Landsberger Str. 396
Munich,  D-81241

  • Booth: A4301

ACCRETECH-a high precision company welcomes you at our booth

ACCRETECH is a world-leading equipment supplier to the semiconductor industry.

Key products are Wafer Probers, Dicing Systems, Dicing Blades, Polish Grinders, Wafer Edge Grinders, High Rigid Grinders and CMP.

Our world-leading Wafer Probers feature highest accuracy, throughput and reliability.

The Laser Dicing technology was the first in the market for a completely dry, dust-free cutting process for MEMS and other applications.

Our new fully- and semi-automatic 200mm/300mm Twin Spindle Dicers feature high speed, efficiency and reliability at smallest footprint available.

Compact and modular CMP systems with high performance CMP technology built up in volume-production line of semiconductor devices

The ACCRETECH Polish Grinder system achieves wafer thickness down to 15µm including stress release in the same system.

For Si, Sapphire, SiC or GaN wafer manufacturer we can provide the required grinding equipment for complete process flow.

We are looking forward to seeing you at booth!

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