The Sigma product range supports wafer sizes from 100mm to 300mm with deposition technologies covering conventional PVD through to MOCVD
Sigma Metal Deposition Technologies
Standard PVD – conventional sputter modules for low topography features
Advanced Hi-Fill (AHF) PVD – ionized sputter source for deposition into high aspect ratio features
C3M – Virtually conformal metal coverage using MOCVD technology for advanced liner/barrier
Advantages
Single wafer processing improves yields and on-wafer performance when compared to batch processing.
Planar target with full face erosion, avoids re-sputtering, reduces particle contamination and improves target life
Rapid target change (<5mins), with common magnetron, increases uptime
Reliable handling of fragile, thinned or bowed wafers
"Super Uniformity" option available for specialist applications
Multi-wafer degas to increase throughput for long (low temp) degas applications
Common software for 200mm and 300mm systems - ease of use
Markets Served
MEMS, Advanced Packaging, Power Semiconductors, LED Manufacturing, RF-IC