Picosun Europe GmbH

World Trade Center
Freiberger Str. 39
Dresden,  01067

Germany
http://www.picosun.com
  • Booth: B1221


AGILE ALD™ solutions for companies driven by innovation!

Picosun is the leading supplier of AGILE ALD™ (Atomic Layer Deposition) thin film coating technology for semiconductor and other industries.

PICOSUN™ ALD equipment portfolio ranges from fully automated, SEMI compliant batch and cluster systems for high volume manufacturing to smaller scale R&D and pre-pilot production tools. Production-proven coating solutions for IC, MEMS, LED, sensor, smart medical, specialty electronics and 3D component processing are mastered with world-class process quality, agile and innovative equipment design, and the most comprehensive process support and customer care.

Contact Picosun to harness the full power of ALD!


 Press Releases

  • SEMICON West, SAN FRANCISCO, CA, USA, 9th July 2019 – Picosun Group, the leading provider of AGILE ALD™ (Atomic Layer Deposition) thin film coating solutions, has launched PICOSUN™ Morpher, a new ALD product platform designed to disrupt the up to 200 mm wafer markets in Beyond and More than Moore domains.

    The PICOSUN™ Morpher ALD platform enables fast, cost-efficient, high volume production of e.g. MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility.

    “Morpher starts a completely new era in PICOSUN™ products, enabling the most advanced devices and components for IoT, 5G communications, autonomous transportation, AR and VR, to name just a few end applications,” states Dr. Jani Kivioja, CTO of Picosun Group.

    Morpher adapts to the changing needs of different business verticals, from corporate R&D to production and foundry manufacturing. Unmatched versatility in substrate materials, substrate and batch size, and the comprehensive process range make Morpher truly a transformable, all-inclusive manufacturing facility for a wide range of semiconductor industries. The SEMI certified PICOSUN™ Morpher comes with completely new software where intuitive and user-friendly HMI allows unified control of the whole cluster.

    “Morpher’s flexibility and adaptability, combined with the latest design attributes and the state-of-the-art software truly manifest our slogan ‘Agile ALD’. Together with our comprehensive consultancy, knowledge transfer and lifecycle management services we provide our customers a genuinely strategic partnership to keep them at the cutting edge of their industries,” continues Dr. Kivioja.

    Picosun provides the most advanced ALD thin film coating technology to enable the industrial leap into the future, with turn-key production solutions and unmatched expertise in the field. Today, PICOSUN™ ALD equipment are in daily manufacturing use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in Germany, North America, Singapore, Taiwan, China and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

    More information:
    Dr. Jani Kivioja
    CTO, Picosun Group
    Tel: +358 50 321 1955
    Email: info@picosun.com
    Web: www.picosun.com

  • ESPOO, Finland, 23rd April 2019 – Picosun Group, supplier of the leading AGILE ALD™ (Atomic Layer Deposition) thin film coating solutions, reports superb results in boosting micro-LED performance using ALD passivation.

    Micro-LEDs are a strong challenger to existing display technologies such as LCDs (liquid crystal displays), OLEDs (organic light-emitting diodes) or conventional LEDs (light-emitting diodes). Offering compact size, low power consumption, superior brightness and energy efficiency, greater contrast and color saturation, ultra-high resolution, flexibility and good reliability, micro-LEDs are currently actively studied and developed at the leading electronics manufacturers and R&D institutes around the world. Micro-LEDs are typically used for small screens such as those used in tablets, smartphones and smart watches, and the first large area displays have also been demonstrated already.

    Still, the micro-LED technology has certain drawbacks that hinder its full-scale commercial breakthrough. The micro-LED screen consists of minuscule pixels producing green, blue and red light. Some steps in the manufacturing process of these pixels easily cause damage to their delicate nanometer-scale structures, which leads to loss of light intensity. ALD has now been proven to effectively fix these damages, not only restoring the light intensity but actually boosting it to superior levels. At Picosun customer site, National Chiao Tung University (NCTU), Taiwan, light-emitting intensity of micro-LEDs has been enhanced by 143.7% by using ALD passivation layers deposited with PICOSUN™ ALD equipment(*).

    “We are happy to report these great results achieved in micro-LED efficiency enhancement using ALD technology. PICOSUN™ ALD equipment have been an integral part of our facilities for a long time, and we are always impressed by their performance and the superior ALD film quality obtained with them. Picosun’s customer support is also impeccable, which is very much appreciated considering we collaborate extensively with industries. Whenever we need something regarding the equipment or process consultancy, Picosun staff is always up to date and ready to provide thorough answers,” states Professor Hao-Chung Kuo from NCTU.

    “NCTU is our prestigious customer and key partner for years already. We are glad that our ALD solutions have enabled this impressive performance boost to their micro-LEDs. Micro-LED technology has immense potential to disrupt the solid state lighting market and our Asian customers, both in industries and R&D, will surely lead the forefront of this development,” continues Mr. Edwin Wu, CEO of Picosun Asia Pte. Ltd.

    Picosun provides the most advanced ALD thin film coating technology to enable the industrial leap into the future, with turn-key production solutions and unmatched expertise in the field. Today, PICOSUN™ ALD equipment are in daily manufacturing use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in Germany, North America, Singapore, Taiwan, China, and Japan, and a world-wide sales and support network. Visit www.picosun.com.

    (*) Chen et.al., Photonics Research, Vol. 7 No. 4, p. 416 (2019).

    More information:

    Mr. Edwin Wu
    CEO, Picosun Asia Pte. Ltd.
    Tel: +358 40 480 3449
    Email: xiaopeng.wu@picosun.com
    Web: www.picosun.com

  • ESPOO, Finland, 25th February 2019 – Picosun Group, a leading supplier of ALD (Atomic Layer Deposition) thin film coating solutions for global industries, has developed an excellent quality ALD yttria process for corrosion protection in harsh environments.

    Yttria, aka yttrium oxide, Y2O3, is extremely hard, dense, and mechanically strong material which has excellent chemical and erosion resistance and very high melting point. These characteristics make it ideal for protective coatings in applications where operating conditions are extreme. Some examples of these applications are various semiconductor production equipment and metal production. Y2O3 also finds uses as a high-k gate dielectric in novel microelectronics such as carbon-based components, thin film transistors, and germanium-metal-oxide semiconductors.

    Yttrium oxide coatings are typically produced with physical vapor deposition, electron beam evaporation, or sputtering methods, but ALD offers several advantages over these techniques. ALD-manufactured yttria films are intrinsically pinhole-free, extremely dense, ultra-thin, and highly uniform, and they cover conformally even the smallest nanoscale details, voids, crooks, and steps on the surface. Achieving these properties with a fraction of film thickness compared to traditional methods saves costs and materials. As the ALD process is based on spontaneous surface chemical reactions between gaseous reactants, it is gentle to the coated surface and can be applied at moderate temperatures, if needed. Cost-efficient, high throughput production of yttrium oxide coatings can be realized in Picosun’s industry-proven PICOSUN™ P-1000 and P-300B ALD equipment (*).

    “Our high volume production ALD machinery such as PICOSUN™ P-1000 and P-300B reactors has been a huge success since their launch. With this equipment we have been able to take ALD to totally new application areas in e.g. surface protection and functionalization of various mechanical components, anti-tarnish and decorative coatings for coins and watch parts, and production of biocompatible coatings for medical devices. Now, our superb quality yttria process, upscaled to production in our high volume reactors, enables revolutionary ALD solutions in industries where durable and reliable surface protection against extreme conditions is needed,” states Dr. Jani Kivioja, CTO of the Picosun Group.

    Picosun provides the most advanced ALD thin film coating technology to enable the industrial leap into the future, with turn-key production solutions and unmatched expertise in the field. Today, PICOSUN™ ALD equipment are in daily manufacturing use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in Europe, North America, Singapore, Taiwan, China, and Japan, and a world-wide sales and support network. Visit www.picosun.com.

    (*) For more detailed process data and quotations, please contact sales@picosun.com!

    More information:
    Dr. Jani Kivioja
    CTO, Picosun Group
    Tel: +358 46 922 8804
    Email: jani.kivioja@picosun.com
    Web: www.picosun.com

  • ESPOO, Finland, 14th February 2019 – Picosun Group, a leading supplier of ALD (Atomic Layer Deposition) thin film coating solutions for global industries, reports unprecedented results in high reliability electronics protection with ALD.

    Hermetic encapsulation by ALD nanolaminates developed by Picosun has been proven to block tin whisker formation on PCB (printed circuit board) assemblies completely(*). During the observation period of over one month to three years, ALD-protected samples showed no tin whisker growth at all, whereas on non-protected samples tin whisker density of over 1000 pcs/cm2 was measured. In addition to blocking tin whiskering, Picosun’s ALD nanolaminates help to protect the PCBAs against other key degradation phenomena such as various forms of corrosion and oxidation. Hermetic ALD coating works efficiently even against moisture and gaseous sulfur in polluted atmosphere. Due to its nanometer-scale thickness, the ALD film has no effect on the PCBA functionality, mass or dimensions and it allows reworking of the PCBA.

    Tin whisker formation and corrosion are particularly fatal in several high reliability electronics applications such as data centers, space, aviation, military, medical and industrial control systems. Picosun’s revolutionary ALD encapsulation method offers now safety improvement, product lifetime lengthening, and even long-term cost savings to these manufacturers. Fast, cost-efficient processing of large amounts of PCBAs can be realized in PICOSUN™ P-1000 and P-300B high volume batch ALD systems with production-proven, industry-optimized processes.

    “We are happy to announce these groundbreaking results obtained with our ALD encapsulants in protection of specialty electronics. This is a new, potentially huge market for ALD. There has already been lots of interest towards our turn-key coating solutions for large scale PCBA protection from the corresponding industries. This shows again the versatility of ALD and its power to disrupt near all fields of today’s industrial manufacturing”, says Dr. Jani Kivioja, CTO of Picosun Group.

    Picosun provides the most advanced ALD thin film coating technology to enable the industrial leap into the future, with turn-key production solutions and unmatched expertise in the field. Today, PICOSUN™ ALD equipment are in daily manufacturing use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in Europe, North America, Singapore, Taiwan, China, and Japan, and a world-wide sales and support network. Visit www.picosun.com.

    (*) Results obtained in Picosun’s collaboration project with the European Space Agency (ESA): “Evaluation of Atomic Layer Deposition (ALD) Conformal Coating to Mitigate Tin Whiskering” (4000113005/14/NL/PA), 2015-2018.

    More information:
    Dr. Jani Kivioja
    CTO, Picosun Group
    Tel: +358 46 922 8804
    Email: jani.kivioja@picosun.com
    Web: www.picosun.com

  • ESPOO, Finland, 21st December 2018 – Picosun Group, a leading, global supplier of ALD (Atomic Layer Deposition) thin film coating solutions, has developed a groundbreaking method for biocompatible encapsulation of microelectronic body implants.

    Remote sensing and therapeutics through self-powered, wirelessly operating microimplants is an emerging technology that is finding a plethora of uses throughout the medical field. Some key examples are neural stimulation and diagnostics, blood glucose, blood pressure, intraocular and intracranial pressure measurements, and even artificial eyesight. These minuscule devices are typically implanted for extended periods of time (from several months to well over ten years), so encapsulation of their sensitive electronics against the corrosive environment inside the human body is crucial. Naturally, also the body has to be protected against possible inflammatory or rejection reaction caused by the implant. Traditional encapsulation materials, mostly used for macroscopic objects such as pacemakers or Cochlear devices, include titanium metal, ceramics, and several polymers such as parylene or polyimide. However, when the implant size diminishes, and the requirements for the implant lifetime increase, novel encapsulation methods and materials are called for.

    ALD is an ideal method for reliable, hermetic encapsulation of various implantable devices, from micro-scale sensors to more macroscopic items such as hip, knee, and dental implants. Several ALD materials are intrinsically biocompatible and inert in the human body. ALD method produces ultra-high quality thin films, that cover uniformly and conformally even complex 3D-structures with nanoscale details, thus the desired effect of the coating can be achieved with much thinner material layers compared to the traditional methods. ALD coatings can be applied at relatively low temperatures, which advocates their use also on sensitive materials such as plastics and polymers.

    Picosun has now developed an ALD nanolaminate encapsulant that can potentially ensure microimplant lifetime of over 10 years in human body environment(*). The nanolaminate deposition process is readily scalable to high throughput, cost-efficient industrial production of hundreds or even thousands of implants per run in PICOSUN™ P-300B or P-1000 ultra-large batch ALD reactors.

    Conformal ALD nanolaminate

    Figure: SEM images showing conformal ALD nanolaminate on edges and corners of test Si pieces(*).

    “There is an increasing number of customers in the healthcare industries that are now looking at ALD to solve some critical issues in their products. We at Picosun have developed a whole family of production-proven, turn-key PicoMEDICAL™ solutions specifically to answer this need. The excellent results of our ALD encapsulation for biomedical microimplants prove that our technological knowhow and decades of experience in the field are now paving the way for a whole new generation of ALD-enabled healthcare solutions,” says Dr. Jani Kivioja, CTO of Picosun Group.

    Picosun provides the most advanced ALD thin film coating technology to enable the industrial leap into the future, with turn-key production solutions and unmatched expertise in the field. Today, PICOSUN™ ALD equipment are in daily manufacturing use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in Europe, North America, Singapore, Taiwan, China, and Japan, and a world-wide sales and support network. Visit www.picosun.com.

    (*) J. Jeong, F. Laiwalla, J. Lee, R. Ritasalo, M. Pudas, L. Larson, V. Leung, and A. Nurmikko: Conformal Hermetic Sealing of Wireless Microelectronic Implantable Chiplets by Multilayered Atomic Layer Deposition (ALD), Adv. Funct. Mater. 2018, 1806440. DOI: 10.1002/adfm.201806440.

    More information:

    Dr. Jani Kivioja
    CTO, Picosun Group
    Tel: +358 46 922 8804
    Email: jani.kivioja@picosun.com
    Web: www.picosun.com


 Products

  • PICOSUN™ Morpher
    The PICOSUN™ Morpher ALD platform is designed for fast, fully automatic, high throughput production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility....

  • The PICOSUN™ Morpher ALD product platform is designed to disrupt the up to 200 mm wafer industries in Beyond and More than Moore technologies. It enables fast, fully automatic, high throughput production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. Morpher adapts to the changing needs of your industry and the requirements of your customers, on all business verticals from corporate R&D to production and foundry manufacturing. The leading versatility in substrate materials, substrate and batch size, and the wide process range make Morpher truly a transformable, all-inclusive manufacturing facility to keep you spearheading your industry.

    Technical features

    Typical substrate size and type

    • 200 mm wafers in batches up to 50 pcs
    • 150 mm wafers in batches up to 50 pcs
    • 100 mm wafers in batches up to 50 pcs
    • High aspect ratio samples (up to 1:2500)
    • Substrate materials: Si, glass, quartz, SiC, GaN, GaAs, LiNbO3, LiTaO3, InP


    Processing temperature and capacity

    • 50 – 300°C
    • Up to 1000 wafers / 24 hours @ 15 nm Al2O3 thickness


    Typical processes

    • Batch processes available with cycle times down to single digit seconds
    • Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, and metals
    • Down to <1% 1σ non-uniformity in a batch (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)


    Substrate loading

    • Fully automatic loading with vacuum cluster tool combined with vertical flip function
    • Cassette to cassette batch loading through Picoplatform™ 200 vacuum cluster system
    • Optional SMIF station


    Key software features

    • Independent recipe editor enabling recipe creation and modification during process runs, with dynamic structure (scalable format for each recipe)
    • Unified interface to control the whole cluster with one communication protocol (Ethercat)
    • Fixed loop control cycle with 1/20 millisecond data logging rate, capable of multi-tasking
    • Datalogger accessible remotely, all data fully exportable
    • SECS/GEM integration to factory host


    Precursors

    • Liquid, solid, gas, ozone
    • Level sensors, cleaning and refill service
    • Up to 12 sources with 6 separate inlets


    The PICOSUN™ Morpher is designed for fully automated handling of wafer batches in combination of industry standard single wafer vacuum cluster platforms. Revolutionary, patented wafer batch flipping mechanism enables integration of the system with semiconductor manufacturing lines where most of the processing takes place in horizontal geometry, and the SEMI S2/S8 certification ensures that the system is compatible with the strictest standards of the industry.

    The PICOSUN™ Morpher ALD system can be integrated to factory automation via SECS/GEM protocol and the state-of-the-art software offers easy, safe and fail-proof operation of the system through intuitive and streamlined graphical user interface. With our patented dual-chamber, hot-wall reactor design with fully separated precursor conduits and inlets, we create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The compact, ergonomic design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market.

  • PICOSUN™ P-1000
    The PICOSUN™ P-1000 ALD system is designed for batch coating of various 3D items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants....

  • Technical Features

    Typical substrate size and type

    • All kinds of 3-dimensional items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL™ solutions)


    Processing temperature

    • 50 – 400°C


    Typical processes

    • Al2O3, ZnO, TiO2


    Substrate loading

    • Manual loading with loading accessory (e.g. forklift cart)


    Precursors

    • Liquid, solid, gas, ozone
    • Level sensors, cleaning and refill service
    • Up to 10 sources with 6 separate inlets


    The PICOSUN™ P-1000 ALD system is designed for batch processing of various 3-dimensional items such as mechanical machinery parts, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL™ solutions) in a production environment. The main applications include various passivation and barrier layers to significantly improve the performance and lifetime of the coated items. The PICOSUN™ P-1000 ALD system offers innovative and agile design to enable the highest quality ALD depositions with excellent uniformity, maximum yields, minimum system downtime and low cost-of-ownership with production-proven processes.

    The reliable, fast, and easy to maintain PICOSUN™ P-1000 ALD system represents the cutting-edge of industrial ALD.

  • PICOSUN™ P-300BV
    The PICOSUN™ P-300BV ALD system is specially designed for production of LEDs, discrete devices, and MEMS devices such as print heads, sensors, and microphones....

  • Technical Features

    Typical substrate size and type

    • 200 mm wafers in batches of 25 pcs (standard pitch)
    • 150 mm wafers in batches of 50 pcs (standard pitch)
    • 100 mm wafers in batches of 75 pcs (standard pitch)
    • Non-wafer substrates (tailored holders)
    • High aspect ratio samples (up to 1:2500)


    Processing temperature

    • 50 – 450°C


    Typical processes

    • Batch processes available with cycle times down to single digit seconds
    • Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, AlN, TiN, and metals
    • Down to <1% 1σ non-uniformity in a batch (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)


    Substrate loading

    • Semi-automatic loading with vertical loaders (one or two loaders)
    • Optional heating for load lock


    Precursors

    • Liquid, solid, gas, ozone
    • Level sensors, cleaning and refill service
    • Up to 8 sources with 4 separate inlets


    The PICOSUN™ P-300 ALD systems have become the new standard in high volume ALD manufacturing. By integrating our patented hot-wall design with fully separated inlets, we can create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The agile design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. Our proprietary Picoflow™ diffusion enhancer technology enables highly conformal coatings on ultra-high aspect ratio substrates with production-proven processes.

    The PICOSUN™ P-300BV ALD system represents the cutting-edge of industrial ALD. The system is designed for semi-automated handling of wafer batches. The tool is optimized for fast batch production and it can be integrated to factory automation via SECS/GEM option. Vacuum loading system with heating option enables clean processing of sensitive substrates and deposition of materials such as metal nitrides.

    The PICOSUN™ P-300BV is the ALD system of choice for innovation driven industries.

  • PICOSUN™ P-300B
    The PICOSUN™ P-300B ALD system is specially designed for production of MEMS devices and coating of 3D items such as machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants....

  • Technical Features

    Typical substrate size and type

    • 200 mm wafers in batches of 25 pcs (standard pitch)
    • 150 mm wafers in batches of 50 pcs (standard pitch)
    • 100 mm wafers in batches of 75 pcs (standard pitch)
    • All kinds of 3-dimensional items such as mechanical machinery parts, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL™ solutions)
    • High aspect ratio samples (up to 1:2500)


    Processing temperature

    • 50 – 500°C


    Typical processes

    • Batch processes available with cycle times down to single digit seconds
    • Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, AlN, TiN, and metals
    • Down to <1% 1σ non-uniformity in a batch (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)


    Substrate loading

    • Manual loading with a pneumatic lift
    • Linear semi-automatic loading
    • Industrial robot loading


    Precursors

    • Liquid, solid, gas, ozone
    • Level sensors, cleaning and refill service
    • Up to 8 sources with 4 separate inlets


    The PICOSUN™ P-300 ALD systems have become the new standard in high volume ALD manufacturing. By integrating our patented hot-wall design with fully separated inlets, we can create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The agile design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. Our proprietary Picoflow™ diffusion enhancer technology enables highly conformal coatings on ultra-high aspect ratio substrates with production-proven processes.

    The PICOSUN™ P-300B ALD system is specially designed for batch processing in MEMS and 3-dimensional component production, such as coating of mechanical machinery parts, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL™ solutions). The system is fast, highly reliable and extremely easy to maintain.

    Customer Testimonials

    “Our PICOSUN™ ALD system has been providing stable and reliable processing for implant surface coating already for a number of years, creating a competitive advantage for our products in the medical implant market. We do recommend PICOSUN™ ALD technology for all of the industries where surface modification on microscale plays a key role in the product development.”
    Mr. Evgeniy Kozlov, Executive Director of CONMET LLC

    “We would wholeheartedly recommend PICOSUN to anyone looking for a fully developed and extremely reliable system regarding ALD technology, no matter what the area of application.”
    Mr. Alfred Gnadenberger and Dr. Lukas Lauter, Austrian Mint

  • PICOSUN™ P-300S
    The PICOSUN™ P-300B ALD system is specially designed for production of MEMS devices and coating of 3D items such as machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants....

  • Technical Features

    Typical substrate size and type

    • Max. 300 mm single wafers
    • High aspect ratio samples (up to 1:2500)


    Processing temperature

    • 50 – 500°C


    Typical processes

    • Single wafer processes available with cycle times down to single digit seconds
    • Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, AlN, TiN, and metals
    • Down to <1% 1σ non-uniformity (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)


    Substrate loading

    • Load lock with magnetic manipulator arm
    • Automatic loading available through Picoplatform™ 200 or Picoplatform™ 300 vacuum cluster system
    • Cassette-to-cassette and FOUP loading available with cluster systems
    • N2 cabinet loading


    Precursors

    • Liquid, solid, gas, ozone, plasma
    • Level sensors, cleaning and refill service
    • Up to 12 sources with 6 separate inlets


    The PICOSUN™ P-300 ALD systems have become the new standard in high volume ALD manufacturing. By integrating our patented hot-wall design with fully separated inlets, we can create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The agile design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. Our proprietary Picoflow™ diffusion enhancer technology enables highly conformal coatings on ultra-high aspect ratio substrates with production-proven processes.

    The PICOSUN™ P-300S ALD system represents the cutting-edge of industrial ALD. The system is designed for fully automated handling of single wafers in combination with industry standard vacuum cluster platforms. The SEMI S2/S8 certified P-300S ALD systems can be integrated to factory automation via SECS/GEM option and they fulfill the most stringent cleanliness requirements of the semiconductor industry.

    The PICOSUN™ P-300S is the ALD system of choice for innovation driven industries in IC.

  • PICOSUN™ R-200 Advanced
    The PICOSUN™ R-200 Advanced ALD systems are suitable for R&D on dozens of applications such as IC components, MEMS devices, displays, LEDs, lasers, and 3D objects such as lenses, optics, jewelry, coins, and medical implants....

  • Technical Features

    Typical substrate size and type

    • 50-200 mm single wafers
    • 156 mm x 156 mm solar Si wafers
    • 3D objects
    • Powders and particles
    • Mini-batch
    • Porous, through-porous, and high aspect ratio (up to 1:2500)


    Processing temperature

    • 50 – 500°C, plasma 450°C (650 °C with heated chuck on request)


    Typical processes

    • Al2O3, TiO2, SiO2, Ta2O5, HfO2, ZnO, ZrO2, AlN, TiN, metals such as Pt or Ir


    Substrate loading

    • Manual loading with a pneumatic lift
    • Load lock with magnetic manipulator arm
    • Semi-automatic loading with handling robot
    • Cassette-to-cassette loading with cluster tools


    Precursors

    • Liquid, solid, gas, ozone, plasma
    • Up to 12 sources with 6 separate inlets (7 if the plasma option is chosen)


    Options

    • Cluster tools, Picoflow™ diffusion enhancer, roll-to-roll chamber, RGA, UHV compatibility, N2 generator, gas scrubber, customized designs, glove box integration for inert loading


    The PICOSUN™ R-200 Advanced ALD system is the global market leader in advanced ALD research tools with hundreds of customer installations. It has become the tool of choice both for companies and research institutes driven by innovation.

    The agile design enables the highest quality ALD film depositions together with the ultimate system flexibility to fit future needs and applications. The patented hot-wall design with fully separate inlets and instrumentation enables particle-free processing adaptable on a wide range of materials on wafers, 3D objects, and all nanoscale features. Excellent uniformity even on the most challenging through-porous, ultra-high aspect ratio, and nanoparticle samples is achieved thanks to our proprietary Picoflow™ technology. The PICOSUN™ R-200 Advanced systems are equipped with highly functional and easily exchangeable precursor sources for liquid, gaseous, and solid chemicals. Highly efficient and patented remote plasma option enables deposition of metals without the risk of short-circuiting or plasma damage. Integration with glove boxes, UHV systems, manual and automated loaders, cluster tools, powder chambers, roll-to-roll chambers, and various in situ analytics systems enable efficient and flexible research with good results no matter what your research area is now or might become later on.


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