SPTS Technologies (An Orbotech Company)

Ringland Way
Newport, Gwent,  NP18 2TA

United Kingdom
http://www.spts.com
  • Booth: A4441


SPTS invites you to visit our booth A4/441 at SEMICON Europa

SPTS Technologies, an Orbotech company, designs, manufactures, sells, and supports advanced MVD, etch, PVD, and CVD wafer processing equipment and solutions for the global semiconductor and micro-device industries, with focus on the Advanced Packaging, MEMS, high speed RF device, power management and LED markets.

With the acquisition of SPTS, Orbotech is able to offer a broader range of process solutions for Advanced Packaging, which includes Orbotech’s Inkjet solutions for die level printing and UV Laser Drilling for through mold vias.

SPTS has manufacturing facilities in Newport, Wales and Allentown, Pennsylvania, and operates across 19 countries in Europe, North America and Asia-Pacific.

For more information please visit www.orbotech.com/spts.


 Press Releases

  • SPTS Presented with Prestigious Award for Excellent Support of Infineon’s Business in the Power and MEMS Sectors

    YAVNE, ISRAEL, April 12, 2018 | ORBOTECH LTD. (NASDAQ: ORBK) today announced that SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, has been awarded ‘Supplier of the Year – Customized Frontend Equipment’ at the  Infineon Supplier Day held in Singapore. The prestigious award was given to SPTS for its outstanding support and the performance of its plasma etch and physical vapor deposition (PVD) equipment.

    Infineon’s global operational and management teams rated and ranked suppliers against stringent criteria, and SPTS was selected for excellent support of Infineon’s Power and MEMS business with its etch and deposition solutions. The award was presented to Kevin Crofton, Corporate Executive Vice President at Orbotech and President of SPTS Technologies, by Pantelis Haidas, Senior Vice President Operations, and Achim Janker, Senior Director - Head of Purchasing Frontend. SPTS was specifically recognized for being an excellent long term and reliable partner to Infineon, highlighting the important collaborative development of special process and hardware solutions to meet Infineon’s current and future needs.

    Kevin Crofton commented, "We are very proud to be a valued partner to Infineon and extremely honored to have earned this prestigious award. We continually strive to achieve a high level of customer satisfaction, and receiving this third Supplier Excellence Award is a real testament of the quality and performance of our engineering, operations and support teams across the company. As a long time trusted partner of Infineon’s Power and MEMS businesses, we look forward to many more years of innovating together and helping to drive mutual success.”

    Infineon Technologies is the global market leader in power semiconductors, retaining the top spot for both discrete power semiconductors and power modules, according to a study[1] carried out by IHS Inc, a business information provider. SPTS Technologies is a preferred supplier and partner to Infineon, and provides etch, deposition and thermal wafer processing equipment to Infineon’s Villach, Dresden, Regensburg and Kulim fabs.

    About Orbotech Ltd.

    Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech's core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality ('reading'); pattern the desired electronic circuitry on the relevant substrate and perform three-dimensional shaping of metalized circuits on multiple surfaces ('writing'); and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing ('connecting'). Orbotech refers to this 'reading', 'writing' and 'connecting' as enabling the 'Language of Electronics'. For more information, visit www.orbotech.com and www.spts.com.

    Cautionary Statement Regarding Forward-Looking Statements 

    Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words “anticipate,” “believe,” “could,” “will,” “plan,” “expect” and “would” and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, the previously announced acquisition of Orbotech by KLA, the manner in which the parties plan to effect the transaction, including the share repurchase program, the ability to raise additional capital necessary to complete the repurchase program within the time frame expected, the expected benefits, synergies and costs of the transaction, management plans relating to the transaction, the expected timing of the completion of the transaction, the parties’ ability to complete the transaction considering the various closing conditions, including conditions related to regulatory and Orbotech shareholder approvals, the plans, strategies and objectives of management for future operations, product development, product extensions, product integration, complementary product offerings and growth opportunities in certain business areas, the potential future financial impact of the transaction, and any assumptions underlying any of the foregoing. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to the foregoing matters and the possibility that expected benefits of the transaction may not materialize as expected, that the transaction may not be timely completed, if at all, that KLA-Tencor may not be able to successfully integrate the solutions and employees of the two companies or ensure the continued performance or growth of Orbotech’s products or solutions, the risk that the Company may not achieve its revenue and margin expectations within and for 2018 (including, without limitation, due to shifting move-in dates); cyclicality in the industries in which the Company operates, the Company’s supply chain management and production capacity, order cancelation (often without penalty), timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the United Kingdom’s prospective withdrawal from the European Union (known as “Brexit”) and political uncertainty in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smart mobile devices, automotive electronics, flexible applications and devices, augmented reality/virtual reality and wearable devices, high-performance computing, liquid crystal display and organic light emitting diode screens and other sophisticated devices, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the best judgment tax assessment issued by the Israel Tax Authority with respect to the audit of tax years 2012-2014 in Israel and the related criminal investigation, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the timing, final outcome and impact of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, and ongoing or increased hostilities in Israel and the surrounding areas.

    The foregoing information should be read in connection with the Company’s Annual Report on Form 20-F for the year ended December 31, 2017, and subsequent SEC filings. The Company is subject to the foregoing and other risks detailed in those reports. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law.

    ORBOTECH COMPANY CONTACTS:

    Rami Rozen

    Tally Kaplan Porat

    VP of Investor Relations

    Director of Corporate Marketing

    Tel: +972-8-942-3582

    Investor.relations@orbotech.com    

    Tel: +972-8-942-3603

    Tally-Ka@orbotech.com

     

    [1] Annual Power Semiconductor Market Share Report 2017, IHS (August 2017)

  • Prestigious Award Recognizes SPTS’s Innovation in Advanced Packaging Technologies for the Global Semiconductor Industry

    NEWPORT,UNITED KINGDOM, 24 April, 2018 | SPTS Technologies, an Orbotech company and a supplier of advanced wafer processing solutions for the global semiconductor and related industries, proudly announced today that it has been awarded the coveted Queen’s Award for Enterprise in Innovation 2018. The award recognizes SPTS’s development of novel physical vapor deposition (PVD) process solutions for Fan-Out Wafer Level Packaging (FOWLP) of semiconductor devices. Some of the advanced features and functionality developed for SPTS’s 300mm Sigma® fxP PVD system was made possible with funding assistance from a Welsh Government R&D grant. In addition to assessing the degree of innovation, the judging panel also evaluated SPTS on its corporate responsibility, which included employee affairs, customer and supplier relationships, and its impact on the environment and contribution to society.

    "We are extremely proud to be recognized with the Queen’s Award for Enterprise in Innovation," stated Kevin Crofton, Corporate Executive Vice President at Orbotech and President of SPTS Technologies. "We provide advanced wafer processing equipment to the world's leading semiconductor and microelectronics manufacturers, and an ongoing program of research and development coupled with our ability to commercialize our innovation has been key to building and sustaining a profitable business. This award belongs to our entire global organization – from those directly involved in the development of our advanced PVD solutions for the fast growing FOWLP application sector, to those who sold, manufactured, installed and supported the many 300mm Sigma systems that we’ve shipped into our customer base."

    Mr Crofton added, "The success of our wafer processing solutions for advanced packaging is a testament to the quality and competitiveness of UK developed technologies and products in the global markets. We are also very pleased to share credit for this award with the Welsh Government who demonstrated their commitment with the R&D grant that helped fund this and other advanced packaging development programs here at SPTS."

    Economy Secretary, Ken Skates said: "Huge congratulations to SPTS on winning another Queens Award for Enterprise and Innovation. SPTS is a prominent global business in South East Wales and an increasingly successful exporter, and this prestigious award is a well-deserved recognition of the company’s hard work and innovation."

    "The Welsh Government is proud to work with dynamic and forward thinking companies such as SPTS and we are pleased to have supported the company’s project to design and develop advanced packaging processes for semiconductors. There is no doubt that companies like SPTS are increasingly vital to our economy which is why my Economic Action Plan, which was published in December, seeks to support businesses to innovate, introduce new products and services and rise to the challenges of the future."

    The Queen’s Awards for Enterprise are the UK’s most prestigious business awards, given only to companies

    or individuals who are outstanding in their field. Previously known as the Queen’s Awards to Industry, the Queen’s Awards for Enterprise were introduced in 1966 to acknowledge businesses with outstanding performance in three categories – International Trade, Innovation and Sustainable Development. The awards are open to any company operating in the UK and are announced annually on 21 April, The Queen’s birthday. 

    About Orbotech Ltd.

    Orbotech Ltd. is a leading global supplier of yield-enhancing and process-enabling solutions for the manufacture of electronics products. Orbotech provides cutting-edge solutions for use in the manufacture of printed circuit boards (PCBs), flat panel displays (FPDs), and semiconductor devices (SDs), designed to enable the production of innovative, next-generation electronic products and improve the cost effectiveness of existing and future electronics production processes. Orbotech's core business lies in enabling electronic device manufacturers to inspect and understand PCBs and FPDs and to verify their quality ('reading'); pattern the desired electronic circuitry on the relevant substrate and perform three-dimensional shaping of metalized circuits on multiple surfaces ('writing'); and utilize advanced vacuum deposition and etching processes in SD and semiconductor manufacturing ('connecting'). Orbotech refers to this 'reading', 'writing' and 'connecting' as enabling the 'Language of Electronics'. For more information, visit www.orbotech.com and www.spts.com.

    Cautionary Statement Regarding Forward-Looking Statements

    Except for historical information, the matters discussed in this press release are forward-looking statements within the meaning of the U.S. Private Securities Litigation Reform Act of 1995. These statements relate to, among other things, future prospects, developments and business strategies and involve certain risks and uncertainties. The words "anticipate," "believe," "could," "will," "plan," "expect" and "would" and similar terms and phrases, including references to assumptions, have been used in this press release to identify forward-looking statements. These forward-looking statements are made based on management’s expectations and beliefs concerning future events and are subject to uncertainties and factors relating to Orbotech’s operations and business environment, the previously announced acquisition of Orbotech by KLA, the manner in which the parties plan to effect the transaction, including the share repurchase program, the ability to raise additional capital necessary to complete the repurchase program within the time frame expected, the expected benefits, synergies and costs of the transaction, management plans relating to the transaction, the expected timing of the completion of the transaction, the parties’ ability to complete the transaction considering the various closing conditions, including conditions related to regulatory and Orbotech shareholder approvals, the plans, strategies and objectives of management for future operations, product development, product extensions, product integration, complementary product offerings and growth opportunities in certain business areas, the potential

    future financial impact of the transaction, and any assumptions underlying any of the foregoing. Actual results may differ materially from those referred to in the forward-looking statements due to a number of important factors, including but not limited to the foregoing matters and the possibility that expected benefits of the transaction may not materialize as expected, that the transaction may not be timely completed, if at all, that KLA-Tencor may not be able to successfully integrate the solutions and employees of the two companies or ensure the continued performance or growth of Orbotech’s products or solutions, the risk that the Company may not achieve its revenue and margin expectations within and for 2018 (including, without limitation, due to shifting move-in dates); cyclicality in the industries in which the Company operates, the Company’s supply chain management and production capacity, order cancelation (often without penalty), timing and occurrence of product acceptance (the Company defines ‘bookings’ and ‘backlog’ as purchase arrangements with customers that are based on mutually agreed terms, which, in some cases for bookings and backlog, may still be subject to completion of written documentation and may be changed or cancelled by the customer, often without penalty), fluctuations in product mix within and among divisions, worldwide economic conditions generally, especially in the industries in which the Company operates, the timing and strength of product and service offerings by the Company and its competitors, changes in business or pricing strategies, changes in the prevailing political and regulatory framework in which the relevant parties operate, including as a result of the United Kingdom’s prospective withdrawal from the European Union (known as "Brexit") and political uncertainty in the United States, or in economic or technological trends or conditions, including currency fluctuations, inflation and consumer confidence, on a global, regional or national basis, the level of consumer demand for sophisticated devices such as smart mobile devices, automotive electronics, flexible applications and devices, augmented reality/virtual reality and wearable devices, high-performance computing, liquid crystal display and organic light emitting diode screens and other sophisticated devices, the Company’s global operations and its ability to comply with varying legal, regulatory, exchange, tax and customs regimes, the timing and outcome of tax audits, including the best judgment tax assessment issued by the Israel Tax Authority with respect to the audit of tax years 2012-2014 in Israel and the related criminal investigation, the Company’s ability to achieve strategic initiatives, including related to its acquisition strategy, the Company’s debt and corporate financing activities; the timing, final outcome and impact of the criminal matter and ongoing investigation in Korea, including any impact on existing or future business opportunities in Korea and elsewhere, any civil actions related to the Korean matter brought by third parties, including the Company’s customers, which may result in monetary judgments or settlements, expenses associated with the Korean matter, and ongoing or increased hostilities in Israel and the surrounding areas.

    The foregoing information should be read in connection with the Company’s Annual Report on Form 20-F for the year ended December 31, 2017, and subsequent SEC filings. The Company is subject to the foregoing and other risks detailed in those reports. The Company assumes no obligation to update the information in this press release to reflect new information, future events or otherwise, except as required by law. COMPANY CONTACTS:

    Destanie Clarke

    Tally Kaplan Porat

    Senior Director, Marketing Communications

    Director of Corporate Marketing

    SPTS Technologies

    Orbotech Ltd.

    Tel: +44 7951 203278

    Tel: +972 8 942 3603

    Destanie.Clarke@orbotech.com

    Tally.KaplanPorat@orbotech.com


 Products

  • Delta® Deposition Systems
    SPTS's Delta PECVD systems are used for a wide range of applications within MEMS, compound semiconductors, and advanced packaging...

  • PECVD

    • Wafer sizes from 75mm to 300mm
    • Radially symmetrical gas flow for superior wafer-in-wafer (WIW) uniformity
    • Up to 10 gas lines and optional on-board liquid delivery system
    • Mixed frequency plasma capability for stress tuning
    • Active platen cooling for critical, low temperature [<175°C] packaging applications
    • Single and multi-wafer preheat chamber options for de-gassing sensitive substrates

    Markets Served

    MEMS applications demand a wide range of dielectric film types,SPTS’s PECVD module offers SiO, SiN and amorphous silicon films tailored to meet the needs of MEMS manufacturers

    Advanced 3D-IC applications, SPTS offers low temperature [<175°C] processes compatible with 300mm bonded substrates. Applications include via-last TSV liner and via-reveal passivation.

    SPTS is the only PECVD provider who can deposit electrically robust, stable nitride and oxide films at <200°C

    RF-IC semiconductor applications, SPTS develops processes and hardware for today’s production needs and Single wafer processing enables unrivalled repeatability and flexibility in a manufacturing environment

    Our handlers and process chambers are proven in high volume production, and are fully compatible with both transparent and carried wafers

  • Omega® Etch Systems
    SPTS offers advanced etch technologies for a wide range of applications within MEMS, Advanced Packaging, LEDs, high speed RF IC & power semiconductors...

  • Plasma Etch

    ICP Etch
    The Omega® ICP process module uses a patented high density plasma source incorporating a radial coil design. The SPTS ICP process module is highly flexible and etches a wide range of materials including oxides, nitrides, polymers, low aspect ratio Si and metals. The ICP module is the market leader for compound semiconductor applications.

    Dielectric Etch
    SPTS’s Omega® SynapseTM process module is an ICP-based high-density plasma source, designed to etch materials which are difficult to etch using conventional RIE or ICP sources.

    The process chamber is of metallic construction and is heated to reduce the level of deposition on it, thereby increasing process stability and increasing the mean time between cleans by more than a factor of 10.

    Si DRIE
    Install base of over 1000 DRIE process modules, SPTS’s market-leading position is spearheaded by the Rapier module, which etches Si using Bosch switched processing as well as non-switched etching for tapered profiles, wafer thinning and via reveal.

  • Sigma® Deposition Systems
    The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD...

  • Sigma Metal Deposition Technologies

    Standard PVD – conventional sputter modules for low topography features

    Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features

    C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier

    Advantages

    Single wafer processing improves yields and on-wafer performance when compared to batch processing.

    Planar target with full face erosion, avoids re-sputtering, reduces particle contamination and improves target life

    Rapid target change (<5mins), with common magnetron, increases uptime

    Reliable handling of fragile, thinned or bowed wafers

    "Super Uniformity" option available for specialist applications

    Multi-wafer degas to increase throughput for long (low temp) degas applications

    Common software for 200mm and 300mm systems - ease of use

    Markets Served

    MEMS, Advanced Packaging, Power Semiconductors, LED Manufacturing, RF-IC


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