Atotech would like to welcome the Semiconductor Industry.
Atotech’s semiconductor technology provides process solutions for advanced wafer metallization - from chip interconnects to wafer level packaging technologies. Electrochemical and electroless deposition techniques are used to plate Cu, Pd, Ni, Au and Sn for a variety of applications. These range from damascene plating over pad surface treatment to metallization of TSV for 3D integration. Being close to its customers is a top priority for Atotech. Its’ regional TechCenters for semiconductor technology development are equipped to provide the industry and local clients with customized products and top-of-the-line plating support. Chemistry production is done in our state-of-the-art manufacturing facilities. Special focus is placed on quality assurance, the use of leading technology and extensive R&D programs. Atotech is committed to developing and implementing innovative and sustainable technologies that allow our customers to minimize production costs, reduce their environmental footprint, and improve process efficiency.
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