Oxford Instruments

North End Road, Yatton
Bristol,  North Somerset  BS49 4AP

United Kingdom
https://plasma.oxinst.com
  • Booth: B1135


Oxford Instruments, World Leader in Plasma Process Solutions

Oxford Instruments Plasma Technology is a leading provider of etch and deposition process solutions for nanometre-sized features, nanolayers, and the controlled growth of nanostructures.

These solutions are based on core technologies in plasma, ion beam and atomic layer deposition and etch. Products range from clustered cassette-to-cassette platforms for high-throughput production processing to compact stand-alone systems for R&D.

We provide a range of technologies:

  • Atomic Layer Deposition
  • Atomic Layer Etching
  • CVD
  • Deep Silicon Etching
  • ICP Etching
  • ICPCVD
  • Ion Beam Etching
  • Ion Beam Deposition
  • PECVD
  • Reactive Ion Etching
  • RIE-PE


 Products

  • PlasmaPro 100 Cobra
    The PlasmaPro 100 Cobra ICP utilises high-density plasma to achieve fast etching and deposition rates. The process modules offer excellent uniformity, high-throughput, high-precision and low-damage processes for wafer sizes up to 200mm. ...

  • The PlasmaPro 100 Cobra ICP utilises high-density plasma to achieve fast etching and deposition rates. The process modules offer excellent uniformity, high-throughput, high-precision and low-damage processes for wafer sizes up to 200mm. 
    Our systems have a wide install base within high volume manufacturing (HVM), with well-developed process solutions. The PlasmaPro 100 Cobra supports a number of markets including, MEMS & sensors, GaAs & InP laser optoelectronics, SiC & GaN power electronics, and RF.

    • Wide temperature range electrode, -150°C to 400°C

    • Compatible with all wafer sizes up to 200mm
    • Rapid change between wafer sizes
    • Low cost of ownership and ease of serviceability
    • Compact footprint, flexible layout
    • In-situ chamber cleaning and end-pointing

    Find out more >

  • PlasmaPro 100 PECVD
    The PECVD process modules are specifically designed to produce excellent uniformity and high rate films, with control of film properties such as refractive index, stress, electrical characteristics and wet chemical etch rate....

  • The PECVD process modules are specifically designed to produce excellent uniformity and high rate films, with control of film properties such as refractive index, stress, electrical characteristics and wet chemical etch rate.

    • High quality films, high throughput, excellent uniformity

    • Wide temperature range electrode
    • Compatible with all wafer sizes up to 200mm
    • Rapid change between wafer sizes
    • Low cost of ownership and ease of serviceability
    • Resistive heated electrodes with capability up to 400°C or 1200°C
    • In-situ chamber cleaning and end-pointing

    Find out more >

  • nSpec - automated defect inspection system
    The system has been developed to meet the requirement of applications with the difference to other systems f. e. quality control. The system uses image processing to determine defects and possible capability to separate particles and other of defects....

  • nSPEC® is a full automated, optical micro wafer inspection system for defect with imaging processing and AI.

    The microscope wafer inspection system is able to constitute and analyze substrate, epi, patterned and diced wafers. nSpec® system has multiple magnifications to fully identify the density and type of defects. Furthermore there is a setting for single image capture or scan. Wafer sizes, type of defects to be identified and scan resolution are the configurations options. nSPEC® use the highest quality optics from the market leaders in microscopy. Lightning and high-resolution camera captures the image and then analyzes it. The software is intuitive and can control all aspect of measurement, e.g. the focus, specimen movement, lightning and objective selection.


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