Applied Microengineering Ltd. (AML)

Unit 8, Library Avenue,
Harwell Oxford
Didcot,  Oxfordshire  OX11 OSG

United Kingdom
  • Booth: A4751

Unique in-situ Aligner Wafer Bonders & BONDCENTRE Services

 AML manufactures unique in-situ aligned wafer bonding machines & provides R&D & production services based around wafer bonding in its BONDCENTRE facility situated in Oxfordshire,UK.

AML’s unique Aligned Wafer Bonders are the only tools capable of in-situ alignment, activation & bonding all carried out in one chamber on the market, & are particularly suited to the bonding requirements of MEMS, IC, & III-V industries.

The incredible flexibility of the machines allows processes that cannot be performed on any other wafer bonder! Particular high vacuum encapsulation and getter activation where wafers are kept at temperature differentials of over 300C

The machines have the flexibility for R&D & the throughput & automation for volume production as well as the lowest cost of ownership with first class support.

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".