Trymax Semiconductor Equipment B.V

Roggeweg 26b
Nijmegen,  6534 AJ

Netherlands
http://www.trymax-semiconductor.com
  • Booth: B1251


Trymax Semiconductor Equipment - When Plasma Matters

Trymax Semiconductor Equipment is an innovative plasma-based company designing, manufacturing and marketing state of the art equipment solutions for ashing, descum, surface preparation, light etching as well as UV photoresist curing and charge erase. With a product portfolio ranging from 100mm wafer size to 300mm and an installed base of 250+ systems, Trymax has significant market shares at foundries, IDMs, and Wafer Level packaging houses for end applications in Power Semiconductors, RF, Analog, Automotive, MEMS, LED, and CMOS. Recognized for its reliability, low cost of ownership, and performances, Trymax continuously innovates to support its customer’s needs. Trymax is headquartered in the Netherlands and operates local offices in Italy and China.


 Press Releases

  • NEO 2000UV to address the lack of available UV curing/charge erase systems and offer longer term perspective to IC manufacturers.

    NIJMEGEN, THE NETHERLANDS – March 27, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions for semiconductor manufacturers, announces the addition of an ultraviolet (UV) curing and charge erase product line to its portfolio. The system called NEO 2000UV is a leading-edge dual chamber solution compliant with wafer sizes up to 200mm.

    UV curing and charge erase equipment are used for a wide range of applications that includes photo-stabilization of the resist prior implantation or etch, for small CD, or to erase charge built-up during the IC manufacturing process. This new offer from Trymax will contribute to support the 200mm wafer capacity increase over the period 2019-2022 forecasted by SEMI in its latest report*.

    The decision of Trymax to develop such new product was based on the market demand. Several IC fabs were facing difficulties to find UV curing/charge erase equipment to expand their manufacturing capacity or simply maintain their existing toolset. Customers had to rely mainly on the rarely available refurbished equipment and parts.

    “By launching NEO 2000UV, Trymax offers longer term perspective to IC manufacturers”, stated Ludo Vandenberk, Executive Vice President of Trymax. “This new product line extends Trymax capabilities to support the semiconductor industry and will generate value for customer by enabling higher yield in wafer manufacturing.”
    NEO 2000UV has been designed taking advantage of the reliable NEO platforms developed by Trymax for plasma ashing, descum, and etching applications. NEO 2000UV is implementing state-of-the-art robotics, components, the latest digital technologies and software, and is CE compliant. NEO 2000UV can accommodate cassettes or SMIFs. It is manufactured in the Netherlands.

    First shipments of pre-ordered systems will start in early Q3 2019. Customers interested to run demonstrations in Trymax application lab are invited to contact Trymax.

    Reference * 200mm Fabs to Add 700,000 Wafers Through 2022, SEMI Reports (Feb 12th, 2019)

    About Trymax Semiconductor Equipment BV:

    Trymax’s core business is to support semiconductor manufacturers through the world with innovative plasma-based solutions for photo resist removal, surface cleaning, isotropic etch, as well as UV curing/charge erase, that are used in the fabrication of integrated circuits and other semiconductor devices. Trymax is a privately held company headquartered in Nijmegen, The Netherlands. Trymax operates regional offices in China (Suzhou) and Italy (Milan). Learn more at www.trymax-semiconductor.com.

    Company contact:
    Yann Guillou
    Global Marketing & Sales Director
    +31 24 350 08 09
    Yann.guillou@trymax-semiconductor.com
  • NIJMEGEN, THE NETHERLANDS – March 18, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma-based equipment and solutions for semiconductor manufacturers, is pleased to announce NIBC Bank as a new strategic financial partner. This partnership will enable Trymax to accelerate new technology developments and scale up its manufacturing capacity. The Dutch merchant bank is providing growth capital via a minority equity position next to the management shareholders.

    Over the last years, Trymax succeeded to significantly grow its revenue and gain market share in the plasma-based equipment market. Trymax decided to join forces with NIBC Bank to support its growth strategy. The partnership also provides financial robustness in this capital intensive industry.

    Leo Meijer, CEO and co-founder of Trymax “In the last 10 years, Trymax grew from a small to a solid medium-sized company with global offices and multiple large customers around the globe. To take the company to the next level and achieve our growth ambition, we are happy to join forces with NIBC Bank to strengthen our company. We share a common ambition, vision and similar values”.

    Frans van der Harst, Managing Director NIBC Mezzanine & Equity Partners “With mezzanine and equity solutions we support successful companies in realizing their growth ambitions. We believe in the strategy and management team of Trymax and are looking forward to support this entrepreneurial company to reach the next level. The investment in Trymax underscores NIBC’s commitment to the Technology Sector and more specifically High-Tech Industry”.

    The partnership between the companies is effective since March 15th, 2019 and has been a collaboration involving Trymax, NIBC Bank, and Oreijs Capital & Management.

    About Trymax Semiconductor Equipment BV:
    Trymax’s core business is to support semiconductor manufacturers through the world with innovative plasma-based solutions for photo resist removal, surface cleaning, as well as isotropic etch, that are used in the fabrication of integrated circuits and other semiconductor devices. Trymax is a privately held company headquartered in Nijmegen, The Netherlands. Trymax operates regional offices in China (Suzhou) and Italy (Milan). Learn more at www.trymax-semiconductor.com.

    About NIBC Bank:
    NIBC is an enterprising bank focused on our clients’ most decisive moments. From our offices in The Hague, Amsterdam, Frankfurt, London and Brussels, NIBC serves around 600 mid-market businesses and more than 400,000 retail clients through a portfolio of client-focused products and services. Through the Investment Department, NIBC Mezzanine & Equity Partners, NIBC supports entrepreneurs with a proven track record by providing risk-bearing capital. www.nibc.com

    Company contact:
    Yann Guillou
    Global Marketing & Sales Director
    +31 24 350 08 09
    Yann.guillou@trymax-semiconductor.com
  • Multi-site shipment in Taiwan and China for 200mm and 300mm bumping descum solutions.

    NIJMEGEN, THE NETHERLANDS - May 15, 2019. 
    Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received multi-system orders for its NEO 2000 and NEO 3000 series from a leading Taiwanese packaging house. This order will expand the existing NEO install base at the customer in Taiwan and allows Trymax to break into the customer’s fab in China. Shipping of the systems will start in Q2 and continue during Q3 2019.

    “We are pleased to receive this order for several shipments in two different fabs”, said Jonathan Lee, General Manager of Trymax in Asia. “Many companies claim to deliver the best Cost of Ownership but these repeat and expansion orders are a concrete example that our solutions are truly delivering it”.

    NEO 2000 series is a dual chamber system for wafers up to 200mm. NEO 3000 series is a dual chamber system for wafers up to 300mm. All systems will be configured with Trymax’s dual source plasma technology combining RF and microwave to provide the best ashing rate and uniformity trade-off. The dual source technology is the choice recommended by Trymax for many wafer level packaging applications such as bumping or Fan-Out Wafer Level Packaging.

    This month, Trymax will be sponsoring the Plasma Etch and Strip in Microtechnology workshop (PESM) in Grenoble (France) in May 20-21, and the SEMI Fab Owner Alliance meeting in Lowell (USA) in May 22-23. Trymax will be exhibiting at the Electronic Components and Technology Conference (ECTC) in Las Vegas (USA) in May 28-31. Staff of the company can be met at these events to learn more about NEO series.

    About Trymax Semiconductor Equipment BV: 
    Trymax’s core business is to support semiconductor manufacturers through the world with innovative plasma-based solutions for photo resist removal, surface cleaning, isotropic etch, as well as UV curing/charge erase, that are used in the fabrication of integrated circuits and other semiconductor devices. Trymax is a privately held company headquartered in Nijmegen, The Netherlands. Trymax operates regional offices in China (Suzhou) and Italy (Milan). Learn more at www.trymax-semiconductor.com

    Company contact: 
    Yann Guillou 
    Global Marketing & Sales Director 
    +31 24 350 08 09 
    Yann.guillou@trymax-semiconductor.com
  • Press release: Trymax Receives Order from a Leading-Edge Photonics Research Organization

    Eindhoven University of Technology (TU/e) acquires a plasma solution from Trymax

    NIJMEGEN, THE NETHERLANDS – August 21, 2019. Trymax Semiconductor Equipment BV (Trymax), a global leader in plasma solutions, today announced it has received an order from NanoLab@TU/e of Eindhoven University of Technology. The NEO 200A series from Trymax with microwave downstream plasma technology was selected to perform resist stripping, descum and surface cleaning on indium phosphide (InP) wafers. This order illustrates the competitiveness of the single chamber and fully automated solution of Trymax for the photonics market.

    “European research organizations and equipment companies are at the forefront of the global photonics industry” commented Carlos Lee, Director General of European Photonics Industry Consortium (EPIC). “Having a company such as Trymax collaborating with Eindhoven University of Technology goes in the right direction to build an efficient manufacturing infrastructure”.

    Eindhoven University of Technology selected Trymax after running technical demonstrations on InP substrate and other compound semiconductor substrates. The results achieved on the NEO 200A platform in term of ash rate, non-uniformity and handling of critical substrate materials of different sizes outperformed competing solutions.

    “Beyond silicon, Trymax has a long experience and unique capabilities in handling various substrates materials such as SiC, GaN, GaAs, LiNbO3, LiTaO, glass, and eWLB” stated Leo Meijer, CEO of Trymax. “Having a recognized university such as Eindhoven University of Technology as a customer is an honor. Trymax, as a Dutch headquartered company, is proud to have the researchers and students from Eindhoven University of Technology developing the photonic solutions of the future with our system”.

    “Eindhoven University of Technology has chosen the Trymax NEO 200A because of the robustness of the tool, the expertise of the Trymax team and the short distance to the lab, all which is superior to what we found elsewhere on the market” mentioned Huub Ambrosius, Managing Director of NanoLab@TU/e.

    The NEO 200A system will be installed at Eindhoven University of Technology in Q3 2019.

    About Trymax Semiconductor Equipment BV:
    Trymax’s core business is to support semiconductor manufacturers through the world with innovative plasma-based solutions for photo resist removal, surface cleaning, isotropic etch, as well as UV curing/charge erase, that are used in the fabrication of integrated circuits and other semiconductor devices. Trymax is a privately held company headquartered in Nijmegen, The Netherlands. Trymax operates regional offices in China (Suzhou) and Italy (Milan). Learn more at www.trymax-semiconductor.com.

    Company contact:
    Yann Guillou
    Global Marketing & Sales Director
    +31 24 350 08 09
    Yann.guillou@trymax-semiconductor.com


 Products

  • NEO 2000
    The NEO 2000 product line is an advanced plasma ashing/etch system from Trymax Semiconductor Equipment with the latest photoresist removal technology offering exceptional performance at a very competitive price....

  • The NEO 2000 is specifically designed for applications on 100mm to 200mm diameter substrates. It’s equipped with an ultra-fast transfer platform and is flexible and configurable for handling different dimensions of substrates at the same time with no hardware changes. The NEO 2000 series has a compact modular design and can deliver a high throughput to achieve the lowest Cost of Ownership.
  • NEO 2000UV
    The NEO 2000UV is an advanced UV Curing/Erase system from Trymax Semiconductor Equipment with the latest and fastest UV curing and charge erase technology on the market....

  • It offers exceptional performances meeting nowadays semiconductor fab requirements. It is a high throughput system with optimized Cost of Ownership. The NEO 2000UV is specifically designed for applications up to 200mm diameter substrates.
  • NEO 2400
    The NEO 2400 series production platform is one of the latest additions to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment....

  • The NEO 2400 platform can be configured with any of the available Trymax NEO process modules and is compatible with the substrates up to 200mm in diameter.

    This platform can be used as a full bridge tool with the compatibility to run substrates of different type and diameter up to 200mm.

  • NEO 200A
    The NEO 200A product is the smallest footprint single chamber platform for advanced ashing and etching products from Trymax Semiconductor Equipment. ...

  • It’s a fully automated single chamber system that can be configured with any of the currently available Trymax NEO process modules. It’s compatible with substrates up to
    200mm in diameter. The small footprint of the NEO 200A is configured with a dual cassette.
  • NEO 3000
    The NEO 3000 product line is a long established tool from the NEO range that is used for advanced plasma ashing and etching from Trymax Semiconductor Equipment....

  • It’s ready for the highest volume of production and adaptable to every production ramp and budget. The NEO 3000 system can be configured with any of the available
    Trymax NEO process modules and is compatible with substrates up to 300mm in diameter. The small footprint and modular design can be flexibly configured based on your production needs.


    The system can be used as a full bridge tool with compatibility to run both 200 and 300mm diameter substrates.

  • NEO 3400
    The NEO 3400 series production platform is one of the latest additions to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment....

  • It’s ready for the highest volume of production and adaptable to every production ramp and budget. The NEO 3400 platform can be configured with any of the available
    Trymax NEO process modules and is compatible with substrates up to 300mm in diameter. The small footprint and modular design can be flexibly configured based on
    your production needs.

    This platform can be used as a full bridge tool with compatibility to run both 200 and 300mm diameter substrates.


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