Polyteknik AS

Moellegade 21
Oestervraa,  DK-9750

  • Booth: B1116

Polyteknik AS - When Thin Film Matters

Polyteknik AS is an innovative technology based company with more than twenty years in business. An excellent platform of technology, a global reference list, and highly skilled personnel makes Polyteknik AS an appreciated partner on deposition technlogy.

Our deposition systems are designed for production and R&D facilities within the semicon, MEMS and electronic industries. We supply high quality PVD systems covering DC/RF/HIPIMS sputtering, e-beam deposition, thermal evaporation, organic deposition (OLED/OPV)

FLEXTURA PVD - Bridging flexibility and robust industrial production!

  • Fully automatic standalone systems or cluster configuration
  • Proven safe and fast wafer handling - batch, single substrate or cassette-to-cassette
  • Proven 1000C high temperature substrate stage for epitaxial growth
  • Sputtering modules
  • Multi magnetron modules - for true co-deposition
  • Evaporation molules
  • Industrail scale Glancing Angle Deposition on up to 200mm substrates (GLAD)
  • Up to 200mm substrates

Contact POLYTEKNIK AS - We understand your needs!

 Press Releases

  • Polyteknik AS introduces an advanced ebeam evaporation module for the Flextura PVD platform. The specific module is developed for production scale glancing angle deposition (GLAD) and is the first commercially available fully automated GLAD tool for cassette-to-cassette processing of 200mm wafers.

    The base transfer and loading module is the standard Flextura platform – meaning a cleanroom interface for standard cassette loading. Behind the cleanroom wall the “magic” takes place…

    It is a single wafer process module including an electrostatic chuck (ESC) with backside gas cooling and a special protection ring for the wafer edge. The chuck is placed on a moving stage that can both rotate (0-40 rpm) and tilt (0-180°) the substrate during deposition – providing you with the full package for exploring the GLAD parameters and creating the desired film properties. To increase throughput, it is equipped with a special engineered 12x60cc crucible.

    The module however also brings several benefits for more traditional ebeam evaporation processes like multilayer metallization and lift-off processes. Due to the automated handling directly from cassette it is fully compliant with strict CMOS cleanroom conditions and loading of wafers is well known to any operator. The cassette loading, a very small footprint combined with efficient backside gas cooling makes is an excellent choice also for medium volume liftoff processes.

    As an alternative to the single wafer GLAD process module we offer a batch process (5pcs 200mm wafers). Connected to the Flextura PVD Cluster is a very cost effective solution for a cassette-to-cassette evaporation process with an absolute minimum footprint.

    More Information:

    Christian Kjelde

    International Sales Manager

    Polyteknik AS

    T: +45 5183 8870

    E: ck@polyteknik.dk

    W: www.polyteknik.com

    *GLAD: Glancing angle deposition (GLAD) is a process where deposition, typically evaporation, is done under a controlled/varied angle while rotating the wafer. Depending on materials and process conditions a number of different and well-controlled nanostructures can be achieved, the structures can have zig-zig, helices, spring- or rod-like forms. This provides possibilities for creating thin film layers with very unique properties for use in especially MEMS, imaging and sensor applications.


  • Flextura PVD
    The Flextura platform is best described as Flexible Production | Flexible Processes | Flexible Investment. From a single chamber with evaporation or sputtering processes as a standalone system to an efficient cluster tool with multiple advanced processes....

  • Volume Production Applications

    • High yield production by PVD: Metallisation, TCOs, AlN, optical reflectors and absorbers.
    • Proven reliable wafer handling by Brooks MAG7 robot
    • Cassette-to-cassette, wafer slot integrity, Wafer mapping
    • Advanced high temperature PVD processing of non-standard semicon solutions
    • Multi magnetron chambers for true co-deposition
    • Automatic loading to batch fixture
    • Bottom-up or top-down processing
    • SEGS/GEM Interface option

    Special Applications

    •  Process frame for epitaxial growth of thin films at elevated temperatures up to 1000°C
    •  Glancing Angle deposition at wafers in mass production scale
    •  Dynamic in-situ feedback control by PEM or RGA in reactive sputtering
    •  HiPIMS sputtering for highly ionised deposition
    •  Electrostic chuck (ESC) with backside gas for substrate cooling or heating, RF/DC bias option.
    •  Market leading process software technology for accurate real time control of deposition.

    Process Modules:

    • High temperature deposition chamber up to 1000°C
      • Increased layer quality
      • Epitaxial growth
    • HiPIMS sputtering (highly ionised) chamber
      • High aspect ratio metallisation
      • Layer property tuning
    • Direct magnetron sputtering (DC, RF and pDC)
    • Multi-magnetron chamber (Co-sputtering)
    • Ebeam evaporation
    • RF/ICP etch, degass, cooling, alignment station
    • Single wafer or batch processing directly from cassette to casette

    Flexible investment – scalable capacity

    The Flextura PVD platform is truly almost Plug&Play and you may add process modules as your need for capacity or new processes increase. The modules function as stand alone units – see Flextura Sputter or Flextura Evaporator – which may be connected to a Flextura PVD Cluster.

    The Flextura way of thinking is giving you the possibility to let the capital investment follow increasing demands of your facility.

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