Vistec Electron Beam GmbH

Ilmstrasse 4
Jena,  D-07743

  • Booth: B1466

We understand E-Beam

As a long-standing equipment supplier, Vistec Electron Beam GmbH is providing leading technology solutions for advanced electron-beam lithography. Based on the Variable Shaped Beam (VSB) principle, the electron-beam lithography systems are mainly utilized for: semiconductor manufacturing applications and advanced research as silicon direct write, compound semiconductor, silicon photonics, mask making as well as integrated optics and several new emerging markets.

The company’s roots go back to Carl Zeiss Jena when the first commercial Variable Shaped Beam system was introduced in the 1970s.

The company is located in Jena, Germany. In addition to its production facility in Germany, Vistec Electron Beam maintains service and support centers in Western Europe, Taiwan and the United States.


  • Vistec SB3050 series
    The Vistec SB3050 series - with a Cell Projection option - is our commitment to semiconductor manufacturing professionals....

  • The Vistec SB3050 series is designed to meet the challenges of direct patterning down to the 32nm technology node, it features Variable Shape Beam (VSB) technology with vector scan and continuously moving stage principles for throughput optimization.

    Our industry proven 300mm design concept has been successfully utilized in more than 10 installations worldwide.

    The Vistec SB3050 series combines state of the art substrate handling with a high-precision stage system and a sophisticated electron-optical 50 keV column specifically developed to ensure excellent resolution performance.

    Thanks to the production-compatible Graphical User Interface (GUI) the Vistec SB3050 can be easily integrated into automated production environments (CIM). Being capable of exposing both masks (including templates) and wafers, the SB3050 exposure tools are the ideal bridge to next generation technology nodes.


    • 50keV high-resolution electron optics with 1nm writing/address grid
    • 310x310mm stage travel range to ensure full 300mm wafer exposure capability
    • High throughput achieved by the "write-on-the-fly" principle combined with Flexible Stage Speed (FSS)
    • State of the art fully automatic substrate handling with mini environment to satisfy the requirements
      of most advanced resist technologies
    • Wafer Mix & Match with optical lithography supported by production compatible correction methods
    • Integrated monitoring software for all critical process parameters
    • High speed data processing allows fast data generation including flexible Proximity Effect Correction with distributed computing
    • Small clean room footprint < 27m² (SB3050)
    • SB3055 with Cell Projection option for combined use with VSB principle for further throughput improvement
  • Vistec SB254
    Vistec’s SB254 is a fully automated, high performance, cost-effective electron-beam lithography system designed for use in both industry and advanced research....

  • Based on the Variable Shaped Beam (VSB) principle, these SB254 tools are utilized in a wide range of existing and emerging semiconductor and nanotechnology applications including silicon direct write, compound semiconductor, mask making, integrated optics and silicon photonics

    The Vistec SB254 is a reliable, field proven system with high throughput rates suitable for 24/7 production environments. Numerous worldwide installations are supported by an efficient international service organization.

    Key Features

    The main features of the Vistec SB254 are:

    • A range of substrate sizes and types  (Wafers up to 200mm and Masks up to 7 inch)
    • Substrate materials cover a huge variety of all commonly used materials, especially compound semiconductor materials as GaAs, GaN on SiC, Si, InP e.g.
    • Mark Detection Software Package (MDSP) for Mix & Match
    • High accuracy field, and key stone correction.
    • Multipass writing.
    • Substrate edge detection – mask/wafer.
    • Dedicated, powerful layout data preparation station covering both hardware & software with ePlace® (up to 256 CPU cores) for fracturing as well as Proximity Effect Correction (PROXECCO).
    • Graphical User Interface (GUI) compliant to SEMI E95.
    • Fully automated substrate handling including pre-alignment: substrates taken from and returned to a SMIF pod.
    • Minimum feature size < 20nm (HSQ).
    • Cell Projection (optional).

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