Panasonic Industry Europe GmbH

Robert Koch Straße 100
Ottobrunn,  85521

Germany
https://eu.industrial.panasonic.com/products/factory-automation/microelectronics
  • Booth: B1640

Panasonic Microelectronics

Plasma Dicing (8" and 12" Wafers), Dry Etching, Plasma Cleaning, Flip-chip Bonding. 

Sales office in Munich, Germany

For in-depth discussion and advice from Panasonic Smart Factory Solutions Europe on these topics, please visit our booth at SEMICON EUROPA 2019.

Categories

200 Packaging and Assembly Equipment
  • Dicing; Sawing; Scribing; Separation Equipment
  • Die Bonding; Attach Equipment
  • Die Sorter; Pick & Place; Flip Chip Placement Systems
    • 202 Other Equipment
  • Cutting; Drilling; Laser ablation; Beveling Equipment
    • 204 MEMS Equipment
  • Deep RIE etching; Dry Etching
    • 207 Process Equipment
  • Cleaning; Washing; Drying Equipment for Substrate, Fab Processing
  • Etching; Stripping; Ashing - Dry and Wet Equipment

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