Meyer Burger Technology AG

PiXDRO LP50 Inkjet Printer Extensive Features and Options

The PiXDRO LP50 is a desktop R&D inkjet printer for functional printing applications. It is designed for research and development of inkjet processes and applications, as well as evaluation and development of inkjet materials. The LP50 platform is an open, accurate, flexible, and easy to use system that will allow you to work at the frontiers of inkjet printing technology. The LP50 is designed for a wide range of applications such as semiconductor packaging, PCB, printed electronics, photo voltaic, display, and bio-medical.

Extensive Features and Options

• Flexible, robust and accurate R&D inkjet printer

• Development of a wide range of processes and applications

• Choice of industrial and disposable printheads

• Advanced test software packages for fast and effective process optimization

• Integrated vision systems for alignment and print view

• Recirculating ink supply for nanoparticle inks

• Standard printhead maintenance stations

• Substrate chuck heating and cooling

• Integrated UV curing

• Single and dual printheads

• Glovebox integration

• Various other options and accessories

PiXDRO JETx Inkjet Printer

The PiXDRO JETx mass production inkjet printer is Meyer Burger’s most advanced platform for printing functional materials. It has a modular architecture and can be configured for a wide range of applications such as printed electronics, photo voltaic, PCB solder masking, semiconductor packaging and chemical machining. The JETx is designed for 24/7 fully automated production, and is typically configured for processing large volumes of customer specific products. The JETx systems have a granite base for superior stability and extremely high stage accuracy and printing precision, combined with high throughput and lowest cost of ownership. It is based on three standard platforms, the JETx-P, -S, and -M, each system targeting specific application areas and product sizes.

PiXDRO JETx-P

Applications: Masking layers for solar wafers

Throughput: 1200/2400/4500 wafers/hour

Feature size: Down to 20 μm

Wafer breakage: < 0.01%

PiXDRO JETx-S

Applications: Dielectric, conductive, adhesive, masking resist for semiconductor back-end and packaging

Throughput: Up to 120 substrates/hour

Feature size: Down to 40 μm

Layer thickness: 0.5 – 100 μm

PiXDRO JETx-M

Applications: Solder mask for PCB, etching mask on panels, encapsulation layers

Throughput: Up to 80 sides/hour

Feature size: Down to 75/75 μm Line/Space

Layer thickness: 5 – 100 μm

Tx-S 300x400 mm
 

460x610