ALK Bldg, 2 Partizansky Avenue
Minsk,  220033

  • Booth: A4265

Building Traditions Into the Future

KBTEM-OMO (Belarus) is:

  • Over 50 years in microelectronics engineering
  • High level vertical integration in design and manufacturing
  • Field proven tools for 1 µm, 0.6 µm, 0.35 µm, 0.13 µm and 90 nm technology node
  • Total solution provider for defect free mask manufacturing
  • Maskless lithography solution
  • Variety of wafer inspection systems
  • Unique solution for double-side lithography
  • Brand new tools only, no secondhand or refurbished tools

KBTEM-OMO performs scientific and technical development and production of special opto-mechanical process equipment as well as inspection and measurement equipment used in microelectronics products manufacture:

  • laser pattern generators for mask and wafer patterning;
  • wafer steppers;
  • large-field steppers;
  • mask aligners;
  • laser-based mask repair systems;
  • automatic mask inspection systems with high detection threshold,
  • wafer inspection tools for macro and micro defect inspection

KBTEM-OMO's unique in-house manufacturing facilities for precision mechanical and optical parts and components, linear step motor fabrication, certified quality and inspection lab provides for high vertical integration in engineering of opto-mechanical special systems and equipment.


  • Wafer Patterning and Inspection Systems
    Product range: Direct writing pattern generator; Mask Aligner Wafer Stepper; Automatic wafer defect inspection Wafer inspection...


    •1.0, 0.6, 0.35 µm single- and multi-beam laser pattern generators

    • Process switch to substrate/mask writing modes

    • Wafer Ø: 300, 200, 150, 100 mm


    • Contact / proximity printing

    • Automated / manual wafer loading

    • Double-side lithography

    • High alignment accuracy 0.4 ~0.7 um resolution

    - wedge compensation and wafer thickness compensation with no contact to mask;
    - 3D (X, Y, Q) high precision wafer manipulator with coarse and fine alignment modes;
    - irregular substrates type and size ( wafer thickness 0.2~0.8 mm, fragile wafer types (GaAs, LiNbO3, etc.) , rectangular;
    - built-in vibration protection unit;
    - energy saving mode.


    • Lamp / solid state laser light source

    • 0.8, 0.35 µm technology node

    • Automatic scaling

    • Double-side alignment

    •Wafer Ø: 200, 150, 100 mm


    • Micro / macro defects inspection

    • Imposed defects inspection

    • High resolution

    • Low cost of ownership (COO)


    • CD inspection

    • Wafer flatness inspection

    • Coordinates and overlay inspection

    • Visual inspection

  • Optics Parts
    In-house optical factory allows to manufare variour optical parts and components, as well as optical coatings...

  • The following optical components and optical coatings can be custom ordered made in low/small volume quanitites

        - Opto-mechanical components
        - Deflectors
        - Aspherical parts
        - Prisms
        - Interference beam splitters
        - Raster parts
        - Lens
        - Plane-parallel components
        - Wedges
        - Basic and working test glass
        - Mirrors
        - Antireflection coatings
        - Products made by photolithography, including vacuum stages

  • Mask Manufacturing Systems
    Multibeam laser pattern generators; D2DB automatic mask inspection systems; Laser mask repair systems. All machines have the same coordinate system platform which allows to have ideal compatibility in the production line...

  • KBTEM-OMO offers the range of tools for Mask Manufacturing with unique ideal compatibility of all the systems in the production line, including:

    • compatibility of all tools coordinate systems;
    • stage travel control algorithms being the same for all the tools;
    • unified approach to coordinate systems’ compensation;
    • unified system of design data conversion for pattern generation and mask inspection;
    • unified data format may be created by forming the database based on pattern defects and defects’ classification;
    • unification of control systems, user-friendly interface;
    • small space and low cost of ownership.


    • 130, 90 nm UV, DUV laser tools
    • Multi-beam raster-scan technology
    • Phase shift mask production
    • Direct substrate patterning option
    • 16/32-beam optical architecture


    • 130nm, 90 nm technology node
    • 0.25, 0.15 µm pixel size
    • Die-to-Database inspection to SEMI standards
    • High throughput

    LASER MASK REPAIR: EM-5131, EM-5141

    •  0.2, 0.15 µm min feature size
    •  Process switch to opaque/transparent defects repair
    •  Pattern copy repair
    •  Through pellicle repair

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