Overview
合飞精准智能设备有限公司是一家国家级高新技术企业，专注于半导体封装领域的超精密材料去除和高可靠性结合工艺设备，专业化、复杂、独特且创新的中小企业。它将研发、制造、销售和服务整合为一体，致力于构建一个独立、可控且技术领先的包装设备平台，推动包装工艺设备的本地化和升级。
Headquartered in Hefei, the company has branch offices in Changsha and Shenzhen, as well as service outlets in Beijing, Shanghai and Xi'an, with its service network covering major semiconductor industry clusters across the country. The core technical team is led by senior industry experts, bringing together R&D talents in precision machinery, optical systems, motion control, image recognition, embedded software, ultrasonic control and other fields, and has comprehensive system design and on-site delivery capabilities.
The company currently has two core product lines: dicing saws and wire bonders, which fully cover the key post-semiconductor-packaging processes of precision dicing + wire bonding. The dicing saw product line includes 6~15-inch semi-automatic and fully automatic models, suitable for IC, optoelectronics, sensors, discrete devices and other fields. It supports efficient processing of hard and brittle materials such as semiconductor materials, ceramics, glass and PCB, and provides integrated solutions ranging from equipment and processes to cutting tools. The wire bonder product line consists of the M6000 multi-functional wire bonder and the T9000 fully automatic heavy aluminum wire bonder. The former supports ball bonding and wedge bonding processes, and is compatible with various types of bonding wire materials including gold wire, aluminum wire, copper wire, silver wire and gold ribbon; the latter focuses on the packaging of power devices such as IGBT and SiC, providing a high-reliability and high-efficiency automated solution.
Adhering to the vision of“Empowering advanced technology with precision intelligent manufacturing”, Accuracy creates sustainable value for customers with intelligent precision equipment, helping packaging manufacturing enterprises achieve high-quality development.