Beijing CGB Technology Co., Ltd

Removing Impurities: Utilizes solutions such as ACE,EKC,IPA,etc. to dissolve impurities on the surface of wafers,like photoresist and particulates,ensuring a high level of cleanliness on the wafer surface to meet the requirements of semiconductor manufactur-ing processes. 

Enhancing Subsequent Process Effects:Provides a clean surface for subsequent processes such as photolithography,etching,and coating, reducing the impact of impurities on these processes and improving the performance,yield,and reliability of chips.

✨ High Efficiency and Accuracy: Quickly removes impurities from the wafer surface,precisely controlling para-meters such as temperature, time, and chemical solution concentration to ensure the stability and consistency of cleaning, achieving uniform cleaning of the wafer surface and guaranteeing high-quality cleaning results.

✨ High Degree of Automation: The automated operation reduces manual intervention,improves production ef-ficiency, and also lowers the risk of misoperation. Simply select the appropriate cleaning mode according to differ-ent cleaning needs, place the wafers in the cleaning machine, and start the cleaning program. The machine also features a drying function for convenient subsequent processing.

✨ Cost Reduction: The filtration system helps extend the service life of chemical solutions, reducing operating costs.

✨ High Work Efficiency: Equipped with multiple robotic arms operating simultaneously,it offers high efficiency and stability.

✨ High Safety: Equipped with leakage protection, liquid leakage protection,temperature protection, electrosta-tic discharge devices, and a fully automatic fire suppression system to ensure the safety of the equipment during operation.

Marangoni Dryer is suitable for drying silicon carbide, polysili-con,and silicon-based wafers,supporting 4/6/8/12-inch wafers with optional thicknesses (350μm-1400μm), adapting to diverse application scenarios. Based on the Marangoni effect,it uses nitrogen to carry IPA to create a surface tension gradient for e-fficient drying, supporting three drying methods: wafer lifting, slow drainage, and swing. Equipped with an up/down convey-ing mechanism, it enables a cassetteless process,preventing poor drying at the contact points between the cassette and wafer, improving drying uniformity.

Automatic wafer Brushing Machine can effectively remove the remaining physical particles on the wafer through the rotating brush head and two fluids, combined with DIW.It is mainly used for post-CMP cleaning and process cleaning of wafers.

✨ Compatible with a wide range of wafer specs

✨ Self-cleaning brush head

✨ Optional configure(wet in and dry out or dry in and out)

✨ Independent flipping module, automatic flipping and cleaning of both sides of the wafer

✨ Flexible chambers( 2/4/6/8 )configuring

✨ Excellent cleaning results

✨ A variety of safety tests(avoiding Debris producing)