Polyteknik AS

Moellegade 21
Oestervraa,  DK-9750

  • Booth: B1116

Polyteknik AS - When Thin Film Matters

Polyteknik AS is an innovative technology based company with more than twenty years in business. An excellent platform of technology, a global reference list, and highly skilled personnel makes Polyteknik AS an appreciated partner on deposition technlogy.

Our deposition systems are designed for production and R&D facilities within the semicon, MEMS and electronic industries. We supply high quality PVD systems covering DC/RF/HIPIMS sputtering, e-beam deposition, thermal evaporation, organic deposition (OLED/OPV)

FLEXTURA PVD - Bridging flexibility and robust industrial production!

  • Fully automatic standalone systems or cluster configuration
  • Proven safe and fast wafer handling - batch, single substrate or cassette-to-cassette
  • Proven 1000C high temperature substrate stage for epitaxial growth
  • Sputtering modules
  • Multi magnetron modules - for true co-deposition
  • Evaporation molules
  • Industrail scale Glancing Angle Deposition on up to 200mm substrates (GLAD)
  • Up to 200mm substrates

Contact POLYTEKNIK AS - We understand your needs!


  • Flextura PVD
    The Flextura platform is best described as Flexible Production | Flexible Processes | Flexible Investment. From a single chamber with evaporation or sputtering processes as a standalone system to an efficient cluster tool with multiple advanced processes....

  • Volume Production Applications

    • High yield production by PVD: Metallisation, TCOs, AlN, optical reflectors and absorbers.
    • Proven reliable wafer handling by Brooks MAG7 robot
    • Cassette-to-cassette, wafer slot integrity, Wafer mapping
    • Advanced high temperature PVD processing of non-standard semicon solutions
    • Multi magnetron chambers for true co-deposition
    • Automatic loading to batch fixture
    • Bottom-up or top-down processing
    • SEGS/GEM Interface option

    Special Applications

    •  Process frame for epitaxial growth of thin films at elevated temperatures up to 1000°C
    •  Glancing Angle deposition at wafers in mass production scale
    •  Dynamic in-situ feedback control by PEM or RGA in reactive sputtering
    •  HiPIMS sputtering for highly ionised deposition
    •  Electrostic chuck (ESC) with backside gas for substrate cooling or heating, RF/DC bias option.
    •  Market leading process software technology for accurate real time control of deposition.

    Process Modules:

    • High temperature deposition chamber up to 1000°C
      • Increased layer quality
      • Epitaxial growth
    • HiPIMS sputtering (highly ionised) chamber
      • High aspect ratio metallisation
      • Layer property tuning
    • Direct magnetron sputtering (DC, RF and pDC)
    • Multi-magnetron chamber (Co-sputtering)
    • Ebeam evaporation
    • RF/ICP etch, degass, cooling, alignment station
    • Single wafer or batch processing directly from cassette to casette

    Flexible investment – scalable capacity

    The Flextura PVD platform is truly almost Plug&Play and you may add process modules as your need for capacity or new processes increase. The modules function as stand alone units – see Flextura Sputter or Flextura Evaporator – which may be connected to a Flextura PVD Cluster.

    The Flextura way of thinking is giving you the possibility to let the capital investment follow increasing demands of your facility.

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