RORZE CORPORATION

1588-2 Michinoue Kannabe
Fukuyama,  Hiroshima  720-2104

Japan
http://www.rorze.com
  • Booth: B1459

RORZE CORPORATION has continued to contribute state-of-the-art technologies
in the semiconductor and the FPD (flat-panel display) industries
based on original technologies and experience for more than 30 years from our foundation.


Our handling robots and equipment with their high reliability and high-degree cleanliness,
are operating in the semiconductor and FPD manufacturing facilities all over the world today.


 Products

  • EFEM
    The high speed transferring system is realized by mounting the new type clean robot and high speed linear track axis....

  • High throughput with two aligners
    For OHT, AGV, Stocker interface (option)
    Compatible use of 200mm and 300mm works (option)

  • RR493 series
    The RR493/scara arm vacuum robot (single arm) realizes the high positioning repeatability and highly reliable vacuum partition performance by adopting DDM (vacuum direct drive motor) for the drive section....

    • Small rotation area (small footprint).
    • Long end-effector available for long reach.
    • Available for narrow gate opening size (15 mm).
    • High accuracy.
    • Available for ultrahigh vacuum.
    • High throughput.
    • Available for the AWC option (wafer position compensation).
  • RR756 series
    RR756 is a SCARA robot and all axes have stepping motors with absolute encoders. The synchronous interpolation of the arm axis and rotation axis enables 2-port access without the X-axis track....

    • Stepping servo motors with ABS encoders are mounted on all axes.
    • 2-port access without X-axis track is available.
    • Heavier hand can be equipped by increasing the arm rigidity.
    • Control of the robot X-axis track is available.
  • Sorter
    High throughput sorting is achieved by using the clean robot on which the new servo, aligner, and linear track axis are mounted. The load port can be mounted at the front, back, left, and right of the frame....

    • High speed alignment using two aligners
    • The edge clamp method prevents transferring particles onto the back surface of a wafer.
    • IDs on both surfaces of a wafer can be read.
    • Corresponding to the system on which the OHT and stocker are mounted.
    • Transferring wafers can be instructed on the touch panel to realize easy-to-understand operability.
  • PLVS
    The PLVS/vacuum platform is a clean handling system which has high positioning repeatability and highly reliable vacuum partition performance using various units of the vacuum direct drive motor drive section....

    • Suitable system configuration and smallest footprint
    • Clean transferring operation
    • Ultrahigh vacuum
    • High throughput

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