SET CORPORATION SA

131 Impasse Barteudet
Saint Jeoire,  F-74490

France
http://www.set-sas.fr
  • Booth: B1112


Visit booth #B1.112 to discover SET Flip-Chip Bonders!

Founded in 1975, based in France, SET is a world leading supplier of High Accuracy Flip-Chip Bonders (chip-to-chip and chip-to-wafer) and versatile Nanoimprint Lithography (NIL) solutions.

With more than 340 equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its flip-chip bonders.

Ranging from manual loading to fully automated version, the SET bonders adapt to all main bonding techniques: fluxless reflow, thermo-compression, adhesive joining compression, thermosonic…

SET offers a comprehensive product portfolio of flip-chip bonders for fast growing markets and serving clients through a global network of representatives (DKSH in Taiwan) and in-depth customer trainings.

Visit SET website for more information: www.set-sas.f


 Products

  • ACCμRA M
    The ACCμRA M is a manual flip-chip bonder designed for ± 3 μm post-bonding accuracy....

  • The ACCμRA M permits to align manually the components with a high level of precision.

    More than a pick-and-place system, it offers thermocompression and reflow capabilities.

    It is the perfect equipment for universities and R&D institutes.

  • ACCµRA 100
    The ACCµRA 100 is a semi-automatic flip-chip bonder designed for ± 0.5 µm post-bonding accuracy....

  • Its flexibility makes it ideal for developing a wide range of applications.

    The ACCµRA 100 combines high precision, accessibility and cost-effectiveness.

    It is the perfect equipment for universities and R&D institutes.

  • ACCµRA OPTO
    The ACCμRA OPTO is a flip-chip bonder designed for ± 0.5 μm post-bonding accuracy....

  • The ACCμRA OPTO is dedicated for low force and reflow processes.                 

    Motorized axes guarantee a high repeatability of your process.

    The ACCμRA OPTO combines high precision, flexibility and accessibility.

    It is the perfect equipment for optoelectronics and silicon photonics applications.

  • ACCµRA Plus
    The ACCμRA Plus is a flip-chip bonder designed for ± 0.5 μm post-bonding accuracy in full automatic mode....

  • The ACCμRA Plus is suitable for reflow and thermocompression processes

    It combines high precision, flexibility and short cycle time.              

    It is dedicated for production in the fields of Optoelectronic and Silicon photonics applications.

  • FC family
    The FC150 and the FC300 are very accurate flip-chip bonders dedicated for R&D and pilot line oriented....

  • The FC150 is a high accuracy and versatile flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform. 

    It allows ± 1 µm post-bonding accuracy.

    Perfect for advanced R&D, the FC150 is also adapted to pilot production thanks to its full automatization.


    The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications.

    It allows ± 0.5 µm post-bonding accuracy.

    The FC300 covers a large range of bonding forces, from 1 to 4000 N. That makes it perfectly suitable for reflow and thermocompression processes.

  • NEW PRODUCT - NEO HB
    The NEO HB is an automatic flip-chip bonder dedicated for production. It allows ± 1 μm @ 3σ post-bonding accuracy....

  • The NEO HB is a flip-chip bonder designed for ±1 μm @ 3σ post-bonding accuracy in stand-alone or full automatic mode (EFEM).

    It is suitable for hybrid / direct bonding processes.

    The NEO HB combines high precision, flexibility and short cycle time.                                           

    It is dedicated for production.


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