Microcontrol Electronic SRL

Via Giuba 11
Milano,  I-20132

  • Booth: B1347

Come, visit, challenge us to meet your requirements!

Microcontrol Electronic (MCE) , part of EMME CI GI group,  was  founded in  1976 with the mission of supplying equipment and service in the Italian semiconductor market .  Since 1985 Microcontrol Electronic started designing , manufacturing and distributing worldwide its own range of equipment . The group is  100% privately owned. MCE  headquarter is located in Milan, with 60 employees and a  5000 square meter warehouse.  MCE facilities  are  ISO 9001 and  14001 certified   .  Today MCE installed base counts more than  500 systems installed  worldwide and is very well known for reliability and flexibility of all its equipment .  Our products  are  installed  in the  following  process areas:

- Photolithography

- Lift Off

- Backgrinding

- Multiprocess  system

- Testing


  • Leonardo series and MWE 300
    Leonardo series is offered on the market in two versions : Leonardo 200 up to 8" , Leonardo 300 for 8" and 12" : MWE system is available in 3 configurations : - table - floor - fab...

  • Leonardo DR : following the establishment of a business relation with Dupont, Microcontrol Electronic started developing a lamination system to apply dry film photoresist on wafers.  The installation of a 200 mm tool  and the strong cooperation with IZM - Fraunhofer Institute in Berlin , allows Microcontrol Electronic to show the full lithographic process to its potential customers. Many of them decided to introduce this new method to apply photoresist layers.

    Leonardo DLO : new method to lift off metal with adhesive tape from wafer. Remove in only one process step all extra unnecessary metals. Microcontrol Electronic offers Leonardo 200 Dry Metal Lift Off system on the market giving the following benefits :

    -this method allows the customer to choose solvent free process.

    -after Leonardo 200 Dry Metal Lift Off system, if solvent is needed to remove photoresist, cleaning is 50% faster.

    -solvent won't be contaminated by metal, so it could be used at least 10 more times than conventional lift off.

    -easier and more environmental friendly method to recycle precious metal waster.

    Leonardo BG : ​in the semiconductor industry, a lamination process was introduced for the first time in the early 80s, to apply a protective tape on the wafer front side, before the backgrinding operation. In 1985, thanks to a cooperation between Microcontrol Electronic and the major italian IC manufacturer , the first ever built fully automatic BG lamination system, was designed and installed in a production line. Since then, in the following 3 decades, Microcontrol Electronic installed more than 200 BG units, with the major IC makers, worldwide (most of them still in production) .

    Leonardo LD : ​Microcontrol Electronic 3 axis robot, developed around Leonardo Series , achieves its highest flexibility in LD state of the art.  LD series allows the customer to use this cluser system in continuous mode to laminate and delaminate a polymer, or layers or use it simply in separate mode being able to perform 3 different processes such as:

    - photolithographic film lamination and cover sheet removal systems

    - backgrinding film lamination and de-lamination systems

    - dry metal lift off system

    Wafer tilting on LD allows to laminate films on the backside of the wafer, for processes like Die Attach Film or the newest Conductive Die Attach Film

    MWE 300

    ​Fully automatic UV curing system on wafer.

    Microcontrol has been manufacturing this process system since 1985 and has installed  hundreds of units in some of the most important Memory manufacturer sites.

    Today the system is able to handle all available wafer diameters with the same system.

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