SETNA

343 Meadow Fox Lane
Chester,  NH  03036

United States
http://www.set-na.com/
  • Booth: B1655


Talk to us about your surface preparation needs, we can help

SETNA is the exclusive representative for SET Corporation in North America, and the manufacturing, sales and service organization for Ontos Atmospheric Plasma systems.

Ontos Atmospheric Plasma systems are designed specifically for the Semiconductor Manufacturing and Packaging Industry.  Ontos performs downstream plasma modification of surfaces without the need for a vacuum system.  Because Ontos operates in room ambient conditions, rapid and continuous surface preparation is achieved.  Examples of Ontos applications include:

  1. Removal of oxides and organics prior to chip or wafer bonding;
  2. Descum of photoresist with simultaneous surface activation for ultra-wetting;
  3. Surface preparation/activation for direct bonding (metals, dielectrics, semiconductors); 
  4. Surface preparation/activation for adhesive bonding;
  5. Adhesion promotion prior to thin-film deposition;
  6. Trace contamination removal after wafer cleanups;
  7. Photomask cleaning (including EUVL);
  8. Preparation for Copper plating;
  9. Preparation of pristine semiconductor surfaces prior to MBE or MOCVD.

SETNA operates demonstration facilities in Ventura, California. In Europe, IZM welcomes demos after authorization.


 Products

  • Ontos Atmospheric Plasma
    Semi-automatic Atmospheric Plasma System for surface preparation. It provides a simple, effective, clean surface modification method without ion bombardment and without the cross-contamination issues often associated with conventional plasma systems....

  • Atmospheric Plasma System for Surface Preparation

    A rapid atmospheric process which reduces native oxidation and organic contamination.

    Passivation of the surface against re-oxidation can also be performed – this process creates a few monolayers of modified surface that resist reaction and diffusion of oxygen – and yet is thin enough that it does not interfere with subsequent processes.

    Ontos provides a simple, effective, clean surface modification method which does not require the throughput- robbing vacuum chamber associated with traditional plasma systems. Additionally, Ontos7 performs this surface modification without ion bombardment and without the cross-contamination issues often associated with conventional plasma systems.

    Ontos is capable of handling both reducing or oxidizing chemistries.

    Ontos performs these surface modification processes with only activated benign gasses (no halogens, no flammables, no toxics) in a low-energy atmospheric environment.


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