Leonardo DR : following the establishment of a business relation with Dupont, Microcontrol Electronic started developing a lamination system to apply dry film photoresist on wafers. The installation of a 200 mm tool and the strong cooperation with IZM - Fraunhofer Institute in Berlin , allows Microcontrol Electronic to show the full lithographic process to its potential customers. Many of them decided to introduce this new method to apply photoresist layers.
Leonardo DLO : new method to lift off metal with adhesive tape from wafer. Remove in only one process step all extra unnecessary metals. Microcontrol Electronic offers Leonardo 200 Dry Metal Lift Off system on the market giving the following benefits :
-this method allows the customer to choose solvent free process.
-after Leonardo 200 Dry Metal Lift Off system, if solvent is needed to remove photoresist, cleaning is 50% faster.
-solvent won't be contaminated by metal, so it could be used at least 10 more times than conventional lift off.
-easier and more environmental friendly method to recycle precious metal waster.
Leonardo BG : in the semiconductor industry, a lamination process was introduced for the first time in the early 80s, to apply a protective tape on the wafer front side, before the backgrinding operation. In 1985, thanks to a cooperation between Microcontrol Electronic and the major italian IC manufacturer , the first ever built fully automatic BG lamination system, was designed and installed in a production line. Since then, in the following 3 decades, Microcontrol Electronic installed more than 200 BG units, with the major IC makers, worldwide (most of them still in production) .
Leonardo LD : Microcontrol Electronic 3 axis robot, developed around Leonardo Series , achieves its highest flexibility in LD state of the art. LD series allows the customer to use this cluser system in continuous mode to laminate and delaminate a polymer, or layers or use it simply in separate mode being able to perform 3 different processes such as:
- photolithographic film lamination and cover sheet removal systems
- backgrinding film lamination and de-lamination systems
- dry metal lift off system
Wafer tilting on LD allows to laminate films on the backside of the wafer, for processes like Die Attach Film or the newest Conductive Die Attach Film
Fully automatic UV curing system on wafer.
Microcontrol has been manufacturing this process system since 1985 and has installed hundreds of units in some of the most important Memory manufacturer sites.
Today the system is able to handle all available wafer diameters with the same system.