Osiris International GmbH

Josef-Schüttler-Str. 2
Singen Htw.,  78224

Germany
http://www.osiris-nano.com
  • Booth: C1554


We invite you to visit us on our booth C1-554

Osiris International is a manufacturer of machines specializing in photolithographic process equipment used in semiconductor and microsystems (MEMS) technology.

The main application areas for surface treatment of wafers, substrates or masks are the following processing applications.

photoresist spin & spray coating, developing, baking,
wet cleaning, post CMP cleaning, etching, stripping & metal lift-off and
temporary bonding & debonding.

In addition to the production of our machines, which range from laboratory systems to semi-automatic and fully automatic systems, we also offer sub-systems such as PR Dispense Systems (Pumps, Syringe or CPD) and media supply cabinets with various canister designs.

We supply our technologies worldwide to major semiconductor manufacturers and internationally renowned research and development institutions.


 Products

  • DEFIXX 30m - debonding system
    The osiris debonding device together with thermal influence achieves a careful and smooth removing of the thinned wafers from the carrier....

  • The osiris debonding device together with thermal influence achieves a careful and smooth removing of the thinned wafers from the carrier. It is a versatile tool that is ideal for many R&D wafer debonding applications and low volume production.

    BENEFITS
    ÷ Wafer size from pieces up to ø12"/300mm
    ÷ Imbedded heaters on wafer and carrier plates
    ÷ Temperature range adjustable up to 200°C
    ÷ Temperature uniformity of +/- 0,5°C
    ÷ Adjustable vacuum line to protect fragile/sensitive wafers
    ÷ Debonding with adjustable force
    ÷ Designed for R&D and low volume production

  • VARIXX 804 - Automaticre resist processing cluster
    The osiris automatic system platform offers the customer the possibility to configure the system so that it can be optimally equipped for the required process....

  • The system platform offers the customer the possibility to configure the system so that it can be optimally equipped for the required process.
    This VARIXX 804 automatic cluster system can be equipped with spin or spray coat and developer process modules, HMDS (vapor primer), hotplates and cool-plates for wafer sizes Ø2" /50mm up to Ø8" /200mm or square substrates up to 6” x 6” / 150 x 150 mm.

    BENEFITS
    ÷ Substrate sizes up to 200mm (round) or 6"x 6" (square)
    ÷ Flexible configuration of process modules
    ÷ Dual arm robotic system for increasing throughput
    ÷ On-the-fly product alignment
    ÷ Full edge handling (backside protected) or standard vacuum gripping
    ÷ Handling for thin, standard or bonded wafer (Si, glass & others)
    ÷ SECS/GEM interface
    ÷ Standard and customized chuck design

  • CHEMIXX 30pm - Single processing cleaning system
    The osiris single processing cleaning system for versatile application....

  • The osiris wet processing system for versatile application. Two system variations are available, with or without DI-water chamber rinse.
    The sytem has an easy to operate user interface with all needed functions like, recipe programming, service, maintenance and
    user administration.

    BENEFITS
    ÷ Wafer up to 300mm
    ÷ Square substrates up to 9 x 9 inch
    ÷ Three integrated media supply systems for three different chemicals.
    ÷ Up to two electric media arms
    ÷ Wide range of nozzles available
    ÷ BSR nozzle for DI-Water
    ÷ Standard or customized chucks
    ÷ Manually operated & safety interlocked process chamber door
    ÷ Controller unit via 10 inch touch screen
    ÷ Designed for Institutes and R&D

    OPTIONAL: (DI) Chamber rinse

  • UNIXX SP760 - Spray coating system
    Osiris offer two different spray methods into one system. For concave or convex surfaces, as well as the traditional in-line technology for substrates with topographic structure....

  • The osiris spray coating system is a innovative and revolutionary spray coating concept that combines two different spray methods into one system.
    With the newly developed method of 3D spray technology, for concave or convex (3D) surfaces, as well as the traditional in-line technology (2D) for substrates with topographic structure, we can now coat all topographies and shapes in one system.

    BENEFITS
    ÷ For flat, concave or convex surfaces
    ÷ Designed for large scale optical devices and different flat substrates sizes
    ÷ 6 axis robot system
    ÷ Up to two ultrasonic spray nozzles with automatic quickexchange function
    ÷ Integrated heating chuck
    ÷ User-friendly operator interface


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