Applied Microengineering Ltd. (AML)

Unit 8, Library Avenue,
Harwell Oxford
Didcot,  Oxfordshire  OX11 0SG

United Kingdom
  • Booth: A4751

Unique in-situ Aligner Wafer Bonders & BONDCENTRE Services

 AML manufactures unique in-situ aligned wafer bonding machines & provides R&D & production services based around wafer bonding in its BONDCENTRE facility situated in Oxfordshire,UK.

AML’s unique Aligned Wafer Bonders are the only integrated systems capable of in-situ alignment, activation & bonding - all carried out in one chamber - on the market, and are particularly suited to the bonding requirements of MEMS, IC, & III-V industries.

The incredible flexibility of the machines allows processes that cannot be performed on any other wafer bonder! Particular strengths include the capabilities for high vacuum encapsulation and getter activation, where wafers may be held at different temperatures, with differentials of over 300C.

The systems offer the flexibility for R&D and the throughput and automation for volume production, provide the lowest cost of ownership and benefit from first class support.

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".