The PlasmaPro 100 Cobra ICP utilises high-density plasma to achieve fast etching and deposition rates. The process modules offer excellent uniformity, high-throughput, high-precision and low-damage processes for wafer sizes up to 200mm.
Our systems have a wide install base within high volume manufacturing (HVM), with well-developed process solutions. The PlasmaPro 100 Cobra supports a number of markets including, MEMS & sensors, GaAs & InP laser optoelectronics, SiC & GaN power electronics, and RF.
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