Industriestr. 14
Darmstadt,  D-64297

  • Booth: A4735

ISRA VISION has been a leading supplier of high-performance quality inspection systems for more than 30 years. Today, our automated and highly accurate solutions set the standards for the detection of material defects and total process control in numerous markets.

For semiconductor industry, ISRA has combined leading-edge technologies to provide high-speed and high-precision quality control along the production chain – universally applicable and intuitively easy-to-use.

Customers choose ISRA for its ability to develop products consistent to their requirements. Benefits are the identification of high efficiency enhancements and cost saving potentials. To achieve this goal, more than 700 ISRA employees worldwide are working to contribute to your success.

 Press Releases

  • A new inspection system now allows wafer edges to be monitored during the entire manufacturing process – both increasing yield and lowering costs, as the system prevents the processing of defective material. Moreover, because the sensor can be optionally integrated in existing process tools, it can be used in every production step.

    Today, the quality of wafers is often only checked at the start of production. However, the many processing steps put the material under a great deal of stress, particularly at the edge, and often cause quality issues. The high-speed surface inspection of the front, back and wafer edge is an efficient solution to this problem. This is necessary as chips are becoming ever thinner for use in modern IT and consumer electronics products, thus making them more vulnerable. Devices such as smartphones are gaining ever more functions, yet the amount of space for the hardware is limited. To meet the simultaneously increasing quality requirements, continuous inspection is required as early as the wafer manufacturing process.

    Customized deployment for critical process steps

    The EdgeScan from ISRA VISION can be used as an OEM product throughout the entire process and for every type of wafer. It is compatible with all common process tools and is also available as a retrofit solution for existing machines. Moreover, the solution’s connection and results output comply with the SEMI standard. The sensor unit can be deployed in an individual manner depending on where in the process the components are under the most stress. During preadjustment, a line scan camera checks the edge of the wafer simultaneously from three sides. Its multiview technology, in which a prism deflects the image by 45 degrees, creates three views, making it possible to view the component from 360 degrees even at cycle times of just a few seconds.

    This kind of inspection is a result of the new awareness that problems often begin at the edge. Defects here can cause cracks and breaks. EdgeScan now allows the edge to be monitored throughout the entire production process. ISRA’s solution complements conventional AOI systems that use a matrix camera, which have a limited field of vision and only inspect the surface, thereby enabling a complete inspection.

    This high quality can be guaranteed throughout the entire manufacturing process thanks to solutions from ISRA. For instance, CrackScan identifies micro cracks at the earliest possible stage and lays the groundwork for high-quality wafers and later chips. SurfQScan detects even the finest scratches on the polished, reflective surface of the finished wafer. And DicingScan enables inspection immediately following dicing, thereby covering a further process step that was previously not sufficiently monitored. The ISRA portfolio of products for inspecting semiconductors enables the maximum customer satisfaction through the very highest quality.

  • The white light interferometer (WLI) for in-line measurements has been proven in a variety of applications and is now even faster thanks to NetGAGE3D. Together with high measurement speeds and a robust process, the sensor enables users to capture color images or conduct batch-by-batch quality inspections. This solution takes white-light interferometry to the next level when it comes to speed and the very highest precision.

    Whether for inspecting circuit boards and wafers or metal components in a tray, the high precision of the new white light interferometer quickly and easily boosts quality when used in the production line. The 3D sensor is ideally suited to full-surface contactless measurement and guarantees pinpoint accuracy. With just a single scan, the NetGAGE3D white light interferometer dependably delivers highly accurate measurement results in the nm range to ensure a reliable inspection of different surface area properties such as roughness or flatness, but also of dimensional accuracy and completeness. Depending on the application, the new sensor can be equipped with various cameras, for example with a particularly high lateral resolution for detecting roughness or a very large measuring field for inspecting evenness.

    Short scanning times for a variety of applications

    The expanded sensor is equipped with new software and hardware components that enable even faster measurement. The new method enables a significantly higher degree of data efficiency, as fewer interference signals are needed to calculate the surface structure and fewer redundancies occur during the measurement. Thanks to this new scanning method, the 3D sensor will enable even shorter scanning times of less than a second.

    The new NetGAGE3D plus is perfectly tailored to automated series production. With short measurement times and a batch processing function, the systems are able to measure a large number of components in next to no time at all. Furthermore, its brief scan time also means that the NetGAGE3D plus is suitable as a cycle-controlled measurement technology for use in the electronics industry, where the systems are primarily used to check printed circuit boards or soldering paste. Thanks to a special feature for the batch processing of components in a magazine, NetGAGE3D plus can achieve significant time savings in operator self-inspection, as users can directly intervene in the manufacturing process in order to make corrections.

    NetGAGE3D plus for networked manufacturing

    Thanks to high-quality components, the self-preserving enclosure and low maintenance requirements, NetGAGE3D plus is very robust. The operating concept is optimized for both touch screens and conventional input using a keyboard and mouse, while the intuitive menu navigation makes operation easy, even for users without any prior knowledge. Equipped with an embedded PC and Wi-Fi capability, the sensor already meets all technical requirements for networked production as standard and is the ideal solution for a multitude of applications.


  • CrackScan
    Optical inspection system for detecting material defects like micro cracks, crystal dislocation etc....

  • Optical inspection systems with dedicated illuimation for detecting material defects like micro cracks, crystal dislocation etc. that occur during wafering process but also in wafer thinning/grinding/polishing steps as common in MEMS, power devices and wafer level packaging applications.

    Systems are available as stand-alone, manual loading units and can be connected to any standard EFEM, sorter or other wafer handling equipment via standard SEMI bolt interface to create a fully automated inspection unit for various tasks.

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