ZS-Handling GmbH

Budapester Str. 2
Regensburg,  D-93055

  • Booth: C1552

Welcome to ZS-Handing - Contactless Ultrasonic-Handling

ZS-Handling GmbH develops, produces and sells systems and machines for industrial handling devices based on Ultrasonic Suspension Technology. Our patented technology makes parts float and enables contactless handling of workpieces. This technology can be applied in nearly all industries, when it comes to ultra-clean handling.

Vibration generators with separate power electronics generate a compressed air film with repulsive forces. This allows components to be lifted and guided along defined paths without contact. In combination with negative pressure, workpieces can also be gripped on the upper side - without touching them.

Advantages of the Ultrasonic Suspension Technology:

  • Applicable upto cleanroom class ISO 1.
  • No compressed air generation with complex and cost-intensive air conditioning required.
  • Can be operated with any ambient gas, e.g. inert gas.
  • No introduction of mechanical stresses into workpieces, thus reducing the risk of workpiece damage.
  • High flatness, also on formlabile substrates (up to 75µm).
  • Handling on processed or coated surfaces is also possible from the tospside.
  • No carry-over of impurities, thus significantly reduced risk of contamination.



  • LeviWafer-Gripper
    With the LeviWafer-Gripper transport system it is possible, to lift and transport sensitive Wafers contactless. In combination with the transport, loading and unlading of stacks and cassettes is also possible....

  • No scratches on the substrate during transport

    The ultrasonic gripper keeps the wafer at a distance, with the use of ultrasound, which enables non-contact transport. Besides micro-scratches, the Ultrasonic Suspension Technology also prevents contamination on the wafers and allows the use of the gripper in cleanrooms. The LeviWafer-Gripper can be designed with a single or double paddle.

    Features of the LeviWafer-Gripper:

    • Contactless pickup
    • No use of compressed air
    • Suitable for standard cassettes
    • Customizable according to customer specifications
  • LinearLevi-Conveyor
    The LinearLevi-Conveyor enables the contactless transport of sensitive materials. ...

  • High flatness of the substrate during the transport

    With the LinearLevi-Conveyor, the workpieces can be guided along defined lines, without any points of contact and without the use of compressed air. Due to the Ultrasonic Suspension Technology, the substrate is kept at a distance, which prevents micro-scratches and contamination. During the transport, a high flatness also on formlabile substrates is provided.

    Features of the LinearLevi-Conveyor:

    • Conveyor works with glass, aluminium or steel sonotrode
    • Available in different lengths
    • Customizable according to customer specifications
    • High flatness of the workpiece
  • LinearOverhead-Transport
    With the LinearOverhead-Transport-System it is possible to lift and transport sensitive materials, e.g. wafers contact-free from above....

  • No air turbulences and thus no contamination from the particles

    The LinearOverhead-Transport-System uses negative pressure together with ultrasound, which enables contactless linear transport of components on the top side. With this system, the workpieces can be lifted from above and guided along defined lines. Besides the linear transport, the topside conveyor can be combined with other systems to provide inspecting and sorting, as well as singulating of the substrate.

    It can be supplied in various versions and sizes, for example for the contactless transport of wafers.

    Features of the LinearOverhead-Transportsystems:

    • Contactless overhead lifting
    • No air turbulences
    • Available in different lengths
    • Customizable according to customer specifications
  • Modular Waferhandling-System
    The modular Waferhandling-System facilitates all possible handling processes of wafers. ...

  • No contact with the wafer during the handling in the system

    Loading and unloading, conveying, gripping, inspecting, sorting and singulating can be realized in one system.

    Our Ultrasonic Suspension Technology keeps the wafer on distance the whole time and therefore prevents micro-scratches and contamination.

    Features of the Modular Waferhandling-System:

    • Modular Design
    • Suitable for clean rooms
    • Customizable according to customer specifications
    • Linking various processes in one system
  • LeviSolar-Gripper
    The LeviSolar-Gripper enables contactless gripping and depositing of solar wafers....

  • Our technology guarantees the ultragentle and ultra-clean handling of the sensitive surfaces.

    When gripping the wafer, a combination of vacuum and ultrasound is used. The vacuum provides the attraction of the wafer and the ultrasound keeps the workpiece, with its repelling effect, at distance. Thus, no points of contact occur between the wafer and the gripper, and gentle handling is ensured. The LeviSolar-Gripper is available for different wafer sizes. The edge stops support the wafer to center itself and to stay in position.

    Features of the LeviSolar-Gripper:

    • Contactless overhead lifting
    • No carry-over of impurities and no micro scratches
    • No need for compressed air

  • UltraLevi-Desk
    With the UltraLevi-Desk it is possible to transport and (un)load substrates without contact....

  • High flatness of the substrate

    Our patented technology lets the workpieces float on the surface of the ultrasonic table. The substrate is kept at a distance, which allows contactless transport and prevents micro-scratches and contamination. Furthermore, high flatness of the substrate is guaranteed, and thus, breakage rates can be reduced. The UltraLevi-Desk can be combined with other systems and integrated in manufacturing lines to improve the production efficiency.

    Features of the UltraLevi-Desk:

    • Extendable
    • High Flatness of the Substrate
    • Customizable according to customer specifications
    • Recesses for inspection systems or cutting units

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