The scia Trim 200 is designed for high precision film thickness trimming in wafer processing. The correct trimming amount is achieved by varying the dwell time, while the focused ion beam scans across the wafer surface.
The scia Trim 200 is a high volume production system and accommodates a standard semiconductor cassette handling robot. Cluster tools with two process chambers and two cassette load-locks are available.
- Frequency trimming of bulk acoustic wave (BAW) or surface acoustic wave (SAW) filters
- Thickness trimming of Lithium Tantalate, Lithium Niobate or Quartz wafers
- Film thickness error or step height correction in thin film head (TFH) manufacturing
- Dimensional correction in manufacturing of MEMS components