The SemDex A provides reliable, high-precision measurements of wafer and multi-layer thickness, bow, warp or roughness with flexible handling options.
Substrate-layer thickness, TTV or the total thickness of a stacked wafer, bow, warp and flatness of a wafer can be determined with sub-µm accuracy in a single measuring run.
Surface roughness down to nm level and furthermore, TSV, RST and mini-bump parameters can be retrieved as well.
The powerful, modular system can be equipped with diverse handling and measurement configurations like different sensors, measurement stages and automation hardware. A typical configuration consists of a dual arm robot with flipping option, two load ports, a pre-aligner and one or two measurement modules for multiple applications. Other configurations with up to 4 load ports for 200 mm (8“) wafers or up to 3 load ports for 300 mm (12“) are possible on request.
Two robot arms provide high throughput handling. Wafer flipping is possible at all stations. High warpage and framed wafer handling is optional.
The tool can be equipped with different xy stages or a rotational stage for fast measurements that cover the complete wafer area. The use of multiple readers to measure the wafer or glass carrier ID ensures maximum flexibility. A high resolution camera in the metrology module can be added to evaluate the geometrical shape of a stacked wafer.
The WaferSpect software package serves as an intuitive user interface for metrology needs: create and save recipes, execute measurement tasks, evaluate and process result data.
A SECS /GEM software package is available and can be customized to specific requirements.