CE-MAT GmbH

Bachweg 2
Linsengericht,  D-63589

Germany
http://www.ce-mat.com
  • Booth: A4545

CE-MAT is dealing with cost-effective and innovative products for the semiconductor and solar industry. We offer customer specific solutions to your requirements in the areas spare parts, equipment and service.

Our program contains the following areas:

  • Ceramic Spray Electrostatic Chucks and consumables for Single Wafer Plasma Etch
  • Silicon Boat for atmospheric and LP-CVD processes
  • Second source parts for ion implanter
  • Quartz parts for furnaces and epitaxy
  • CVD SiC dummy wafer
  • Quartz glass raw materials
  • Inspection tools: Visual, IR and PL


 Products

  • CE-MAT Product Family
    Our Product Family...

    • Ceramic Spray Electrostatic Chucks and consumables for Single Wafer Plasma Etch
    • Silicon Boat for atmospheric and LP-CVD processes
    • Second source parts for ion implanter
    • Quartz parts for furnaces and epitaxy
    • CVD SiC dummy wafer
    • Quartz glass raw materials
    • Inspection tools: Visual, IR and PL
  • Silicon boat for thermal processing
    Advantages of Silicon boat over quartz and/or SiC boat...

    • Reduced defect density and particle counts  leading to yield improvement
    • Identical thermal expansion of boat and wafer, no friction
    • Sophisticated rod design
    • Less overlap rod to wafer
    • No metallic impurities in silicon as in quartz or SiC
    • No slip lines or crystal damages
    • Using silicon vs Quartz or SiC
    • Using mono crystal vs poly crystal silicon(no CVD growing defects)
    • No warp of the boat as it is known by using quartz materials for high-temperature processes
      • Increased tool uptime compared to quartz and SiC boats
      • Less cleaning and maintainance (proven uptime > 2 years)
  • Ceramic Spray Electrostatic Chuck
    Convert your Polyimide ESC into Ceramic ESC...

  • Benefits of Ceramic ESC

       1) Ceramic Layers for Anti Micro-Arcing to Longer Life Time

       2) Wafer-less Cleaning

       3) Embossing He Pattern for Temp. Uniformity

       4) Direct Coated Layers without adhesive use

       5) Ceramic Sleeves in He Hole for

       6) Thermal Conductivity material for Temp. Uniformity

       7) Multiple Repairs possible for Surface Conditions 


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