EV Group (EVG)

DI Erich Thallner Strasse 1
St. Florian/Inn,  A-4782

  • Booth: A4241

Visit EVG at the booth # A-4241

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.



  • EVG® ComBond®
    High-Vacuum Wafer Bonding Platform enabling emerging MEMS applications as well as electrically conductive and oxide-free covalent bonds at room or low temperatures...

  • The EVG ComBond marks a new milestone in EVG’s unique portfolio of wafer bonding equipment and technology in response to market needs for more sophisticated integration processes. Typical application areas range from advanced engineered substrates, stacked solar cells and power devices to high-end MEMS packaging, high-performance logic and “Beyond CMOS” devices.

    The highly flexible platform supports multiple modules, including activation, bake, optical alignment and thermo-compression wafer bonding modules for metal-based bonding. EVG’s wafer activation technology and high-vacuum handling and processing allow the formation of covalent bonds at room temperature for engineered substrates and facilitates the bonding of heterogeneous materials as well as the formation of electrically conductive bond interfaces. The high-vacuum technology also enables low-temperature bonding of metals, such as Aluminum, that re-oxidize quickly in ambient environments.


    • High Vacuum Covalent Bonding
      • In-Situ Oxide removal
      • Superior Surface Properties
      • Conductive Bonding
    • Room Temperature Process
      • Multiple Materials Combination
      • Stress Free Bond Interface
      • High Bond Strength 
    • Modular System for HVM and R&D 
      • Flexible Configuration
      • Fully Automated
      • Easy Serviceability
  • EVG®7200 LA SmartNIL®
    SmartNIL®-based Nanoimprint Lithography System...

  • The EVG7200 Large-Area UV Nanoimprint System allows imprinting on Gen 2 (370 mm x 470 mm) panel size substrates. The SmartNIL-based system is ideally suited to leverage nanotechnology for panel manufacturing. For applications like displays, biotechnology and photonic elements, which cannot be reduced in size, it is crucial to increase the substrate utilization efficiency by increasing the pattern area. NIL has proven to be the most cost-efficient way to enable fabrication of nano patterns on large areas as it is not limited by optical systems and can provide the best pattern fidelity for the smallest structures.
    SmartNIL provides superior conformal imprint results down to 40 nm utilizing a very robust and controllable tooling.


    • Nanopatterning down to 40 nm on panel-size substrates
    • Robust and precisely controllable processing
    • Optimized high-power UV curing sequence for panel substrates
    • Fully automated imprinting and controlled low-force detachment for maximum working stamp reusability
    • Proprietary SmartNIL technology is a scalable and robust technology fulfilling industry needs
    • SmartNIL provides unmatched conformal imprinting over large areas
    • Volume-proven imprinting technology with superior replication fidelity
    • Uniform large-area imprint with high process flexibility
    • Multiple-use polymer stamp technology for longest master lifetime and significant cost savings
  • IQ Aligner® NT
    Automated Mask Alignment System...

  • The new IQ Aligner NT is the most productive and technically advanced automated mask alignment system for high-volume applications. It provides a 2X increase in throughput and a 2X improvement in alignment accuracy over EVG's previous-generation IQ Aligner system. The IQ Aligner NT surpasses the most demanding requirements for back-end lithography applications while providing up to 30 percent lower cost of ownership compared to competing systems. It is ideally suited for wafer bumping and interposer patterning serving a variety of advanced packaging types, including Wafer-level Chip Scale Packaging (WLCSP), Fan-out Wafer Level Packaging (FOWLP), 3D-IC/Through-silicon Via (TSV), 2.5D Interposers, and Flip Chip.

    Enhanced Performance

    Semiconductor advanced packaging is continually evolving to enable new types of devices with increasing functionality at a lower cost per function. As a result, new developments in lithography are required to address the unique needs of the advanced packaging market. The new IQ Aligner NT addresses the most challenging requirements of advanced packaging lithography with the best technical performance data combined with extraordinary productivity.

    • First-rate throughput
      • First Print >200 wph
      • Topside Alignment >160 wph
      • Backside Alignment >160 wph
    • Cutting-edge alignment accuracy
      • Topside Alignment ≥ 250 nm
      • Backside Alignment ≥ 500 nm
    • High power lamp house
      • Broad band intensity >120 mW/cm²
      • i-line intensity > 65 mW/cm²

    New Capabilities

    The IQ Aligner NT incorporates a number of technical improvements and unique features to address a variety of industry needs as well as enable advanced process control.

    • Dual substrate size concept
      • Handles different mask sizes with no retooling efforts and no adapter frames required - provides a quick and easy bridge tool
    • Full clearfield mask movement
      • Highest process compatibility and flexibility in alignment pattern positioning
      • Facilitates processing with dark field masks
    • All contact-free processing
      • Contact-free wafer wedge error compensation (WEC)  
      • Contact-free process photo mask gap calibration
    • Run-out compensation
      • Ultra-flat temperature-controlled wafer chuck
    • Manual mask and wafer-loading capabilities
      • Allows manual wafer loading on systems configured with robot handling
    Automated Production Fusion Wafer Bonding System combining several performance breakthroughs to surpass ITRS requirements for wafer bonding...

  • EVG's GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning . The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of <50 nm.


    • New SmartView® NT3 face-to-face bond aligner with sub-50 nm  wafer-to-wafer alignment accuracy
    • Up to six pre-processing modules like Clean Module, LowTemp™ Plasma Activation Module, Alignment Verification Module and Debond Module available
    • XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)
  • EVG®50
    Automated Metrology System for industry leading high-accuracy measurements...

  • The EVG 50 (fully automated stand-alone tool) and the Inline Metrology Module (integrated in EVG's high-volume manufacturing systems) offer highly accurate measurements at high speed, utilizing different measurement methods for a large number of applications.

    The tool's application range covers multi-layer thickness measurements for determination of the total thickness variation (TTV) of an intermediate layer, the inspection of bond interfaces as well as resist thickness measurement, and meets the most demanding requirements of the yield-driven semiconductor industry.


    • Multi-layer metrology with industry-leading throughput and resolution
      • Multi-layer thickness mapping
      • Bond interface inspection
    • Low contact edge handling
      • Particle free
      • Full-area accessible front- and backside
    • Self-calibrating for better system reproducibility and more productive time
    • Various output formats
    • 100% production inspection
  • EVG®850TB/DB (XT Frame)
    Automated Temporary Wafer Bonding / Debonding Systems. Next-generation thin wafer processing for high-volume 3D IC manufacturing, Based on EVG’s new XT Frame equipment platform...

  • Built on the company’s XT Frame platform, the new EVG®850TB/DB systems double the throughput over EVG’s previous-generation, industry-benchmark equipment platform to up to 40 stacks per hour. The systems enable the highest productivity, repeatability and yields in thin-wafer processing. Designed for EVG’s open materials platform approach, the EVG®850TB/DB support a wide range of adhesives from various materials suppliers, providing customers with the most flexible choice of temporary bonding materials.


    • Highly efficient continuous mode operation (zero idle time)

    • Ultra-fast handling system

    • Up to nine process modules

    • Up to 4 FOUP load ports

    • Up to 10 additional FOUPS in a Local Foup Storage System

    • In-line metrology module option enables real-time monitoring of bonding/debonding process

    • Qualified for a wide range of bonding and debonding processes, including low temperature debonding methods like ZoneBOND®


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