Trymax Semiconductor Equipment B.V

Roggeweg 26b
Nijmegen,  6534 AJ

Netherlands
http://www.trymax-semiconductor.com
  • Booth: C1241


Trymax Semiconductor Equipment - When Plasma Matters

Trymax Semiconductor Equipment is an innovative plasma-based company designing, manufacturing and marketing state of the art equipment solutions for ashing, descum, surface preparation, light etching as well as UV photoresist curing and charge erase. With a product portfolio ranging from 100mm wafer size to 300mm and an installed base of 250+ systems, Trymax has significant market shares at foundries, IDMs, and Wafer Level packaging houses for end applications in Power Semiconductors, RF, Analog, Automotive, MEMS, LED, and CMOS. Recognized for its reliability, low cost of ownership, and performances, Trymax continuously innovates to support its customer’s needs. Trymax is headquartered in the Netherlands and operates local offices in Italy and China.


 Products

  • NEO 200A
    The NEO 200A product is the smallest footprint single chamber platform for advanced ashing and etching products from Trymax Semiconductor Equipment. ...

  • It’s a fully automated single chamber system that can be configured with any of the currently available Trymax NEO process modules. It’s compatible with substrates up to 200mm in diameter. The small footprint of the NEO 200A is configured with a dual cassette.
  • NEO 2000
    The NEO 2000 product line is an advanced plasma ashing/etch system from Trymax Semiconductor Equipment with the latest photoresist removal technology offering exceptional performance at a very competitive price....

  • The NEO 2000 is specifically designed for applications on 100mm to 200mm diameter substrates.

    It’s equipped with an ultra-fast transfer platform and is flexible and configurable for handling different dimensions of substrates at the same time with no hardware changes. The NEO 2000 series has a compact modular design and can deliver a high throughput to achieve the lowest Cost of Ownership.

  • NEO 2400
    The NEO 2400 series production platform is one of the latest additions to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment....

  • The NEO 2400 platform can be configured with any of the available Trymax NEO process modules and is compatible with the substrates up to 200mm in diameter.

    This platform can be used as a full bridge tool with the compatibility to run substrates of different type and diameter up to 200mm.

  • NEO 3000
    The NEO 3000 product line is a long established tool from the NEO range that is used for advanced plasma ashing and etching from Trymax Semiconductor Equipment....

  • It’s ready for the highest volume of production and adaptable to every production ramp and budget. The NEO 3000 system can be configured with any of the available Trymax NEO process modules and is compatible with substrates up to 300mm in diameter. The small footprint and modular design can be flexibly configured based on your production needs.

    The system can be used as a full bridge tool with compatibility to run both 200 and 300mm diameter substrates.

  • NEO 3400
    The NEO 3400 series production platform is one of the latest additions to the industry leading NEO range of advanced plasma ashing and etching products from Trymax Semiconductor Equipment....

  • It’s ready for the highest volume of production and adaptable to every production ramp and budget. The NEO 3400 platform can be configured with any of the available Trymax NEO process modules and is compatible with substrates up to 300mm in diameter. The small footprint and modular design can be flexibly configured based on your production needs.

    This platform can be used as a full bridge tool with compatibility to run both 200 and 300mm diameter substrates.

  • NEO 2000UV
    The NEO 2000UV is an advanced UV Curing/Erase system from Trymax Semiconductor Equipment with the latest and fastest UV curing and charge erase technology on the market....

  • It offers exceptional performances meeting nowadays semiconductor fab requirements. It is a high throughput system with optimized Cost of Ownership. The NEO 2000UV is specifically designed for applications up to 200mm diameter substrates.

Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".