Annealsys

139 rue des Walkyries
Montpellier,  34000

France
http://www.annealsys.com
  • Booth: A4235


Rapid Thermal Processing / Chemical Vapor Deposition systems

Annealsys designs and manufactures Rapid Thermal Processing (RTP and RTCVD) and Direct Liquid Injection deposition (CVD and ALD) systems.
RTP furnaces from R&D to production application for wafers from 2-inch up to 200 mm.
Cold wall chamber technology, high temperature (1450°C) and high vacuum capabilities, fast cooling system and pulse annealing mode for processing thermally sensitive substrates.
Applications: MEMS, sensors, optoelectronics, discrete devices, power devices (GaN, SiC), Leds…
Processes: RTA, RTO, Ohmic contact annealing, RTCVD of graphene and h-BN, selenization
High temperature RTP furnace up to 2000°C for silicon carbide implant annealing.
Direct Liquid Injection deposition systems for deposition of metals, oxides, nitrides, metals, 2D materials (TMD), etc. These systems can perform deposition processes with the widest range of chemicals including low vapor pressure and thermally unstable precursors. They have multi process capabilities inside the same process chamber: CVD, ALD, MOCVD and pulse pressure CVD and even RTP and RTCVD in the 2-inch system that makes it a unique machine for process development of new materials.

www.annealsys.com


 Products

  • AS-Master
    The AS-Master is a 200 mm cold wall chamber RTP system with vacuum and high vacuum capabilities. The system is available with manual loading for process development and with robot handling system for MEMS and production applications....

  • The AS-Master system is 200 mm cold wall chamber Rapid Thermal Processor. The system can receive a susceptor with a maximum outer diameter of 240 mm for processing 200 mm wafers or batch of smaller wafers.

    The cold wall chamber technology provides significant advantages: high process reproducibility, higher cooling rate, accurate temperature measurement and contamination free environment.

    Several halogen lamp furnaces versions are available with a high temperature version that can perform processes up to 1450°C. The cold wall chamber technology associated with the pulse control mode of the lamp furnace allows processing thermally sensitive substrates.

    The fast cooling option increases the cooling rate by 4 times compare to conventional RTP systems.

    The system can be provided with customized loading systems including loading of the wafers on or into graphite susceptors for annealing of materials with low infrared absorption.

  • AS-Premium
    The AS-Premium is a RTP platform with a square chamber that can process substrates up to 156x156 mm². The versatile configuration allows different temperature ranges, different heating and loading configurations. ...

  • The AS-Premium is a 6-inch infrared lamp RTP system that. The machine is designed to be versatile to meet customer requirements
    The process chamber can be provided with top heating or top and bottom heating. The system can be used for R&D application with manual loading and can be provided for production application with cassette to cassette loading or a cluster tool.
    The high vacuum capability combined with a loadlock offers ultra-clean process conditions for processes that are very sensitive to oxygen or moisture contamination.
    The machine can be used for a wide range of applications including optoelectronics, MEMS, power components (SiC, GaN), silicon smoothening, etc

  • AS-One
    The AS-One is a RTP platform available for up to 100 mm or up to 150 mm diameter substrates. The versatile configuration and high temperature range makes it suitable for R&D applications and small scale production. ...

  • The AS-One RTP system has been specially developed to meet the requirements of universities, research laboratories, quality control and small-scale production. The high reliability guarantees low cost of ownership.
    The clam shell style design of the process chamber gives full access to the bedplate and provides easy loading and unloading of the wafers and practical thermocouple installation. The AS-One can receive a turbo molecular pumping unit in order to provide ultra-clean process environment.
    The machine can be used for a wide range of applications including optoelectronics, MEMS, power components (SiC, GaN), silicon smoothening, etc.

  • MC-050 DLI-CVD / DLI-ALD system
    The MC-050 is a Direct Liquid Injection deposition system. It can perform a wide range of processes inside the same chamber without removing the substrate CVD, ALD, pulse pressure CVD, MOCVD, RTP, RTCVD. ...

  • The Annealsys MC-050 system is a 2-inch (50 mm) DLI-CVD / DLI-ALD reactor with halogen lamp heating.
    The association of the infrared lamp heating with the direct liquid injection vaporization system makes this system unique for material research. It offers the capability to deposit most of the materials of the periodic table with multi process capability inside the same process chamber.
    The Direct Liquid Injection (DLI) vaporizers provide perfect control of precursor flow and allow utilization of low vapor pressure and diluted chemical precursors. The fast switching of the precursor vapor flows with the by-pass valve provide perfect interface control for deposition of nanolaminates.
    The automated liquid panel is optimized for reduced consumption of chemical precursors. The no dead volume design provides full rising capability for easy change of chemicals and refilling of the precursor tanks in a glove box.
    Applications: oxides, metals, nitrides, 2D materials (TMD), etc.

  • MC-100 DLI-CVD / DLI-ALD system
    The Annealsys MC-100 system is a 4-inch CVD reactor developed to meet the requirements of research and development units. It is designed for DLI-CVD and ALD processes for deposition of metal and metal alloys, oxides and transition metal nitrides....

  • The Annealsys MC-100 system is a 100 mm DLI-CVD / DLI-ALD reactor.
    The Direct Liquid Injection (DLI) vaporizers provide perfect control of precursor flow and allow utilization of low vapor pressure and diluted chemical precursors. The fast switching of the precursor vapor flows with the by-pass valve provide perfect interface control for deposition of nanolaminates.
    The automated liquid panel is optimized for reduced consumption of chemical precursors. The no dead volume design provides full rising capability for easy change of chemicals and refilling of the precursor tanks in a glove box.
    Applications: oxides, metals, nitrides, 2D materials (TMD), etc.


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