Visit SET to discover High Accuracy Flip-Chip Bonder
SET is a world leading supplier of High Accuracy Die-to-Die and Die-to-Wafer Flip-Chip Bonders. With more than 300 equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its flip-chip bonders. The SET bonders adapt to all main bonding techniques: fluxless reflow, thermo-compression, adhesive joining compression, thermosonic… SET’s newest generation of bonder, the ACCµRA100, guarantees the highest bonding accuracy (± 0.5 µm) and quality for the most demanding applications: IR imagers, 3D IC with high density TSV, MEMS and optoelectronics applications.
Visit SET Website for more information: www.set-sas