Fraunhofer IZM - ASSID

Ringstrasse 12
Moritzburg,  D-01468

  • Booth: A4421

Fraunhofer IZM is a worldwide leading institute for microelectronic packaging. Fraunhofer IZM-ASSID provides prototyping and low-volume manufacturing services (300/200 mm) at its leading-edge pilot line for wafer-level packaging. Fraunhofer IZM-ASSID has established strong cooperations with leading material and equipment suppliers in which customer-specific solutions in the field of material, equipment and processes are developed and introduced into products. As a member of the Fraunhofer Cluster 3D Integration, Fraunhofer IZM-ASSID offers fully customized support for 3D integration and 3D SiP including design, technology and reliability.

Core Competencies:

  • Leading-edge wafer level packaging
  • 3D heterogeneous system integration
  • Wafer-level System-in-Packages (WL-SiP)
  • Enhanced interconnection & assembly technologies
  • Customized technology development
  • Customer-specific prototyping & pilot-line manufacturing
  • Process, equipment & material evaluations as well as qualification
  • Process transfer & product integration

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