Teltec Semiconductor Pacific Limited

Hong Kong,  China
http://www.teltec.asia

• Booth: 3351

Welcome to TELTEC Pacific's booth - N3.3351

Overview

Teltec Semiconductor Pacific Ltd (www.teltec.asia), celebrating 41 years of excellence, stands as the premier sales and service organization for the semiconductor industry (front-end and back-end) across the Asia-Pacific region.

Key Applications:

1) Substrate Activation/Cleaning: UVO Cleaners, Plasma Cleaning Systems, Plasma Photoresist Removal Systems

2) Failure Analysis: Bond Testers, Decapsulation Systems, Scanning Acoustic Microscopes, IV Curve Tracers, TDR, X-ray Inspection Machines

3) Reliability Testing: Burn-in & Reflow Ovens, Centrifuges, Solderability Testers

4) IC Testing: Automated Wafer Probe Stations, IC Testers & Handlers, Harddockings, Interfaces, Manipulators

5) Photolithography: Mask Aligners, Nanoimprinters, Photoresists, Solar Simulators, Wafer Bonders

6) Metrology: AFM, Optical Profilers, Nanoindentors, Thin Film Thickness and Stress Measurement Systems, Thermal Warpage & Strain Measurement Systems, XRD, XRF

7) Deposition & Etching: ALD/ALE Systems, Plasma Deposition & Etching Systems, Sputtering & Evaporation Systems

8) Production Equipment: AOI Machines, Strip Grinders, Auto Molding Systems, Die Bonders, Flip Chip Bonders, Multi-die Bonders, Ball Mount Systems

Contact Information:
Address: Rm. 2802 Wing On House, 71 Des Voeux Road, Central, Hong Kong
Tel: (852) 2521 4213
Email: [email protected]

  Press Releases

• Kayaku Advanced Materials - Photoresists (For Lift-Off, MEMS, E-beam Lithography, Compound Semiconductor, Wafer Bonding and Wafer Level Packaging) (Dec 12, 2025)

  Kayaku Advanced Materials

  
  Kayaku Advanced Materials - Photoresists (For Lift-Off, MEMS, E-beam Lithography, Compound Semiconductor, Wafer Bonding and Wafer Level Packaging)

  Photoresists (For Lift-Off, MEMS, E-beam Lithography, Compound Semiconductor, Wafer Bonding and Wafer Level Packaging)

  Permanent Photo-Patternable Epoxies

  SU-8 3000 Series - Permanent Epoxy Negative Resists
  • High aspect ratio imaging
  • i-line processing
  • Near vertical sidewalls
  • Wide range of film thicknesses in a single coat:
  ~ 5-50μm with SU-8 3000 series
  • High thermal and chemical stability
  • SU-8 3000: improved adhesion and flexibility
  • Wide application space: MEMS, microfluidics, opto-electronics, displays etc.

  SU-8 TF 6000 Series - High resolution thin resists
  • Photoimageable thin film (0.5 to 10μm) with high resolution patterning capability
  • Low temperature cure (<150°C), photothermal or thermal only cure
  • Improved adhesion, increased flexibility & Excellent coat quality vs. SU-8 3000

  KMPR 1000 Series - Temporary Epoxy Negative Resists
  • High aspect ratio imaging with vertical sidewalls
  • Up to 100μm in a single spin coat
  • Compatible with standard aqueous develops
  • Reduced cracking
  • Excellent metal adhesion
  • Excellent plating bath stability

  PermiNex™
  Permanent Wafer Bonding Adhesives for Non-Hermetic Applications
  PermiNex™ 1000 - Solvent base
  PermiNex™ 2000 - Aqueous base
  • Negative-tone, photo-imageable adhesives
  • Low temperature processing (< 200°C)
  • Good patterning resolution with up to 3:1 achievable aspect ratio
  • High quality, void free bonding at 150°C/0.58MPa-30s
  • Superb adhesion to Silicon and Glass

  Permanent Photo-Patternable Polymers

  KMSF™ 1000 Low Stress Dielectric Photoresist
  Material Attributes:
  • Negative tone, photo-imageable resist
  • Low temperature cure (≤ 175 ˚C)
  • i-Line /broadband sensitivity, 1:1 aspect ratio
  • Low residual stress and ultra-low warpage
  • High elongation to failure and moderate tensile strength
  • Excellent resistance to standard chemicals
  • Low shrinkage on cure and good thermal stability
  • Good adhesion to Si, SiO2, SiN, Cu and PI
  • Applications: Stress buffer, passivation, encapsulation, RDL

  KMSF™ 2000 Low Dk/Df Photo-dielectric
  Material Attributes:
  • Negative-tone, photoimageable dielectric
  • Low temperature cure( ≤ 200°C)
  • i-Line /broadband sensitivity, 1:1 aspect ratio
  • 5-10 μm film thickness after cure
  • Solvent development in PGMEA
  • Good thermal and chemical stability
  • Can replace polymide film
  • Application: Wafer Level Package

  Temporary Lift-Off Resists

  PMGI & LOR Bi-Layer Lift-Off Resists
  Material Attributes:
  • Enables high resolution (<0.25μm) metallization lift-off
  • Enables thick metal deposition (>3μm)
  • Supports high volume, high yield production prcoesses
  • Excellent adhesion to Si, NiFe, GaAs, GaN and other III-V compounds
  • Clean lift-off, even after very high temperature processing

  LOR C
  Advanced formulation for topgraphy and concentional ERB systems:
  • Suitable for bi-layer lift-off processes on substrates with topography; improved trench- fill ability, no formation of voids/bubbles in trenches that cause issues  during subsequent metalization step.
  • Elimination of cobweb & whisker formation on wafers and build-up in spin bowl.
  • Compatible with Ethyl Lactate and EBR PG EPRs.
  • Controlled undercut and simple bi-layer process.
  • Similar thermo-mechanical properties to LOR A and LOR B.

  UniLOR™ N - Negative Photoresists for Single Layer Lift-off Processes
  •Negative tone, chemically amplified resists. Resolution down to 2 μm
  •1 to 5 μm film thickness in a single coat
  •I-Line/Broadband sensitivity, 1 : 1 aspect ratio capability
  •Adjustable sidewall profile angle
  •Aqueous alkaline development (standard 0.26N TMAH developers)
  •Suitable for metal evaporation physical vapor deposition
  •Clean removal with standard photoresist removal chemistries
  •Pattern thermal stability up to 200°C
  •Good adhesion to various substrates

  PMMA & Copolymer (MMA (8.5) MAA)
  PMMA (polymethacrylate) is a polymeric material well-suited for many imaging and non-imaging microelectronic applications. PMMA resists are PMMA polymers of specific molecular weights that are dissolved in a solvent, such as anisole (a safer  solvent) and then filtered. Exposure, direct write e-beam or X-ray typically, causes a chain scission of the polymer, resulting in a solubility differential between the  exposed and unexposed regions of the resist film, leading to very high resolution patterning. PMMA is commonly used for direct write e-beam processes such as T-gate fabrication. PMMA is also used for temporary wafer bonding processes such as wafer thinning, where it’s used as a protective layer and the temporary adhesive.
  • Well suited for direct write e-beam & X-ray exposure
  • High resolution: <0.1μm
  • Wide range of molecular weights and viscosities available
  • Developer: MIBK: IPA
  • Solvent systems: (A) anisole & (C) chlorobenzene
  • Applications include e-beam writing, multi-layer T-gate lift-off, wafer thinning, etc.
  
  Copolymer resists are based on a mixture of MMA and 8.5% methacrylic acid. Copolymer (8.5) MAA is commonly used in combination with PMMA in bi-layer lift-off processes where independent CD control of the bi-layer resist stack is required. 

  Temporary Plating Resists

  TempKoat™ N 15 - Thick, Negative-tone Temporary Resist
  • Negative-tone, chemically amplified resist
  • 7 to 20 μm film thickness in a single coat
  • i-Line/broadband sensitivity, 2:1 aspect ratio capability
  • No hydration or latency delay
  • Aqueous alkaline development
  • Compatible with typical microbump and RDL plating chemistries
  • Clean and easy removal with standard photoresist removers

  TempKoat™ P 20 - Thick, Positive-tone Temporary Resist
  • Positive tone, chemically amplified resist
  • 10 to 40 μm film thickness in a single coat
  • i-Line/broadband sensitivity, 3:1 aspect ratio capability
  • No hydration or latency delay
  • Aqueous alkaline development
  • Compatible with typical microbump and RDL plating chemistries
  • Clean and easy removal with standard photoresist removers

• PVA TePla - Microwave Plasma Cleaning Systems (Dec 12, 2025)

  Microwave Plasma Cleaning Systems

  GIGA 690

  The plasma system GIGA 690 is the successor model to the PS400 and PS660 and has become well established on the market since its launch in 2008. As a low-pressure microwave plasma system, it is designed for the cleaning and activation of semiconductor components in chip packaging, including before die-attach, wire bonding, flip-chip underfilling, and encapsulation. To this end, microwaves of 2.45 GHz are introduced through a window into the vacuum chamber, where they generate a chemically reactive plasma. This process allows particularly fast and damage-free plasma treatment.

  Improve yield and reliability for:

  • Die Attach
  • Wire Bonding
  • Encapsulation
  • Flip Chip Underfill
  • Solder Ball Attach

  80 Plus

  The plasma system 80 Plus is easy to operate and features same side loading and unloading, in manual and automatic mode. The System software complies to the
  standards in the semiconductor industry. Due to the very short process time the system can be integrated into fully automated assembly lines.

  In two configurations: Configuration “IoN” or Configuration “GIGA”

  Improve yield and reliability for:

  • Die Attach
  • Wire Bonding
  • Encapsulation
  • Flip Chip Underfill
  • Solder Ball Attach

  Microwave Plasma Systems

  Microwave generated plasma is the superior plasma technology for microchip fabrication.
  Microwave plasma creates an etching process, which is very isotropic and behaves very similar to a wet stripping process. The very high electron density and low kinetic ion energy makes this process ideal for removal of polymers while causing very little surface damage.

  APPLICATIONS

  • Removal of Polymers: standard photo resist, polyimide, SU-8
  • Chip Packaging
  • OLED / PLED
  • Wafer Metrology
  • Solar Cell Etching

  RF Plasma Systems

  RF plasma systems are the most widely used and versatile plasma technology. This plasma technology is applied to a broad spectrum of industrial, semiconductor and medical device applications.

  Material surfaces that require cleaning, coating or chemical modification are immersed into the energetic environment of an RF plasma. Although they are subjected to chemically reactive species that are carried to their surfaces by the directional effects of many RF plasma systems. These directional effects can carry momentum under the right conditions. A plasma system can physically remove more inert surface contaminants and cross-linking polymers to lock the plasma treatment in place.

  The plasma systems can be customized to meet a customers specific application and through-put needs. The chamber, electrodes, power generator and vacuum pumps are scaled based on the the size and shape of the specific substrate to be processed. For example the generator frequency can be in the ranges of 40 kHz, 100 kHz, 150 kHz, 13.56 MHz with wattage’s from 1 to 2000 watts depending on the particular process requirements.

  PVA Tepla America brings significant experience in designing equipment. With Proper engineering a RF plasma system can be designed to fit the precise need of the application without adding unnecessary costs and can usually meet the customers particular budget requirements.

• Camtek - Advanced Optical Inspection (AOI) Systems (Dec 12, 2025)

  自动光学检测系统

  Eagle^T-AP 型号

  整合了2D和3D检测和测量于同一平台内，保证在高性能下实现极高产能水平。

  • 下一代凸块，高度直到2um。
  • 超多数量的凸块检测和测量(5千万)。
  • 凸块直径和表面缺陷的检测。
  • RDL测量和高度的检测。
  • TSV post-via-fill突出物检测(凸起)。
  • 2D检测：粒子，小裂缝，小划痕，PM，墨点，污染，污迹等缺陷。
  • 2D量测：Bump，RDL，Pad，UBM，Via的直径、宽度、长度和位移。
  • 3D量测：Solder, Gold, Lead-free, Pillar, Copper, Micro bumps 和 Nails的高度、共面性、以及PR/PI厚度和Via开口的深度。
  • 可编程彩色滤光片与可独立控制的暗场和亮场的光源系统相结合，加上精细设计的算法能取得最佳缺陷感知灵敏度，并提供最佳的产能。
  • 可选双臂式机械手臂。
  • 优秀的多重倍率组合，实现高TPT与检测平衡。
  • 根据Die内不同区域的检测要求，智能化分区，并采用不同的算法和参数，实现更精准的缺陷检出。
  • 在一个扫描周期内，能连续运用不同的对焦点，不同的倍率，不同的光照选项，设定不同的检测灵敏度和算法引擎，实现高精准缺陷检出。
  • Tool Matching: 允许在不同机台上运行同一个工作 (同版本软件)。
  • 可进行在线和离线的工作设定，交互式自动程序，便于区域的定义。

  Eagle^T-AP Plus 型号

  此机专为先进封装的需求而设计，在提供超强算法的同时，也保持极高的性能与产能。

  • 每片晶圆可超过6千万个Bumps
  • 可进行100% Bumps高度的测量
  • Bump大小：2-250微米
  • 可测任何类型及大小的CD或叠片
  • 可测Die的偏移
  • 可做EBR计算
  • 可进行自动设置与校准
  • 可做超高产能配置
  • 可生成高深形貌
  • 可做层厚测量

  性能：

  • 可测Bump的高度、共面性、PR/PI的厚度（需开槽采用面到面的算法）
  • 专用三解测量仪 (Camtek Triangulation Sensor (CTS) ) ：高速三维扫描
  • 专用共聚焦传感器 (Camtek Confocal Sensor (CCS) )：三维高精度形貎测量
  • 专用光干涉轮廓仪 (Camtek Light Interferometer Profiles (CLIP) )

  Eagle-i / Eagle-i Plus 型号

  为半导体工业从研发到高产量的环境需求而设计。

  • 2D检测：粒子，小裂缝，小划痕，PM，墨点，污染，污迹等缺陷。
  • 2D量测：Bump，RDL，Pad，UBM，Via的直径、宽度、长度和位移。
  • 可编程彩色滤光片与可独立控制的暗场和亮场的光源系统相结合，加上精细设计的算法能取得最佳缺陷感知灵敏度，并提供最佳的产能。
  • 双臂式机械手臂。
  • 优秀的多重倍率组合，实现高TPT与检测平衡。
  • 根据Die内不同区域的检测要求，智能化分区，并采用不同的算法和参数，实现更精准的缺陷检出。
  • 在一个扫描周期内，能连续运用不同的对焦点，不同的倍率，不同的光照选项，设定不同的检测灵敏度和算法引擎，实现高精准缺陷检出。
  • Tool Matching: 允许在不同的机台上运行同一个工作 (同版本软件)。
  • 可进行在线和离线的Job设定，交互式自动程序，便于区域的定义。

• Bruker - AFM, Optical Profilers, Stylus Profilers, Nanoindentors, XRD (Dec 12, 2025)

  Bruker

  AFM, Optical Profilers, Stylus Profilers, Nanoindentors, XRD

  Dimension FastScan Pro

  The Dimension FastScan Pro delivers the highest metrology-level speed and performance of any industrial AFM available today. The system enables automated or semi-automated measurements while ensuring the utmost ease of use and the lowest cost per measurement for quality control, quality assurance, and failure analysis.

  Features:
  FastScan Pro utilizes an open-access platform, large- or multiple-sample holders, and numerous ease-of-use features to provide flexible high-performance nanoscale metrology for industrial QA, QC, and FA applications. The system delivers automated 2-inch to 12-inch wafer measurements for semi, data storage and HB-LED. It features increased XY sample travel for full access to 200mm wafers or multiple samples in 200-mm diameter area, with optional chucks for 300-mm wafers. The system also provides the choice between a high-throughput 5-10x FastScan scanner for topography, roughness and other metrology analyses, or an Icon scanner with 90µm scan range for larger scans and high-accuracy topography performance.

  ContourX 3D Optical Microscopes

  The ContourX family of profilometers utilizes numerous Bruker-exclusive WLI technology advances to deliver the industry's most capable benchtop metrology and easiest to use surface measurement software. Available in three benchtop models, the ContourX profilers feature new, robust design and provide a range of capabilities and price points optimized to match individual metrology and budget requirements. New hardware features include an innovative stage design for larger stitching capabilities and a 5MP camera with a 1200x1000 measurement array for lower noise, larger field-of-view, and higher lateral resolution. In addition to the new USI and Advanced PSI modes, software enhancements include Bruker's new VisionXpress interface, which provides simple and intuitive access to the full power of the award-winning Vision64® analytical software suite and makes these profilers ideal for multi-user environments.

  Fast and repeatable 3D Metrology

  • Industry-best Z resolution, independent of magnification
  • Largest standard field of view
  • Compact, vibration-tolerant design for highest stability and repeatability
  • Surface-Independent Metrology with Application-Specific Solutions
  • Precision Engineering - Measure gage-capable surface roughness and flatness
  • Orthopedics/Ophthalmics - Quantify radius of lens curvature and shape deviation for aspheres
  • Tribology - Analyze impact of friction and corrosion
  • Advance Research - Monitor topography changes in micro-bacterial colonies

  Applications:

  • Roughness (Polished Glass, Oily Material, Photoresist, Silicon etc)
  • Warpage
  • Curvature
  • Topography

  Hysitron TI 990 TriboIndenter

  Hysitron TI 990 TriboIndenter® operates at the intersection of maximum performance, flexibility, reliability, usability, and speed. It builds upon decades of Hysitron® technological innovation to deliver new levels of extraordinary performance, enhanced capabilities, and ultimate versatility in nanomechanical characterization. The Hysitron TI 980 is everything a superior nanomechanical test instrument needs to be, achieving remarkable advances in control and throughput  capabilities, testing flexibility, applicability, measurement reliability, and system modularity.

  • Maximized Characterization Potential
  • Performech ® II Advanced Control Module
  • Multiple Head Measurement Synchronicity
  • nanoDMA III：Dynamic Nanoindentation
  • XPM：Accelerated Property Mapping
  • SPM + Imaging for Superior Nanomechanical Testing Results
  • Powerful System Control and Analysis

  Stylus Profilometer Dektak XT

  The DektakXT® stylus profilometer features a revolutionary benchtop design that enables an unmatched repeatability of 4Å and up to 40% improvement in scanning speeds. This major milestone in stylus profiler performance is the culmination of over fifty years of Dektak® innovation and industry leadership. Through its combination of industry firsts, DektakXT delivers the ultimate in performance, ease of use, and value to enable better process monitoring from R&D to QC. The technological breakthroughs incorporated in DektakXT enable critical nanometer-level surface measurements for the microelectronics, semiconductor, solar, high-brightness LED, medical, and materials science industries.

  Principal：

  A stylus profiler is a contact measurement system; a stylus scans a small tip over the surface to examine the stylus vertical displacement as the tip traces the surface topography.

  • N-Lite+ Low Force with 0.03 to 15 mg (optional)
  • The probe is attached to the sensor via a magnet for easy and risk-free operation.
  • IS3 low inertia LVDT Sensor，Stable and calibration-free under normal operation
  • 3.1M Pixel color camera
  • Arch-arm design makes the system more stable and reliable
  • Can achieve the industry's best repeatability of 5 angstroms, 1σ on 1um steps
  • Vision 64 System significantly speeds up and simplifies data analysis process

  Stylus Profilometer Dektak XTL

  The Dektak XTL builds upon over 50 years of stylus expertise and application customization for production facilities to meet the stringent industry roadmaps of both today and tomorrow. The 300-millimeter, high-accuracy encoded XY staging gives manufacturers a reliable tool to meet stringent gage R&R requirements. Dektak’s Dual Camera Control with high-magnification dual view cameras offers enhanced spatial awareness. Point-and-click positioning in the live video allows operators to quickly place samples at the right location for quick and easy measurement setup and automation programming. The system's large interlocked door provides safe and easy access for sample loading/unloading.

• Heller Industries - Reflow Ovens (Dec 12, 2025)

  Heller

  
  Heller Industries - Reflow Ovens

  Mark 7 系列 - 回流焊炉

  最新低顶盖设计
  MK7采用最新低顶盖设计，方便客户的操作和保养，机械的表面湿度更低，环保节能

  革新的助焊剂回收系统
  最少维护时间，最多生产时间，最高产量
  革新的助焊剂回收系统，用收集瓶回收助焊剂，易更换清理可实现在线保养维修，延长保养周期，缩短保养所需时间，特殊冷却区设计，冷却区层板无助焊剂残留

  极富灵活性的下降斜率
  最新平板式冷却模组，能满足最严苛的温度曲线要求可达到3度/秒以上的下降斜率，亦可轻松应对缓慢下降要求独特的10英寸加热模组，拥有业内相同加热长度下最多温区，最多温控点

  回流炉ＣＰＫ－实时监控工艺参数，有效提升产能和品质
  三阶数据管理
  第一阶：回流炉CPK
  第二阶：工艺CPK
  第三阶：产品追溯性管理

  能源管理软件
  HELLER专有能源软件，智能化管理能源消耗依据生产状态(满载，少量或閒置)，自动调整设备抽排风

  Mark 5 系列 - 回流焊炉

  Mark 5 系列回流焊炉系统

  在尽量减少预防性维护和占地面积的同时，提供一致的性能，以满足高容量要求。

  Mark 5 系列回流焊炉的出现，带来更低的使用成本。Heller回流焊炉在加热和冷却方面的发展，可以为您节省高达40% 的耗氮量和耗电量。MK5 系列不仅是最佳的回流焊系统，更具有业内最好的综合价值！

  • 新冷却管式免维护助焊剂收集系统
  • 无铅应用
  • 简易维护保养
  • 节能省氮
  • 标配Cpk软件
  • 加强型加热模组
  • 最快的冷却速率
  • Profile一步到位

  Mark 5 - 回流焊炉

  高产能生产解决方案(链速高达1.4米/分)可配合最快的贴片机产线。

  MK5系统可通过最低的delta Ts，实现最高的再现性。Mark 5 回流焊炉系统的最新突破使客户的购置成本进一步降低。Heller新型加热和冷却的改进将减少40%氮气消耗和电力消耗。MK5 系列不仅是最佳的回流焊系统，更具有业内最好的综合价值！

  
  Pressure Reflow Oven (PRO)

  • 提供各种类型的 PRO
  • 最大工作压力：8 bar（标准）至 20 bar（可选）
  • 最高工作温度：300oC
  • 氮气启用（选项）
  • 洁净室等级高达100级（可选）
  • 提供全自动化

  压力固化炉 (PCO)

  在晶圆黏结工艺，特别是芯片黏着和底部填胶应用中，压力固化炉(PCO)，或压热器，可以减少微小气泡和增加黏附强度。

  压力固化炉是通过向一个钢化容器里注入高压气体，并且使用强制对流气体进行加热和冷却来工作的。加热器、热交换器和吹风马达均位于压力容器的内部。当固化工艺完成时，压力容器将自动释放压力至1atm并冷却。

  工艺规格：

  • 工艺时间 ：一般120分钟或用户特制
  • 工作温度 ：60°C ~ 200°C
  • 最高温度 ： 220°C
  • 工作压力 ：1 bar - 10 bar
  • 容量 ： 24组框架 (通常)
  • 冷却方式 ：PCW (17°C – 23°C)
  • 冷却水压力：2 kg f/cm² ~ 4 kg f/cm²

  压力固化的应用：

  • 印刷行业的复合成型
  • 芯片黏着固化
  • 晶圆层压
  • 热压晶圆黏结
  • 芯片底部填胶固化
  • 孔矽填充
  • 胶片和带条黏结

  在线式 (固化) 垂直型炉
  拥有全对流和超省氮等先进技术，可满足客户各种固化需求。

  在线式垂直炉实现环氧胶固化工艺在3个极大优势：

  • 在线式自动进出产品提高了产量，减少了离线式固化炉所需的反复进出板的人工
  • 在线式由于无需频繁开启和关闭炉门而节省了时间和热量损失，所以工艺一致性好而保证了产品质量。
  • 而垂直炉只需要6英尺大的占地面积即可实现4小时的固化工艺，从而节约了工厂车间装修成本。

  使用Heller公司的垂直(固化)炉使您的工艺产能提高到一个新高度。

  Heller在线式固化垂直炉将产品从上道装配线上送入垂直炉内，最后被送入后道流水线，整个过程的最短循环时间为25秒。
  
  独立时间控制和温度时间控制的4个内部加热区可以完成任何固化或密封用曲线，包括两段式固化曲线。固化时间可设定为几分钟到几个小时不等。

  Heller垂直炉具有输送装置的宽度可调节性、载具多样性、业内唯一的储存室接口、往复传输机制等特点

  真空辅助回流炉

  Heller在线式真空辅助回流焊系统将真空模组安装在热风回流炉内，可实现在线式自动化量产，并有效消除空洞。

  • 有效减少 99% 焊接时空洞的产生
  •  实现在线式真空辅助回流
  • 温度曲线可灵活调整
  • 高效真空泵机组实现最短降压时间
  • 配备助焊剂回收系统，防止助焊剂残留

  水平对流无助焊剂回流焊 (Horizontal Convection Fluxless Reflow Oven)
  Heller已经设计并建造出适用于正式生产的蚁酸氛(Formic Acid Vapor)回流焊接的回流焊炉。该新型回流焊炉完全符合SEMI S2/S8的安全标准(包括毒气)。

  
  蚁酸回流焊炉 (Flux-Free Formic Reflow Oven)

  • 在晶圆凸点回流焊接应用领域，该应用已经取得了极佳的效果
  • 无助焊剂回流焊接应用气态蚁酸(HCOOH)来替代了标准助焊剂成分
  • 消除了回流焊接前添加助焊剂以及回流焊接后清洁助焊剂的工序
  • 无焊后助焊剂清洁促使了线内环氧树脂涂布和线内环氧树脂固化的发展
  • 蚁酸(Formic Acid)可以应用于任何回流焊接温度曲线(比如帐篷型或浸泡型)，能够同时调节炉子的蚁酸曲线和回流焊接温度曲线

  Heller蚁酸回流焊炉的特点

  • 可以应用任何回流焊接温度曲线(比如帐篷型或浸泡型)
  • 能够同时调节炉子的蚁酸浓度曲线和回流焊接温度曲线
  • 严苛的蚁酸安全防范系统(感应器／侦测器)，符合工业生产规范要求

  基板真空吸附回流焊 (Heller Vacuum Clamping Reflow Oven)

  Heller开发的真空夹具系统，是和配置真空轨道的回流焊一体化的整套系统。真空夹具从炉膛入口处到出口处循环运转，自动回收，实现在线式生产。无论是晶圆回流还是基板回流，这套真空夹具都可有效解决产品的板弯板翘问题。

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