VA Innovation Pte Ltd

Blk 5004
Ang Mo Kio Ave 5 #04-10 TECHplace II
Singapore,  569872

Singapore
http://www.va.com.sg
  • Booth: A4549


 Press Releases

  • (20180906)

    VAI has many years experience in semiconductor test application, at VAI we offer test socket and contactor, a unique solutions for various type of devices. 

    -    Test

    -    Burn In

    -    Test Site: Single to 100 multi test site

    -    Universal test contactor, cater for wide range of package size in one contactor

    -    Contactor cater for High Temp testing - up to 220DegC

    -    High speed contactor - 40GHz@-1dB

    -    Package pitch range from 0.09mm to 1.27mm

    -    Package size range from 0.18x0.2mm to 50x50

    -    Package IO > 3,500

    Device Type: 

    -    BGA, uBGA, VFBGA, FCTEBGA, LFBGA,QFP, QFN, LGA, TQFP,   VQFN,,FPBGA, MLP, CSP, SIP, WLCSP, MEMS

    -    SOT package, TO Package, (TO package with Kelvin contact)  SOIC package         (SOIC with Kelvin contact)  TSOP package, SOP, MSOP

    -    Edge card, Strip test socket

    -    WLCSP

    -    Kelvin, non Kelvin

    -    Non Magnetic socket for MEMS Gyroscope

    Test Contactor for Handler:-

    -    Pick and Place          

     -   Gravity Feed     

    -    Turret

        


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