Picosun Europe GmbH

World Trade Center
Freiberger Str. 39
Dresden,  01067

Germany
http://www.picosun.com
  • Booth: B1221


AGILE ALD® solutions for companies driven by innovation!

Picosun is the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology for semiconductor and other industries.

Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself well over four decades ago.

PICOSUN® product portfolio ranges from fully automated, SEMI compatible 300 mm industrial ALD systems to smaller scale research and pre-pilot production tools, with special dedication to cost-efficient, turn-key production solutions for up to 200 mm wafer markets. Picosun offers you the best-in-class thin film technology for conventional IC, compound and power semiconductors, LEDs, MEMS, sensors, and 3D components such as medical devices, machinery parts, coins, watches and jewelry, with the leading process quality, agile and innovative equipment design, and the most comprehensive after-sales support and services.

Contact Picosun to harness the full power of ALD!


 Press Releases

  • ESPOO, Finland, 30th March 2020 – Picosun Group reports excellent results in development of state-of-the-art photonics with its ALD (Atomic Layer Deposition) equipment and solutions.

    Photonic devices such as waveguide amplifiers and lasers are central components in optical data transmission, a key technology realizing our modern, connected, information-driven society.

    Silicon-integrated photonics take the technology one step further, enabling a whole new generation of microelectronics where optical solutions overcome some of the key challenges of conventional technologies.

    Erbium-doped waveguide amplifiers and lasers are the most potential candidates for signal generation and amplification for telecommunication wavelengths. To reach the maximum performance of these devices, the amount and spatial distribution of dopant erbium atoms in the host material must be carefully optimized and controlled. This is where ALD shows its unique strength and beauty.

    At Aalto University, Finland, Picosun’s customer Prof. Zhipei Sun’s group at the Finnish national infrastructure Micronova, and his international collaborators, have now used Picosun’s ALD technology to manufacture erbium-based silicon-integrated waveguide amplifiers with world-record performance(*).

    “Silicon-integrated photonics, already employed by the leading companies in the field, are the future of microelectronics. We are very pleased of the performance of our PICOSUN® ALD equipment and the excellent quality of the Er:Al2O3 waveguide amplifiers manufactured with it. Customer support and consultancy from Picosun have always been there when we need it. ALD process is CMOS-compatible, further facilitating the integration of our waveguides into commercial chip production,” states Dr. John Rönn, the leading author of the results, from the Department of Electronics and Nanoengineering at Aalto University.

    ”ALD has been enabling disruptive future technologies since its invention. Picosun is happy to work with the leading experts in the field, such as our esteemed customers at the Aalto University. Our ALD solutions provide them the means to realize their groundbreaking work to develop yet more advanced communications and data transmission technologies for more connected, open, and integrated global society,” continues Mr. Edwin Wu, CEO of Picosun Asia Pte. Ltd

    (*) The results were published in the journals ACS Photonics 3, 2040-2048 (2016) and Nature Communications 10, 432 (2019).

    Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, North America, Singapore, Taiwan, China, Korea, and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

    More information:

    Mr. Edwin Wu
    CEO, Picosun Asia Pte. Ltd.
    Tel: +358 50 321 1955
    Email: info@picosun.com
    Web: www.picosun.com

    Dr. John Rönn
    Department of Electronics and Nanoengineering
    Aalto University, Espoo, Finland
    Tel: +358 50 354 9262
    Email: john.ronn@aalto.fi
    Web: www.aalto.fi/en/department-of-electronics-and-nanoengineering/photonics

  • ESPOO, Finland, 29th April 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, reports several significant new sales to photonics applications.

    Like all other globally operating export companies, Picosun has also been affected by the COVID-19 pandemic. However, ALD is still going strong as new fields of industry keep discovering its potential all the time. Photonics is one example of these fields where Picosun’s ALD solutions enable a plethora of novel applications.

    “Picosun’s global team is now concentrating all efforts to provide the leading edge ALD solutions and services to our customers. At these challenging times, many industries are struggling. The importance of future-enabling technologies such as ALD gets especially highlighted now. A global digital leap is happening and all businesses are investing in remote working, video conferencing and other digital operations. This requires fast network connections and large, real-time data transfer. Photonics can offer a next generation solution to these challenges,” says Mr. Jussi Rautee, CEO of Picosun Group.

    Photonics has rapidly become a key market for Picosun. Several significant industrial sales, both from new and returning customers, have been closed, where end applications relate to production of optoelectronics, displays, signal processing and sensing, lighting, and virtual or augmented reality devices.

    “Photonics is a wide umbrella covering several key enabling technologies of today, from optical data transmission and optical integrated circuits to medical applications and even quantum computing. We at Picosun are happy to deliver our ALD solutions to the frontrunning companies in this field to keep their businesses thriving. Novel, advanced means of communication and data sharing will help our global community not only during these times of crisis but in the future as well, as the now happening paradigm shift in the ways of working will have a far-reaching and profound impact on our lives,” continues Rautee.

    Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, North America, Singapore, Taiwan, China, Korea and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

    More information:
    Mr. Jussi Rautee
    CEO, Picosun Group
    Tel. +358 50 345 4457
    Email: info@picosun.com
    Web: www.picosun.com

  • ESPOO, Finland, 11th May 2020 – Picosun Group, provider of the leading AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries, and A*STAR’s Institute of Microelectronics (IME), Singapore, strengthen their collaboration in next generation memory technologies.

    In collaboration with IME, Picosun provided the ALD solutions and consultancy needed in the development work of new FeRAM (ferroelectric random-access memory) and ReRAM (resistive random-access memory) technologies. This strengthens the long collaboration between these two parties and opens up new possibilities in upscaling and industrialization of the technology, with Picosun’s advanced ALD technology developed for 12” wafer processing.

    FeRAM and ReRAM are emerging memories whose potential benefits over the existing technologies are their non-volatility, simple structure, and lower power usage. However, this far their relatively higher production costs and reliability issues have been the main hindrances to their large-scale breakthrough.

    ALD is an ideal method to manufacture ultra-thin and high-density material structures with unmatched quality, purity, structural integrity, and atomic level tailored composition. These attributes have great potential to solve the challenges in FeRAM and ReRAM manufacturing, and can lower the manufacturing costs for the same memory capacity. ALD’s mature position in semiconductor industries supports its implementation in novel memory chip production as well.

    “IME continues to spearhead the development of novel and advanced microelectronics technologies. We look forward to continuing our on-going partnership with Picosun in developing state-of-the-art FeRAM and ReRAM solutions to an emerging market, and benefit industry partners in the local ecosystem,” says Professor Dim-Lee Kwong, Executive Director of IME.

    “We are glad to work together with IME in the fascinating field of novel memory technologies. Singapore is one of our key hubs in Asia and IME our esteemed customer for years. This collaboration will create new innovations and practises in modern memory chip manufacturing and sharpen our competitive edge in the business,” says Mr. Jussi Rautee, CEO of Picosun Group.

    Picosun provides the most advanced ALD thin film coating technology to enable the industrial leap into the future, with turn-key production solutions and unmatched expertise in the field. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in Germany, North America, Singapore, Taiwan, China, Korea, and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

    More information:

    Mr. Juhana Kostamo
    Deputy CEO, Picosun Group
    Tel: +358 50 3699 565
    Email: juhana.kostamo@picosun.com

    Mr. Edwin Wu
    CEO, Picosun Asia Pte. Ltd.
    Tel: +358 40 480 3449
    Email: xiaopeng.wu@picosun.com

  • ESPOO, Finland, 26th May 2020 – Picosun Group, the leading supplier of AGILE ALD® (Atomic Layer Deposition) thin film coating technology for global industries, reports strong growth during fiscal year 2018-2019, as a result of Group’s strategy to focus on industrial customers. The growth has continued in the first quarter of 2020.

    During the fiscal year 1st October 2018 – 31st December 2019, Picosun Group’s order intake was 35,9 M€ and turnover 34,2 M€. EBIT was 377 k€. The growth from the previous corresponding 15 months period was +18,4 % in order intake, and +5,5 % in turnover.

    Picosun invested over 19 % of the turnover in R&D activities during the last fiscal year. The main R&D activities related to new product developments in line with the new Group strategy. During the period Picosun Group launched many improvements to existing products and services. The most important product launch was PICOSUN® Morpher ALD production platform for e.g. MEMS, LED, 5G and power electronics markets, which was launched in July 2019 with positive response from the customers.

    Picosun Group has continued its strong growth in the first quarter of 2020, resulting in 10,7 M€ order intake, growth of +64,1% compared to Q1/2019. Turnover grew +36,3 % in the same period. EBIT was 1,2 M€. Despite uncertainty caused by the ongoing coronavirus pandemic Picosun Group expects the growth to continue in the fiscal year 2020, compared to the corresponding period in 2019.

    Picosun held its Annual General Meeting on 26th May 2020. Mr. Kustaa Poutiainen continues as the Chairman of the Board. Other Board members nominated by the Annual General Meeting are Dr. Tuomo Suntola, Mr. Juha Mikkola and Mr. Hannu Turunen.

    “Despite of the challenges caused by the global COVID-19 pandemic, Picosun’s business is continuing strong. Our strategy implementation continues well and has led to positive growth especially in new product sales in the first quarter of this year. We have also hired new personnel and hiring will continue when the corona situation eases off. To support our growth, we are planning to accelerate our investments in product and business development as well as in our facilities and factories. Picosun’s success is made of the hard work, dedication and team spirit of our personnel with unmatched expertise in ALD and solid commitment to our customers,” states Mr. Jussi Rautee, CEO of Picosun Group.

    Picosun provides the most advanced ALD thin film coating technology to enable the industrial leap into the future, with turn-key production solutions and unmatched expertise in the field. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous major industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea, and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

    More information:
    Mr. Kustaa Poutiainen               
    Chairman of the Board, Picosun Group
    Tel: +358 400 424 506
    Email: kustaa.poutiainen@picosun.com

    Mr. Jussi Rautee
    CEO, Picosun Group
    Tel: +358 50 345 4457
    Email: jussi.rautee@picosun.com

  • ESPOO, Finland, 29th June 2020 – Picosun Group reports excellent results in ALD-organic bilayer encapsulation of metal electrodes for neuroprosthetics and bioelectronic medicine. Group also reports superior hermetic barrier performance of its ALD nanolaminates against corrosive ion diffusion in aqueous media. This is an important result for medical ALD applications and implantology, where metal components and sensitive microelectronics need to be protected against corrosion caused by human body fluids.

    Picosun’s ALD nanolaminates were proven to completely block the diffusion of Na+, K+, Cl and PO43- ions, which are known to be amongst the most corrosive ionic species in aqueous media [1]. Tests were performed at 87 °C PBS (phosphate-buffered saline) solution for 2 months (see Figure 1). Several of Picosun’s ALD materials have been proven non-cytotoxic and safe for human tissues already earlier [2], which gives great flexibility for designing tailored nanolaminate encapsulants for varying substrates and levels of protection.

    For (platinum) metal electrode protection, ALD HfO2 was first used as an attachment and innermost barrier layer deposited right against the metal, and biocompatible organic polymer PDMS (polydimethylsiloxane) was applied on top of the ALD film to create impermeable, stable bilayer protection combining the best properties of both materials [3]. ALD HfO2 provides good adhesion to and hermetic sealing of the surface, whereas PDMS, as the more “macroscopic” layer, robustness and sturdiness on top of the ultra-thin ALD film. The bilayer coatings were tested by soaking them in PBS solution for 450 days at room temperature.

    The results of both tests again support ALD’s enormous potential to provide totally new solutions to the challenges medical device industries are facing. The constant trend of increased miniaturization and system-level integration of microelectronics drives the same development in implantable medical devices as well. When the device size decreases but its complexity and the time the device spends inside human body increase, traditional encapsulation methods fail.

    “ALD’s excellent barrier properties either as such, or combined with other encapsulation methods, support the trend of miniaturization and increased functionalization of medical microelectronics and enable a variety of novel products. Introduction of ALD encapsulation can also help the manufacturers to replace expensive, noble metal components with cheaper materials, when ALD protection ensures the inertness of the devices inside the body. Picosun’s ALD technology is already at use at several medical device manufacturers, and we want to keep spearheading ALD’s integration into healthcare industries. We are happy to provide production-proven, turn-key solutions to manufacturers to realize a whole new generation of safer, longer-lasting and user-friendly implantable devices for remote and digital healthcare,” says Dr. Jani Kivioja, CTO of Picosun Group.

    Picosun provides the most advanced AGILE ALD® (Atomic Layer Deposition) thin film coating solutions for global industries. Picosun’s ALD solutions enable technological leap into the future, with turn-key production processes and unmatched, pioneering expertise in the field – dating back to the invention of the technology itself. Today, PICOSUN® ALD equipment are in daily manufacturing use in numerous leading industries around the world. Picosun is based in Finland, with subsidiaries in Germany, USA, Singapore, Taiwan, China, Korea, and Japan, offices in India and France, and a world-wide sales and support network. Visit www.picosun.com.

    [1] ALD 2019 – 19th International Conference on Atomic Layer Deposition, 21-24 July 2019, Bellevue, Washington, USA / ULIMPIA project, funded by PENTA under grant number PENTA-2017-Call2-16101-ULIMPIA.

    [2] https://www.picosun.com/press/picosun-expands-selection-of-biocompatible-ald-materials-for-medical-applications/

    [3] Nanbakhsh et. al., “Long-term encapsulation of platinum metallization using a HfO2 ALD-PDMS bilayer for non-hermetic active implants”, Proceedings of IEEE 70th Electronic Components and Technology Conference (ECTC), 3-30 June 2020, Orlando, Florida, USA / POSITION-II project, funded by the ECSEL JU under grant number Ecsel-783132-Position-II-2017-IA.

    More information:
    Dr. Jani Kivioja
    CTO, Picosun Group
    Tel: +358 46 922 8804
    Email: info@picosun.com
    Web: www.picosun.com


 Products

  • PICOSUN® Morpher
    The PICOSUN® Morpher ALD platform is designed for fast, fully automatic, high throughput production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility....

  • The PICOSUN® Morpher ALD product platform is designed to disrupt the up to 200 mm wafer industries in Beyond and More than Moore technologies. It enables fast, fully automatic, high throughput production of MEMS, sensors, LEDs, lasers, power electronics, optics, and 5G components with the leading process quality, reliability, and operational agility. Morpher adapts to the changing needs of your industry and the requirements of your customers, on all business verticals from corporate R&D to production and foundry manufacturing. The leading versatility in substrate materials, substrate and batch size, and the wide process range make Morpher truly a transformable, all-inclusive manufacturing facility to keep you spearheading your industry.

    Technical features

    Typical substrate size and type

    • 200 mm wafers in batches up to 50 pcs
    • 150 mm wafers in batches up to 50 pcs
    • 100 mm wafers in batches up to 50 pcs
    • High aspect ratio samples (up to 1:2500)
    • Substrate materials: Si, glass, quartz, SiC, GaN, GaAs, LiNbO3, LiTaO3, InP


    Processing temperature and capacity

    • 50 – 300°C
    • Up to 1000 wafers / 24 hours @ 15 nm Al2O3 thickness


    Typical processes

    • Batch processes available with cycle times down to single digit seconds
    • Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, and metals
    • Down to <1% 1σ non-uniformity in a batch (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)


    Substrate loading

    • Fully automatic loading with vacuum cluster tool combined with vertical flip function
    • Cassette to cassette batch loading through Picoplatform™ 200 vacuum cluster system
    • Optional SMIF station


    Key software features

    • Independent recipe editor enabling recipe creation and modification during process runs, with dynamic structure (scalable format for each recipe)
    • Unified interface to control the whole cluster with one communication protocol (Ethercat)
    • Fixed loop control cycle with 1/20 millisecond data logging rate, capable of multi-tasking
    • Datalogger accessible remotely, all data fully exportable
    • SECS/GEM integration to factory host


    Precursors

    • Liquid, solid, gas, ozone
    • Level sensors, cleaning and refill service
    • Up to 12 sources with 6 separate inlets


    The PICOSUN® Morpher is designed for fully automated handling of wafer batches in combination of industry standard single wafer vacuum cluster platforms. Revolutionary, patented wafer batch flipping mechanism enables integration of the system with semiconductor manufacturing lines where most of the processing takes place in horizontal geometry, and the SEMI S2/S8 certification ensures that the system is compatible with the strictest standards of the industry.

    The PICOSUN® Morpher ALD system can be integrated to factory automation via SECS/GEM protocol and the state-of-the-art software offers easy, safe and fail-proof operation of the system through intuitive and streamlined graphical user interface. With our patented dual-chamber, hot-wall reactor design with fully separated precursor conduits and inlets, we create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The compact, ergonomic design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market.

  • PICOSUN® P-1000
    The PICOSUN® P-1000 ALD system is designed for batch coating of various 3D items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants....

  • Technical Features

    Typical substrate size and type

    • All kinds of 3-dimensional items such as mechanical machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL™ solutions)


    Processing temperature

    • 50 – 400°C


    Typical processes

    • Al2O3, ZnO, TiO2


    Substrate loading

    • Manual loading with loading accessory (e.g. forklift cart)


    Precursors

    • Liquid, solid, gas, ozone
    • Level sensors, cleaning and refill service
    • Up to 10 sources with 6 separate inlets


    The PICOSUN® P-1000 ALD system is designed for batch processing of various 3-dimensional items such as mechanical machinery parts, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL™ solutions) in a production environment. The main applications include various passivation and barrier layers to significantly improve the performance and lifetime of the coated items. The PICOSUN® P-1000 ALD system offers innovative and agile design to enable the highest quality ALD depositions with excellent uniformity, maximum yields, minimum system downtime and low cost-of-ownership with production-proven processes.

    The reliable, fast, and easy to maintain PICOSUN® P-1000 ALD system represents the cutting-edge of industrial ALD.

  • PICOSUN® P-300BV
    The PICOSUN® P-300BV ALD system is specially designed for production of LEDs, discrete devices, and MEMS devices such as print heads, sensors, and microphones....

  • Technical Features

    Typical substrate size and type

    • 200 mm wafers in batches of 25 pcs (standard pitch)
    • 150 mm wafers in batches of 50 pcs (standard pitch)
    • 100 mm wafers in batches of 75 pcs (standard pitch)
    • Non-wafer substrates (tailored holders)
    • High aspect ratio samples (up to 1:2500)


    Processing temperature

    • 50 – 450°C


    Typical processes

    • Batch processes available with cycle times down to single digit seconds
    • Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, AlN, TiN, and metals
    • Down to <1% 1σ non-uniformity in a batch (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)


    Substrate loading

    • Semi-automatic loading with vertical loaders (one or two loaders)
    • Optional heating for load lock


    Precursors

    • Liquid, solid, gas, ozone
    • Level sensors, cleaning and refill service
    • Up to 8 sources with 4 separate inlets


    The PICOSUN® P-300 ALD systems have become the new standard in high volume ALD manufacturing. By integrating our patented hot-wall design with fully separated inlets, we can create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The agile design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. Our proprietary Picoflow™ diffusion enhancer technology enables highly conformal coatings on ultra-high aspect ratio substrates with production-proven processes.

    The PICOSUN® P-300BV ALD system represents the cutting-edge of industrial ALD. The system is designed for semi-automated handling of wafer batches. The tool is optimized for fast batch production and it can be integrated to factory automation via SECS/GEM option. Vacuum loading system with heating option enables clean processing of sensitive substrates and deposition of materials such as metal nitrides.

    The PICOSUN® P-300BV is the ALD system of choice for innovation driven industries.

  • PICOSUN® P-300B
    The PICOSUN® P-300B ALD system is specially designed for production of MEMS devices and coating of 3D items such as machinery parts, glass or metal sheets, coins, watch parts and jewelry, lenses, optics, and medical devices and implants....

  • Technical Features

    Typical substrate size and type

    • 200 mm wafers in batches of 25 pcs (standard pitch)
    • 150 mm wafers in batches of 50 pcs (standard pitch)
    • 100 mm wafers in batches of 75 pcs (standard pitch)
    • All kinds of 3-dimensional items such as mechanical machinery parts, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL™ solutions)
    • High aspect ratio samples (up to 1:2500)


    Processing temperature

    • 50 – 500°C


    Typical processes

    • Batch processes available with cycle times down to single digit seconds
    • Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, AlN, TiN, and metals
    • Down to <1% 1σ non-uniformity in a batch (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)


    Substrate loading

    • Manual loading with a pneumatic lift
    • Linear semi-automatic loading
    • Industrial robot loading


    Precursors

    • Liquid, solid, gas, ozone
    • Level sensors, cleaning and refill service
    • Up to 8 sources with 4 separate inlets


    The PICOSUN® P-300 ALD systems have become the new standard in high volume ALD manufacturing. By integrating our patented hot-wall design with fully separated inlets, we can create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The agile design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. Our proprietary Picoflow™ diffusion enhancer technology enables highly conformal coatings on ultra-high aspect ratio substrates with production-proven processes.

    The PICOSUN® P-300B ALD system is specially designed for batch processing in MEMS and 3-dimensional component production, such as coating of mechanical machinery parts, coins, watch parts and jewelry, lenses, optics, and medical equipment, surgical implants and implantable devices (PicoMEDICAL™ solutions). The system is fast, highly reliable and extremely easy to maintain.

    Customer Testimonials

    “Our PICOSUN® ALD system has been providing stable and reliable processing for implant surface coating already for a number of years, creating a competitive advantage for our products in the medical implant market. We do recommend PICOSUN® ALD technology for all of the industries where surface modification on microscale plays a key role in the product development.”
    Mr. Evgeniy Kozlov, Executive Director of CONMET LLC

    “We would wholeheartedly recommend Picosun to anyone looking for a fully developed and extremely reliable system regarding ALD technology, no matter what the area of application.”
    Mr. Alfred Gnadenberger and Dr. Lukas Lauter, Austrian Mint

  • PICOSUN® P-300S
    The PICOSUN® P-300S ALD system is specially designed for production of IC components such as microprocessors, memories, and hard drives, and it is also suitable for MEMS devices such as print heads, sensors, and microphones....

  • Technical Features

    Typical substrate size and type

    • Max. 300 mm single wafers
    • High aspect ratio samples (up to 1:2500)


    Processing temperature

    • 50 – 500°C


    Typical processes

    • Single wafer processes available with cycle times down to single digit seconds
    • Al2O3, SiO2, Ta2O5, HfO2, ZnO, TiO2, ZrO2, AlN, TiN, and metals
    • Down to <1% 1σ non-uniformity (Al2O3, WIW, WTW, B2B, 49 pts, 5mm EE)


    Substrate loading

    • Load lock with magnetic manipulator arm
    • Automatic loading available through Picoplatform™ 200 or Picoplatform™ 300 vacuum cluster system
    • Cassette-to-cassette and FOUP loading available with cluster system
    • N2 cabinet loading


    Precursors

    • Liquid, solid, gas, ozone, plasma
    • Level sensors, cleaning and refill service
    • Up to 12 sources with 6 separate inlets


    The PICOSUN® P-300 ALD systems have become the new standard in high volume ALD manufacturing. By integrating our patented hot-wall design with fully separated inlets, we can create the highest quality ALD films with excellent yield, low particle levels, and superior electrical and optical performance. The agile design with easy and fast maintenance ensures minimum system downtime and lowest cost-of-ownership in the market. Our proprietary Picoflow™ diffusion enhancer technology enables highly conformal coatings on ultra-high aspect ratio substrates with production-proven processes.

    The PICOSUN® P-300S ALD system represents the cutting-edge of industrial ALD. The system is designed for fully automated handling of single wafers in combination with industry standard vacuum cluster platforms. The SEMI S2/S8 certified P-300S ALD systems can be integrated to factory automation via SECS/GEM option and they fulfill the most stringent cleanliness requirements of the semiconductor industry.

    The PICOSUN® P-300S is the ALD system of choice for innovation driven industries in IC.

  • PICOSUN® R-200 Advanced
    The PICOSUN® R-200 Advanced ALD systems are suitable for R&D on dozens of applications such as IC components, MEMS devices, displays, LEDs, lasers, and 3D objects such as lenses, optics, jewelry, coins, and medical implants....

  • Technical Features

    Typical substrate size and type

    • 50-200 mm single wafers
    • 156 mm x 156 mm solar Si wafers
    • 3D objects
    • Powders and particles
    • Mini-batch
    • Porous, through-porous, and high aspect ratio (up to 1:2500)


    Processing temperature

    • 50 – 500°C, plasma 450°C (650 °C with heated chuck on request)


    Typical processes

    • Al2O3, TiO2, SiO2, Ta2O5, HfO2, ZnO, ZrO2, AlN, TiN, metals such as Pt or Ir


    Substrate loading

    • Manual loading with a pneumatic lift
    • Load lock with magnetic manipulator arm
    • Semi-automatic loading with handling robot
    • Cassette-to-cassette loading with cluster tools


    Precursors

    • Liquid, solid, gas, ozone, plasma
    • Up to 12 sources with 6 separate inlets (7 if the plasma option is chosen)


    Options

    • Cluster tools, Picoflow™ diffusion enhancer, roll-to-roll chamber, RGA, UHV compatibility, N2 generator, gas scrubber, customized designs, glove box integration for inert loading


    The PICOSUN® R-200 Advanced ALD system is the global market leader in advanced ALD research tools with hundreds of customer installations. It has become the tool of choice both for companies and research institutes driven by innovation.

    The agile design enables the highest quality ALD film depositions together with the ultimate system flexibility to fit future needs and applications. The patented hot-wall design with fully separate inlets and instrumentation enables particle-free processing adaptable on a wide range of materials on wafers, 3D objects, and all nanoscale features. Excellent uniformity even on the most challenging through-porous, ultra-high aspect ratio, and nanoparticle samples is achieved thanks to our proprietary Picoflow™ technology. The PICOSUN® R-200 Advanced systems are equipped with highly functional and easily exchangeable precursor sources for liquid, gaseous, and solid chemicals. Highly efficient and patented remote plasma option enables deposition of metals without the risk of short-circuiting or plasma damage. Integration with glove boxes, UHV systems, manual and automated loaders, cluster tools, powder chambers, roll-to-roll chambers, and various in situ analytics systems enable efficient and flexible research with good results no matter what your research area is now or might become later on.


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