Meyer Burger Technology AG

Schorenstrasse 39
Gwatt (Thun), 
  • Booth: B1712

High-end Solutions for high-tech industries

Meyer Burger is a global leading technology company specializing on innovative systems and processes based on semiconductor technologies.

The company’s focus is on photovoltaics (solar industry) while its competencies and technologies also cover important areas of the semiconductor and the optoelectronic industries as well as other selected high-end markets based on semiconductor materials.

The company’s comprehensive product portfolio is complemented by a worldwide service network with spare parts, consumables, process know-how, customer support, after-sales services, training and other services.

Meyer Burger is represented in Europe, Asia and North America in the respective key markets and has subsidiaries and own service centers in China, Germany, India, Japan, Korea, Malaysia, the Netherlands, Switzerland, Singapore, Taiwan and the USA. The company is also working intensively to develop new markets such as South America, Africa and the Arab region.

The registered shares of Meyer Burger Technology Ltd are listed on the SIX Swiss Exchange.


  • PiXDRO LP50 Inkjet printer
    Advanced desktop R&D inkjet printer Versatile printer for a large variety of processes Robust and accurate motion system Choice of easy exchangeable printheads Direct roadmap to mass production...

  • PiXDRO LP50 Inkjet Printer Extensive Features and Options

    The PiXDRO LP50 is a desktop R&D inkjet printer for functional printing applications. It is designed for research and development of inkjet processes and applications, as well as evaluation and development of inkjet materials. The LP50 platform is an open, accurate, flexible, and easy to use system that will allow you to work at the frontiers of inkjet printing technology. The LP50 is designed for a wide range of applications such as semiconductor packaging, PCB, printed electronics, photo voltaic, display, and bio-medical.

    Extensive Features and Options

    • Flexible, robust and accurate R&D inkjet printer

    • Development of a wide range of processes and applications

    • Choice of industrial and disposable printheads

    • Advanced test software packages for fast and effective process optimization

    • Integrated vision systems for alignment and print view

    • Recirculating ink supply for nanoparticle inks

    • Standard printhead maintenance stations

    • Substrate chuck heating and cooling

    • Integrated UV curing

    • Single and dual printheads

    • Glovebox integration

    • Various other options and accessories

  • PiXDRO JETx Inkjet printer
    Mass production inkjet printer for electronics manufacturing Configurable design for various applications Accurate motion systems Low cost of ownership High productivity...

  • PiXDRO JETx Inkjet Printer

    The PiXDRO JETx mass production inkjet printer is Meyer Burger’s most advanced platform for printing functional materials. It has a modular architecture and can be configured for a wide range of applications such as printed electronics, photo voltaic, PCB solder masking, semiconductor packaging and chemical machining. The JETx is designed for 24/7 fully automated production, and is typically configured for processing large volumes of customer specific products. The JETx systems have a granite base for superior stability and extremely high stage accuracy and printing precision, combined with high throughput and lowest cost of ownership. It is based on three standard platforms, the JETx-P, -S, and -M, each system targeting specific application areas and product sizes.


    Applications: Masking layers for solar wafers

    Throughput: 1200/2400/4500 wafers/hour

    Feature size: Down to 20 μm

    Wafer breakage: < 0.01%


    Applications: Dielectric, conductive, adhesive, masking resist for semiconductor back-end and packaging

    Throughput: Up to 120 substrates/hour

    Feature size: Down to 40 μm

    Layer thickness: 0.5 – 100 μm


    Applications: Solder mask for PCB, etching mask on panels, encapsulation layers

    Throughput: Up to 80 sides/hour

    Feature size: Down to 75/75 μm Line/Space

    Layer thickness: 5 – 100 μm

    Tx-S 300x400 mm


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