TECNISCO is processing service provider for MEMS components.
TECNISCO was established in 1970 as a processing service provider for precision components, taking advantage of DISCO Corporation's cutting and grinding technologies. Since then, we have developed and integrated our technology fields into a "Cross-edge" micro processing technology which crosses five leading-edge technologies such as cutting, grinding, polishing, metalizing, and bonding, thus supporting high-tech products in the industries of optical communication, industrial laser, AV/mobile, projector, automotive and medical devices.
Now, with “ The TECNISCO WAY “which clearly defined our corporate values, every single staff member of our company continuously challenges creativity and evolution. With our developed unique micro processing technologies, we promise that we will continue to provide first-grade products and services to our customers to become a real solution partner who can realize what our customers really want.
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