The Takatori AMR2200G is proven for solvent free metal lift off processing. Gold is the main metal processed. The gold is removed from the wafer surface in the unrequired areas using lift off onto a UV release or heat release tape, wth no solvent use. The gold is easily reclaimed from the tape.
This process is particularly relevant to GaAs fabs who use Gold metal, providing a very economical lift off and reclaim process.