Pall GmbH

Philipp-Reis Strasse 6
Dreieich,  D-63303

Germany
http://www.pall.com
  • Booth: B1217


Welcome to Semicon Europa 2019! Please stop by Booth B1/217!

Pall Microelectronics is the global leader in filtration, separation and purification technologies for the microelectronics and photovoltaic industries. It supports the semiconductor, data storage, fiber optic, advance display, ink jet and materials markets with a comprehensive suite of contamination control solutions for chemical, gas, water, chemical mechanical polishing (CMP) and photolithography processes. The company headquarter is in Port Washington, New York, with extensive operations throughout the world.

Stop by our booth to learn about our latest technologies for 7 nm processing and beyond!  


 Products

  • 2 nm XpressKleen™ Advanced 2 nm Filtration
    A key addition to Pall’s wet cleans filter line-up is the new 2 nm XpressKleen™ filter and all PFA disposable assemblies. The new 2 nm XpressKleen filter is designed to meet the growing defectivity challenges of sub-7 nm critical chemical processing....

  • The new 2 nm XpressKleen filter is designed to meet the growing defectivity challenges of
    sub-7 nm critical chemical processing.  It demonstrates finer retention, much faster flow, and higher purity than previous filters.  Retention is validated using Pall’s gold nanoparticle challenge test and customer on wafer defect trials.

    “The 2 nm XpressKleen filter leverages Pall’s proprietary ‘XP’ cleaning process that reduces trace metal contamination by 50% to less than 500 parts per trillion (ppt) total for thirty critical metal ions for a ten-inch device,” said Shangaza Dasent, Senior Vice President of Pall Microelectronics.  “The ‘XP’ cleaning process also removes organics, surface particles, and anions.  Pall is proud to bring these important purity and retention capabilities to the market to enable the semiconductor scaling cadence.”  

  • IonKleen™ IPA Purifier
    The IonKleen IPA purifier is an all fluoropolymer filter and purifier designed for the removal of metals and particles > 2 nm from IPA up to 80oC in high purity cleaning application in leading edge semiconductor manufacturing....

  • The IonKleen™ IPA Purifier has been specifically designed for the removal of particles and metal ions from IPA at temperatures from ambient to 80oC.

    The purifier uses a pure PTFE substrate with a patented and proprietary surface modification that incorporates ion exchange groups that spontaneously and immediately remove metal ions from IPA and other solvents.

    A 2nd layer of XpressKleen™ PTFE membrane provides particle removal down to 2 nm and above.

    The dual function media combination is assembled in a high area design to maximize metal removal efficiency (MRE) and extended ion exchange capacity (IEC), while minimizing pressure drop. This makes the purifier suitability for both point of use and recirculation applications.

  • New Microza OLT hot water sanitized UF Modules
    Pall introduces the new hot water sanitization packaging process known from the 4KD/2 nm Microza OAT modules now also for the Microza OLT module series....

  • New Microza1 OLT hot water sanitized UF Modules – Pall introduces the new hot water sanitization packaging process known from the 4KD/2 nm Microza OAT modules now also for the Microza OLT module series. The advantages are lower extractables due to hot water elution resulting in a rapid TOC rinse up by maintaining a 6 months on shelf life.

    1Microza is a trademark of Asahi Kasei Corporation

  • XPR3 Sub 1 nm PE-Kleen Filter
    The new filter, rated as sub 1 nm, is constructed of ultra-high purity, high density polyethylene (HDPE) media and high-density polyethylene (HDPE) hardware materials....

  • The new filter rated as sub 1 nm is constructed of ultra-high purity, high density polyethylene (HDPE) media and high-density polyethylene (HDPE) hardware materials. HDPE is a high-performance material known for its superior hard particle removal, making it ideal for most chemicals used in the advanced lithography processes including leading edge EUV resist materials.  It offers a significant improvement in cleanliness and particle removal over traditional lithographic filter materials. 

    “Pall’s lithography filters are known for superior defect reduction capability,” said Michael Mesawich, Vice President of Pall’s Global Product Planning Group. “The new sub -1 nm PE-Kleen filter is an additional tool for advanced lithographers to use in their defectivity reduction strategies.”

    The new sub 1 nm PE-Kleen filter undergoes Pall’s Xpress cleaning process, which results in superior metal, organic and particulate cleanliness, specifically designed for the most advanced patterning chemistries. The combination of the finest removal rating and the Xpress cleaning results in a superior defect reducing filter combination. 

    To learn more about the new PE-Kleen filter and other Pall Microelectronics technology solutions, please visit http://www.pall.com
  • Profile® III Filter
    The next generation of Pall CMP depth filters. Available in 0.3 and 1.0 um grades, the Profile® III is designed to replace traditional depth filters while further reducing slurry LPC’s, improving cost of ownership and increasing overall throughput....

  • The Profile® III filter series incorporates Pall’s proprietary continuous gradient pore structure technology.  The Profile III technology was optimized and specifically designed for fine slurry applications.   The design allows customers to move to finer rated filters to reduce LPC’s and scratch defects while maintaining excellent flowrate and lifetime characteristics.  The design also allows for extending filter life over traditional similarly rated depth filters.


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