Mitsui Chemicals Europe produces and supplies specialty chemicals and high performance polymers to European markets.
We offer a broad range of Chemicals & Intermediates, Chemical Solvents, Specialty Polymers and Engineering Plastics,
Functional Materials, Electronic Materials, and Adhesive Resins.
Regarding semiconductor manufacturing, We provide a wide array of product lines featuring high-fuction adhesive tape such as Non-UV and UV surface protective tape used in silicon wafer back-grinding process, named ICROS™ TAPE.
Today, ICROS™ Tape is not only used for BG process but also for many other processes in semiconductor manufacturing flow, such as dicing, packaging process due to high functional technologies like heat resistant, chemical resistant property.
< Technology area >
- Superior Total Thickness variation (TTV)
- Easy peel off and Very low contamination
- High topography absorption (<250mm)
- Chemical resistant for etching process
- Heat resistant for reflow process (>260degC)
- Heat resitant and Expandability
- High transparent for inspection and laser process
- Anti ESD
- Self releasability
For Bumped Wafer Tapes
Gold bump (20-30um bump height)
Pillar Bump (40-100um bump height)
Solder Bump (100-150um bump height)
Solder bump (150um+ bump height)
Thin Grinding Tapes
Chemical Resistant / Heat Resistant Tape
Transparent Dicing tape
Heat Resistant Tape Dicing tape
Self releasable tape