Dongfang Jingyuan Electron Co., Ltd.

Beijing,  China
http://www.dfjy-jx.com
  • Booth: 6263

Overview

Dongfang Jingyuan Electron Co., Ltd. was established in 2014 and is headquartered in Beijing Yizhuang Economic and Technological Development Zone. The company focuses on integrated circuit production management solutions.
Since its establishment, the company has been committed to innovative R&D, having secured 150 invention patents, 25 registered software copyrights, and 100 registered trademarks.
Talent is the foundation of a high-tech enterprise. R&D personnel account for 60% of the total workforce, among whom 50% hold master’s degrees. Core team members possess product development and management experience at world-leading semiconductor technology companies in Silicon Valley, Japan, and Europe.

  Products

  • EBI
    It uses an electron beam to scan wafer surfaces and generate high-resolution images. With intelligent algorithms, it accurately detects both electrical and physical defects, making it a vital tool for yield enhancement....

    • It uses an electron beam to scan wafer surfaces and generate high-resolution images. With intelligent algorithms, it accurately detects both electrical and physical defects, making it a vital tool for yield enhancement.
  • CD-SEM
    A metrology tool that measures the critical dimensions of patterns using electron beam imaging and monitors key process parameters. It is an essential tool for yield management in semiconductor manufacturing....

    • A metrology tool that measures the critical dimensions of patterns using electron beam imaging and monitors key process parameters. It is an essential tool for yield management in semiconductor manufacturing.
  • DR-SEM
    Uses ultra-high-resolution electron beam imaging technology to thoroughly re-examine and analyze defects. It captures high-resolution images for morphology analysis and acquires energy spectrum data for compositional analysis....

    • Uses ultra-high-resolution electron beam imaging technology to thoroughly re-examine and analyze defects. It captures high-resolution images for morphology analysis and acquires energy spectrum data for compositional analysis.
  • HV-SEM
    Utilizes high-voltage electron beam penetration to measure the 3D structures of semiconductor devices, such as bottom layer patterns in deep trench features....

    • Utilizes high-voltage electron beam penetration to measure the 3D structures of semiconductor devices, such as bottom layer patterns in deep trench features. It enables precise measurement of dimensions, overlay (OVL), critical dimension uniformity (CDU), and nesting accuracy, while also supporting deep defect detection.
  • Computational Lithography Product – PanGen
    This product uses lithography mask optimization to correct image distortions and enhance yield. It is an indispensable technology in advanced chip manufacturing....

    • This product uses lithography mask optimization to correct image distortions and enhance yield. It is an indispensable technology in advanced chip manufacturing.

Categories

203 Equipment, Inspection & Measurement
  • Defect; Particle; Bump; Contamination Detection, Review or Inspection
  • Line Width; Critical Dimension (CD) Measurement
    • 602 Manufacturing Software
  • Yield Mgmt; Process Control Software
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