SUPERIOR TECHNOLOGY FOR SINTERING,SOLDERING,DIFFUSION &CVD
SRO-700/-714/-716 VACUUM REFLOW: Soldering/Brazing OVENS/RTAs, semi automatic
SRO i-Line: Vacuum Reflow Soldering, fully automatic, high volume, void free-IGBT-CSP-DBC,Flip Chip
SRO-706-GETTER MEMS/PACKAGE SEALING WITH GETTER ACTIVATION
SRO-71x-TCB THERMO COMPRESSION BONDER: 300°C, Transient Liquid Phase Soldering/Bonding, warped/thinned chip Ag sintering, Cu pillar/micro bump flip chip soldering
PEO-601/-604 QUARTZ TUBE FURNACE: Fast ramping, multipurpose, ultra-uniform, LPCVD, CNT/graphene, VCSEL/ AlGaAs/ Si oxidation, diffusion, high vacuum, H2, annealing, alloying, LTCC sintering, thick film paste firing, Polyimide backing, Poly Si, Epitaxy, Si3N4, LTO, P & N solid source diffusion
PHP-630 LTCC SINTERING PRESS: 1100°C, Constrained LTCC sintering, hot LTCC/ glass embossing
RV-126/-129 DIAMOND SCRIBERS: to 200 mm Si Wafers, Al2O3, glass, InPh, GaAs
IR CVD/ALD SYSTEM:1050°C, single wafer, fast temperature & pressure
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