sentronics metrology GmbH

Mallaustr. 72
Mannheim,  D-68219

  • Booth: A4743

sentronics metrology - Focus on Quality

sentronics metrology GmbH is world leader in non-contact, non-invasive optical metrology.
For over ten years sentronics metrology has been developing and marketing systems for seamless monitoring of quality processes in the areas of: wafers, coatings / films.
For many well-known manufacturer in the wafer industry, our metrology and inspection systems stand for quality assurance, precision and process security.


  • SemDex A
    High Speed Wafer Metrology and Sorting System with Multi Sensor Technology ...

  • The SemDex A provides reliable, high-precision measurements of wafer and multi-layer thickness, bow, warp or roughness with flexible handling options. 

    Substrate-layer thickness, TTV or the total thickness of a stacked wafer, bow, warp and flatness of a wafer can be determined with sub-µm accuracy in a single measuring run. 

    Surface roughness down to nm level and furthermore, TSV, RST and mini-bump parameters can be retrieved as well.

    The powerful, modular system can be equipped with diverse handling and measurement configurations like different sensors, measurement stages and automation hardware. A typical configuration consists of a dual arm robot with flipping option, two load ports, a pre-aligner and one or two measurement modules for multiple applications. Other configurations with up to 4 load ports for 200 mm (8“) wafers or up to 3 load ports for 300 mm (12“) are possible on request. 

    Two robot arms provide high throughput handling. Wafer flipping is possible at all stations. High warpage and framed wafer handling is optional.

    The tool can be equipped with different xy stages or a rotational stage for fast measurements that cover the complete wafer area. The use of multiple readers to measure the wafer or glass carrier ID ensures maximum flexibility. A high resolution camera in the metrology module can be added to evaluate the geometrical shape of a stacked wafer.

    The WaferSpect software package serves as an intuitive user interface for metrology needs: create and save recipes, execute measurement tasks, evaluate and process result data. 

    A SECS /GEM software package is available and can be customized to specific requirements.

  • SemDex M
    Modular Metrology System...

  • The flexible SemDex M is the base platform for a wide range of semiconductor metrology applications. Diverse measurement configurations and handling options are possible using different sensors, measurement stages and automation hardware.

    SemDex M is a modular system that can be used as a stand-alone semi-automated metrology system (M1) or as a fully-automated tool with an automation module (M2) attached to handle 6”, 8” and 12” wafers or frames. 

    Each module is configured flexibly to provide a customized sensor and automation configuration for each specific requirement. Select the sensors, stage and chuck type suitable for your metrology applications and solve your handling requirements by choosing appropriate components from a wide range of robots, end-effectors, load ports and pre-aligners for the automation module. 

    To enhance the productivity or fulfill future requirements each SemDex M system can be upgraded on-site with additional
    modules with a minimum effort and lowest tool down time. 

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