scia Systems GmbH

Annaberger Str. 240
Chemnitz,  09125

  • Booth: A4365


  • scia Mill 200
    System for large area Ion Beam Etching and Milling of single substrates up to 200 mm. A typical application is structuring of complex multilayers of materials with very low contamination....

  • The scia Mill 200 is designed for highly uniform Ion Beam Etching and Milling of single substrates. The system is available as single vacuum chamber version with load-lock or handling robot as well as in cluster configuration with up to three chambers and cassette handling.

    The scia Mill 200 can be used for Ion Beam Etching (IBE) with inert gases. Additionally the system can be applied for Reactive Ion Beam Etching (RIBE) as well as for Chemically Assisted Ion Beam Etching (CAIBE).


    • Structuring of MEMS, MRAM and sensors (e.g. TMR/GMR), metallic and dielectric multilayers
    • Ion Beam Smoothing
    • Microstructuring
    • Reactive etching of III/V Semiconductors (e.g. GaAs, GaN, InP)
  • scia Trim 200
    Ion beam trimming tool for localized film thickness trimming in MEMS applications. Typically used for frequency trimming in manufacturing of acousto-electrical devices and localized pole trimming of thin film heads and post-CMP processing....

  • The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. The correct trimming amount is achieved by varying the dwell time, while the focused ion beam scans across the wafer surface.

    The scia Trim 200 is a high volume production system and accommodates a standard semiconductor cassette handling robot. Cluster tools with two process chambers and two cassette load-locks are available.


    • Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
    • Thickness trimming of Lithium Tantalate, Lithium Niobate or Quartz wafers
    • Film thickness error or step height correction in thin film head (TFH) manufacturing
    • Dimensional correction in manufacturing of MEMS components

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