Visit booth #B1.112 to discover SET Flip-Chip Bonders!
Founded in 1975, based in France, SET is a world leading supplier of High Accuracy Flip-Chip Bonders (chip-to-chip and chip-to-wafer) and versatile Nanoimprint Lithography (NIL) solutions.
With several hundreds of equipment installed worldwide, SET is globally renowned for the unsurpassed accuracy and the flexibility of its flip-chip bonders.
Ranging from manual loading to fully automated version, the SET bonders adapt to all main bonding techniques: fluxless reflow, thermo-compression, adhesive joining compression, thermosonic…
SET offers a comprehensive product portfolio of flip-chip bonders for fast growing markets and serving clients through a global network of representatives (DKSH in Taiwan) and in-depth customer trainings.
Visit SET website for more information: www.set-sas.f