Plan Optik AG

Ueber der Bitz 3
Elsoff,  56479

  • Booth: B1013

Glass, fused silica and silicon for MEMS and semiconductors.

Plan Optik AG is the leading manufacturer of structured wafers when it comes to technology. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals these wafers are essential components used as active elements for numerous applications in MEMS technology. The wafers of glass, glass-silicon compounds or quartz are available in sizes up to 300 mm diameter. Wafers by Plan Optik provide high-precision surfaces. Plan Optik wafers are available to minimum tolerances with application-specific structuring and complex material combinations.

Plan Optik AG's extensive experience in the integration of optical, electronic or chemical functions within a wafer as the basis of MEMS applications has made the company the preferred partner of large international manufacturers. Based on Plan Optik's expert knowledge the wafers are developed in collaboration with customers such as OSRAM, Infineon, Motorola, Samsung, Honeywell and Bosch.

 Press Releases

  • Application, Products • 11 June 2019

    Sensors and Micro-Electro-Mechanical-Systems (MEMS) have changed the way how we interact with technology and how it interacts with itself and our environment. Without them we would not have smartphones, smart homes or wearable devices as smart watches as well as a huge range of industrial and medical devices that require the functionality provided by MEMS and Sensors.

    One of these sensors that has been first developed decades ago is the pressure sensor, which is used in a wide variety of applications. These range from automotive as tire-pressure monitoring systems (TPMS) or oil and gas pressure sensing to healthcare applications as blood-pressure measurement and sensors integrated in the tip of a catheter or smartphones, where pressure sensors are used to enhance GPS navigation or weather forecasting. Furthermore pressure sensors are used for process control in production lines and commercial or industrial buildings.

    Plan Optik AG, the leading manufacturer of blank and patterned wafers from glass and quartz supplies companies from start-ups to international large scale manufacturers that are developing and manufacturing MEMS Pressure Sensors.

    Blank Glass wafers are used as substrates to manufacture MEMS sensors and membranes whereas patterned wafers with cavities or through holes are used to encapsulate the pressure sensor die. Cavities can be used to encapsulate a reference pressure and through holes connect the membrane to the environment to enable pressure measurement. The encapsulation is done by using a wafer level packaging (WLP) approach. Often anodic bonding between the sensor from Silicon and cap-wafers from glass is used to create a hermetic encapsulation. Therefore Plan Optik uses cte adapted materials. After packaging the dies are separated by dicing the wafer.

    Compared to other materials glass offers long term stability as well as chemical and thermal resistance. Its transparent property allows doing in-process inspection of the MEMS die which leads to higher throughput and can help to reduce cost by increase of yield. In addition glass wafers can be marked with laser marking or QR-codes for process traceability.

    If you are interested in how glass wafers can be used in your MEMS, Sensor or Semiconductor application get in touch with our engineers by clicking the link below or mailing to
  • Business • 18 April 2019

    Elsoff. In order to serve the high demand of wafers with fixed specifications more quickly, Plan Optik AG has founded a new brand called Wafer Universe, to provide off the shelf products.

    Beside Plan Optik's main business of customized wafers, Wafer Universe is going to handle the range of stock products. By separating those two business areas and optimizing processes Wafer Universe is able to offer the shortest quotation and delivery time. There is a huge variety of high-quality wafers made of different materials and in different sizes available from stock.

    Borosilicate wafers by Wafer Universe are mainly used as substrate wafers for a variety of Semiconductor and MEMS applications. Furthermore these wafers are often used in production processes as carriers for Thin-Wafer-Handling or for Wafer-Level-Packaging (WLP) of MEMS and sensors. Wafer Universe supply borosilicate wafers either with regular polishing or with the enhanced MDF polishing by Plan Optik. All wafers are available in packing units of 10 or 25 pcs.

    Borosilicate Wafers with regular polishing are available in sizes from 100 mm up to 300 mm diameter. The thickness ranges from 300 µm for 100 mm wafers up to 1000 µm with a thickness tolerance of 10µm. Regular polished wafers will have a surface roughness (Ra) below 1 nm and a ttv below 10 µm.

    Borosilicate wafers with the enhanced MDF polishing are available in sizes from 100 mm up to 200 mm diameter with a thickness of 500 µm. MDF polished wafers will have a surface roughness (Ra) below 0.5 nm and achieve a sub-surface damaging reduction bigger than 99%.

    Wafers made of alkaline free glass are often used as carriers for Thin-Wafer-Handling processes, as packaging substrates for Wafer-Level-Packaging of MEMS and general Semiconductor applications. Alkaline free glass wafers are available in 150 mm diameter with a thickness of 500 µm and 200 mm with a thickness of 725 µm. Those double side polished wafers will have a surface roughness (Ra) below 1 nm and a ttv below 10 µm.

    In addition to borosilicate glass and alkaline free glass wafers, Wafer Universe also offers wafers from quartz that can be used in high temperature processes or applications that demand high optical transmission. Quartz wafers with semiconductor grade are available in sized from 100 up to 200 mm. The thickness ranges from 300 up to 1000 µm with a surface roughness (Ra) below 0.5 nm and a ttv below 10 µm.

    As you can see before Wafer Universe will be able to serve mainly every customer with stock products in respond to it's needs – simple and fast. In order to guarantee the highest quality, Plan Optik employs a quality management system certified as per IATF 16949, ISO 14001 and ISO 9001.

    Learn more about Wafer Universe and its wide range of stock products at

    Download product catalogue here:

  • Business • 23 January 2019

    Plan Optik AG, the leading manufacturer of wafers from glass and quartz for Semiconductor and MEMS applications, is proud to announce its collaboration with the Centre de Collaboration MiQro Innovation (C2MI) in Bromont, Canada.

    After successfully working with C2MI and members of their company network in the past years Plan Optik AG will from now on also participate in C2MI network activities. Joining this network will enable Plan Optik to share their experience and Know-how to members, partners and companies beyond. As a member Plan Optik will provide manufacturing service for other members, partners and other companies in order to thrive innovations and decrease the time from prototype to product manufacturing of new technologies.

    About C2MI

    "The C2MI is an international beacon in advanced packaging and microsystems. As a Centre of Excellence, its goal is to allow its members to foster the growth of the microelectronics industry through the accelerated commercialization of market-driven prototypes. Active and seamless collaboration and synergy among the Center’s members enables the rapid commercialization of next-generation prototypes." (from C2MI Homepage)


    Cap Wafers from glass, quartz, silicon and compound materials for Wafer Level Packaging up to 300 mm. Customer-specific, in various materials and combinations....

  • Plan Optik manufactures packaging wafers from custom-made single items to large-scale series using glass, quartz and silicon and combinations of these three materials. The diameter is 50 - 300 mm with low thickness tolerances and low ttv values. In each case the structuring of the wafer is carried out on a customer-specific basis, for example with optical cavities, coatings and drillings.

    Packaging wafers by Plan Optik are used to pack and thus to seal hermetically optical or chemical sensors, pressure sensors and acceleration sensors. Typical industrial applications lie in the fields of consumer electronics (CMOS imaging, micro-mirrors), automotive technology (pressure sensors, e.g. tires, engine monitoring), aerospace (3D acceleration sensors), chemistry (micro-reaction technology), pharmaceuticals (lab-on-chip) and in the general manufacture of semiconductors.

    For the manufacture of ultra-thin substrates from silicon, gallium arsenide and other special materials. CTE-adapted materials, re-cyclable. Customer-specific solutions....

  • Plan Optik produces carrier wafers as a carrier substrate for the processing of thin semiconductor wafers. These carriers are used to permit the safe handling of delicate semiconductor wafers (e.g. those made of silicon and gallium arsenide). Semiconductor wafers are becoming ever thinner, and at the same time the requirements as regards their thickness tolerance and surface quality for back thinning, sawing and numerous other processes continue to rise. For this reason, high-precision carrier wafers (carriers) are a fundamental requirement when it comes to processing. Plan Optik manufactures these carriers using a special glass which provides the perfect substrate material in this respect, because it demonstrates excellent thermal and chemical stability. An additional advantage is the possibility of re-using such carriers - thus making an important contribution not only to the reduction of costs but also to environmental protection.

    Substrate wafers for general MEMS & Semiconductor applications. Borosilicate, Quartz, Fused Silica, Alkaline Free and Silicon-on-Glass Wafers. manufactured to custom specifications. Standard SEMI / JEIDA specifications from 2” to 300 mm....

  • Plan Optik offers customized substrate wafers from various types of glass and quartz, from single-item production to large-scale series. The diameter measures between 2” - 300 mm with low thickness tolerances and low ttv values.

    Typical areas of application for Plan Optik’s substrate wafers are in consumer electronics sector (CMOS imaging, micro mirrors), automotive sector (pressure sensors, e.g. tires, engine control), aerospace (3D acceleration sensors), chemistry (micro reaction technology), pharmaceuticals (Lab-on-chip) and in semiconductor production in general.


    • MEMS & Semiconductors
    • Anodic bonding with Silicon
    • MEMS & Sensor manufacturing
    • Optoelectronics
    • OLEDs and high performance LCD Displays
    • Thin film semiconductors
    • Optical switches, solar and industrial applications
    • SoG Wafers to replace common SOI-Wafers with better Insulation
    • Leading edge Semiconductor, lithography and optical applications
    Patterned interposer and TGVs from Glass, Quartz, Silicon-on-Glass or compound materials used for 3D Integration. Wafer diameter from 2” to 200 mm manufactured on customer specific designs with patterning and alignment features....

  • Plan Optik manufactures Interposer like Glass-Interposer, Si-Interposer, Through-Glass-Vias (TGV) or Wafers Interposer with Redistribution Layers.

    Using borosilicate glass with a thermal expansion coefficient adapted to that of silicon, Plan Optik wafers are used in 3D wafer level packaging of MEMS, whereby the combination of mechanical, optical and electrical functions within a wafer substrate is made possible. This results in vacuum-tight Through-Silicon-Vias (TGV) which can also be used in demanding environments, for example with high temperature fluctuations or humidity.


    • 2.5D / 3D Wafer-Level-Packaging
    • Chip-Stacking
    • 3D Integration of MEMS Sensors & Semiconductor Devices
    • RF components and Modules
    • CMOS Image Sensors (CIS)
    • Automotive RF & Camera Modules

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