EV Group (EVG)

DI Erich Thallner Strasse 1
St. Florian/Inn,  A-4782

  • Booth: C1231

Visit EVG at the booth # C-1231

EV Group (EVG) is a leading supplier of equipment and process solutions for the manufacture of semiconductors, microelectromechanical systems (MEMS), compound semiconductors, power devices, and nanotechnology devices. Key products include wafer bonding, thin-wafer processing, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. Founded in 1980, EV Group services and supports an elaborate network of global customers and partners all over the world. More information about EVG is available at www.EVGroup.com.



  • EVG®850 TB
    Automated Temporary Bonding System...

  • The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops.
    Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes.


    - Open adhesive platform

    - Various carriers (silicon, glass, sapphire, etc…)

    - Bridge tool capability for different substrate sizes

    - Available with multiple load port options and combinations

    - Recipe controlled system

    - Real time monitoring and recording of all relevant process parameters

    - Fully integrated SECS/GEM interface

    - Optional integrated inline metrology module for automated feedback loop

    More information: https://www.evgroup.com/products/bonding/temporary-bonding-and-debonding-systems/evg850-tb/

    Automated Production Fusion Bonding System...

  • EVG BONDSCALE is designed to fulfill a wide range of fusion/molecular wafer bonding applications, including engineered substrate manufacturing and 3D integration approaches that use layer-transfer processing, such as monolithic 3D (M3D). With BONDSCALE, EVG is bringing wafer bonding to front-end semiconductor processing and helping to address long-term challenges for "More Moore" logic device scaling identified in the International Roadmap for Devices and Systems (IRDS). Incorporating an enhanced edge alignment technology, BONDSCALE provides a significant boost in wafer bond productivity and lower cost of ownership (CoO) compared to existing fusion bonding platforms.

    BONDSCALE is being sold alongside EVG's industry benchmark GEMINI FB XT automated fusion bonding system, with each platform targeting different applications. While BONDSCALE will primarily focus on engineered substrate bonding and layer-transfer processing, the GEMINI FB XT will support applications requiring higher alignment accuracies, such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning.


    - Fully automated fusion/molecular wafer bonding applications on 200 mm and 300 mm substrates in a single platform

    - Direct wafer bonding with plasma activation for heterogeneous integration of different materials, high-quality engineered substrates as well as thin-silicon layer-transfer applications

    - Layer-transfer processes and engineered substrates enabling logic scaling, 3D integration such as M3, 3D VLSI including backside power distribution, N&P stacking, logic-on-memory, clustered functional stacks and beyond-CMOS adoption

    More information: https://www.evgroup.com/products/bonding/fusion-and-hybrid-bonding-systems/bondscale/

  • EVG®150
    Automated Resist Processing System...

  • Designed as a fully modular platform, the EVG150 allows automated spray/spin/develop processes and high-throughput performance. The EVG150 guarantees highly uniform coats and improved repeatability. Wafers with high topography can be uniformly coated by EVG’s OmniSpray technology, where traditional spin coating encounters limitations.


    - Wafer sizes up to 300 mm

    - Up to six process modules

    - Customizable number - up to twenty bake/chill/vapor prime stacks

    - Up to four FOUP load ports or cassette loading

    - Available modules include Spin Coat, Spray Coat, NanoCoat™, Develop, Bake/Chill/Vapor/Prime

    - EV Group’s proprietary OmniSpray® ultrasonic atomization technology provides unmatched process results when it comes to conformal coating of extreme topographies

    - Optional NanoSpray™ module achieves conformal coating of 300-micron deep patterns with aspect ratios up to 1:10 and vertical sidewalls

    - Extensive range of supported materials

    - Bake modules for up to 250 °C

    - Megasonic technology for cleaning, sono-chemical processing and developing improves process efficiency and lowers the process time from hours to minutes

    - Sophisticated and field-proven robot handling with dual end-effector capability ensures continuous high throughput

    - Handling of thick or ultra-thin, fragile, bowed or small-diameter wafers 

    - Versatile combinations of multi-functional modules for spin and spray coating, developing, bake and chill provide great opportunities in many fields of application

    - EFEM (Equipment Frontend Module) and optional FSS (FOUP Storage System)

    - Process technology excellence and development service

    - Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)

    - Smart process control and data analysis feature [Framework SW Platform]

    • - Integrated analysis features for process and machine control
    • - Equipment and process performance tracking feature
    • - Parallel/queueing task processing feature
    • - Smart handling features
    • - Occurrence and alarm analysis
    • - Smart maintenance management and tracking

    More information: https://www.evgroup.com/products/lithography/resist-processing-systems/evg150/

  • EVG®40 NT
    Automated Measurement System...

  • The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy.
    Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters.
    With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.
    As an application example, the EVG40 NT completes EVG’s product range for highly accurate aligned wafer bonding as the tool of record for reliably verifying the 100 nm bond overlay accuracy of EVG’s GEMINI FB automated fusion.


    - Versatile measurement options for lithography and bonding metrology

    - Alignment verification for bonding and lithography applications

    - Top- to bottom-side microscope for manifold measurement methods

    - Critical dimension (CD) measurement

    - Die-to-die alignment verification

    - Multi-layer thickness measurement

    - High measurement accuracy in vertical and lateral direction

    - High throughput due to specialized calibration routine

    - PC-based measurement and pattern recognition software for highest reliability

    More information: https://www.evgroup.com/products/metrology/evg40-nt/?amp%3BL=5%20and%201%3D1&cHash=ca91e6c36d241ef5c083c4010619ad3a

    Automated Production Wafer Bonding System...

  • Vertical stacking of semiconductor devices has become an increasingly viable approach to enabling continuous improvements in device density and performance. Wafer-to-wafer bonding is an essential process step to enable 3D stacked devices. EVG's GEMINI FB XT integrated fusion bonding system extends current standards and combines higher productivity with improved alignment and overlay accuracy for applications such as memory stacking, 3D systems on chip (SoC), backside illuminated CMOS image sensor stacking, and die partitioning. The system features the new SmartView NT3 bond aligner, developed specifically for fusion and hybrid wafer bonding alignment requirements of < 50 nm.


    - New SmartView® NT3 face-to-face bond aligner with sub 50 nm wafer-to-wafer alignment accuracy

    - Up to six pre-processing modules like:

    • - Clean module
    • - LowTemp™ plasma activation module
    • - Alignment verification module
    • - Debond module

    - XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)

    Optional features:

    • - Debond module
    • - Thermocompression bond module

    More information: https://www.evgroup.com/products/bonding/fusion-and-hybrid-bonding-systems/gemin-fb/

  • EVG®610
    Mask Alignment System...

  • The EVG610 supports a variety of standard lithography processes, such as vacuum-, hard-, soft-, and proximity exposure modes, with the option of back-side alignment. Moreover the system offers additional capabilities including bond alignment and nanoimprint lithography (NIL). The EVG610 offers quick processing and re-tooling for changing user requirements with a conversion time of less than a few minutes. Its advanced multi-user concept can be adapted from beginners to expert level, thus making it ideal for universities and R&D applications. 


    - Wafer/substrate size from pieces up to 200 mm/8’’

    - Top-side and bottom-side alignment capability

    - High-precision alignment stage

    - Automated wedge compensation sequence

    - Motorized and recipe-controlled exposure gap

    - Supports the latest UV-LED technology

    - Minimized system footprint and facility requirements

    - Step-by-step process guidance

    - Remote tech support

    - Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)

    - Agile processing and conversion re-tooling

    - Table top or stand-alone version with anti-vibration granite table

    - Additional capabilities:

    • - Bond alignment
    • - IR alignment
    • - Nanoimprint lithography (NIL)

    More information: https://www.evgroup.com/products/lithography/mask-alignment-systems/evg610/


Send Email

Type your information and click "Send Email" to send an email to this exhibitor. To return to the previous screen without saving, click "Reset".