Your 200|300 mm R&D Partner for M(O)EMS and Nanoelectronics
Center Nanoelectronic Technologies
At the Center Nanoelectronic Technologies (CNT), Fraunhofer IPMS carries out applied research on 300 mm wafers for IC manufacturers, suppliers, equipment manufacturers and R&D partners. CNT offers the following services on Ultra Large-Scale Integration (ULSI) level:
The CNT has its own 800 m² clean room with 40 processing and analytic tools for 200/300 mm wafer and offers professional wafer handling for a smooth wafer exchange (short loops).
Industry standards guarantee a risk-free and quick integration of new developments and process innovations into the production lines of our customers to save costs and time.
MEMS Technologies Dresden
Fraunhofer IPMS develops for its customers products and technologies in the realm of microelectromechanical systems (MEMS), and micro-opto-electro-mechanical systems (MOEMS). Our capabilities span the entire development arc for MEMS and MOEMS products and technologies.