JTA Equipment Technology

34 St Peters Wharf
Newcastle upon Tyne,  NE6 1TW

United Kingdom
  • Booth: A4134

We focus on the Takatori Tape Vacuum lamination systems

Primary products for Semiconductor Manufacturers are Takatori quipment for Semiconductor wafer vacuum taping, tape lamination/delamination, application of Dry Resist Films, wafer temporary bonding, wafer mounting under vacuum and lift off processing.

Products for Wafer manufacturers include wafer sorters, wafer thickness and shape measurement and wafer polishers from Gigamat Technologies, plus wire saws from Takatori for wafer slicing.  We are the main supplier for equipment for slicing of hard materials.

Heavily involved in MEMs device lamination using the Takatori TEAM100/300 vacuum lamination system, and in LED production with our taping/mounting systems.


  • Takatori TEAM100/300 vacuum lamination system
    Allows excellent topography coverage due to use of vacuum lamination, and additionally cuts the tape prior to lamination to a preset diameter, allowing the tape to be cut inside the wager edge to minimise edge bubble problems on grinding thin wafers....

  • The TEAM100/300 allows lamination under vacuum to provide excellent topography coverage
  • Takatori AMR2200G Metal Lift Off equipment
    This tool uses tape to lift off metal layers without use of solvents...

  • The Takatori AMR2200G is proven for solvent free metal lift off processing.  Gold is the main metal processed.  The gold is removed from the wafer surface in the unrequired areas using lift off onto a UV release or heat release tape, wth no solvent use.  The gold is easily reclaimed from the tape.

    This process is particularly relevant to GaAs fabs who use Gold metal, providing a very economical lift off and reclaim process.  

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".