Plan Optik AG

Ueber der Bitz 3
Elsoff,  56479

Germany
http://www.planoptik.com
  • Booth: C1228


Glass, fused silica and silicon for MEMS and semiconductors.

Plan Optik AG is the leading manufacturer of structured wafers when it comes to technology. In sectors such as consumer electronics, automotive, aerospace, chemistry and pharmaceuticals these wafers are essential components used as active elements for numerous applications in MEMS technology. The wafers of glass, glass-silicon compounds or quartz are available in sizes up to 300 mm diameter. Wafers by Plan Optik provide high-precision surfaces. Plan Optik wafers are available to minimum tolerances with application-specific structuring and complex material combinations.

Plan Optik AG's extensive experience in the integration of optical, electronic or chemical functions within a wafer as the basis of MEMS applications has made the company the preferred partner of large international manufacturers. Based on Plan Optik's expert knowledge the wafers are developed in collaboration with customers such as OSRAM, Infineon, Motorola, Samsung, Honeywell and Bosch.


 Press Releases

  • 28 May 2020

    Sensors and Micro-Electro-Mechanical-Systems (MEMS) have changed the way how we interact with technology and how it interacts with itself and our environment. Without them we would not have smartphones, smart homes or wearable devices as smart watches as well as a huge range of industrial and medical devices that require the functionality provided by MEMS and Sensors.

    One of these sensors that has been first developed decades ago is the pressure sensor, which is used in a wide variety of applications. These range from automotive as tire-pressure monitoring systems (TPMS) or oil and gas pressure sensing to healthcare applications as blood-pressure measurement and sensors integrated in the tip of a catheter or smartphones, where pressure sensors are used to enhance GPS navigation or weather forecasting. Furthermore pressure sensors are used for process control in production lines and commercial or industrial buildings.

    Plan Optik AG, the leading manufacturer of blank and patterned wafers from glass and quartz supplies companies from start-ups to international large scale manufacturers that are developing and manufacturing MEMS Pressure Sensors.

    Blank Glass wafers are used as substrates to manufacture MEMS sensors and membranes whereas patterned wafers with cavities or through holes are used to encapsulate the pressure sensor die. Cavities can be used to encapsulate a reference pressure and through holes connect the membrane to the environment to enable pressure measurement. The encapsulation is done by using a wafer level packaging (WLP) approach. Often anodic bonding between the sensor from Silicon and cap-wafers from glass is used to create a hermetic encapsulation. Therefore Plan Optik uses cte adapted materials. After packaging the dies are separated by dicing the wafer.

    Compared to other materials glass offers long term stability as well as chemical and thermal resistance. Its transparent property allows doing in-process inspection of the MEMS die which leads to higher throughput and can help to reduce cost by increase of yield. In addition glass wafers can be marked with laser marking or QR-codes for process traceability.

    If you are interested in how glass wafers can be used in your MEMS, Sensor or Semiconductor application get in touch with our engineers by clicking the link below or mailing to sales@planoptik.com.

  • 20 November 2020

    Plan Optik AG, the leading manufacturer of customized wafers from glass, quartz or glass-silicon compound materials has launched its new Cu-Interposer technology at SEMICON Europa 2019.

    The progressive miniaturization, increasing integration density and requirements for more powerful signal routing create the need for 3D integration. Interposer technologies for rewiring have been developed for efficient communication with high transmission rates in the 3D chip stack or 3D system package. At present, organic interposers are predominantly used for these technologies. Organic interposers can be produced inexpensively, but are no match for the modern and increasing demands on 3D integration and high transfer rates. Through Glass Via Wafers (TGVs) offer a cost-effective alternative to the costly silicon interposer technology. TGV interposers are a promising technology for three-dimensional and high-density hybrid integration. For high-frequency applications and optoelectronic components, insulation layers are integrated and therefore not required compared to silicon technology of IC chips.

    But: There is no established solution to produce glass interposers at wafer level, which provides all the required properties for high-frequency applications. For this reason, Plan Optik has developed a new technology to produce interposers with an applied copper layer, which is particularly suitable for high-frequency applications.

    Next Generation Interposer

    As a first step, Plan Optik will be able to offer Interposers as drilled glass wafers with a copper layer. Those Interposer wafers will be available in sizes up to 300 mm with hole diameters down to 100 µm (depending on wafer thickness). At present, customized Redistribution Layers (RDL) can be integrated on wafer sizes up to 8”. The wafer thickness ranges from 200 µm up to 1 mm. Plan Optik’s Cu-Interposer can be produced as a wafer, as panels or as boards depending on customer needs. With a minimum hole distance equal to via diameter and a Cu-layer thickness starting from 1 µm Cu-Interposer are perfectly suitable for high-frequency applications like for example 5G broadband transmission, radar and imaging sensors, biosensors or beam steering networks.

    More products coming soon

    In the next steps Plan Optik will be able to add via fillings and pluggings to raise the device on the Interposer / Board as well as adding solder masks soon. Furthermore, Plan Optik’s latest interposer technology also paves the way for more exciting products and applications such as Glass-Circuit-Boards (GCB) with Integrated Passive Devices (IDP) like capacitors, resistors or coils as well as products with highest integration density, which will be used to realize antenna modules.

    –> https://planoptik.com/cu-interposer/

  • 29 June 2020

    As technology is rapidly moving forward the reduction of device and chip size is playing an important role to be able to implement as many chips and sensors in smallest space. For this reason thickness reduction of the semiconductor wafers is necessary. Thin semiconductor wafers (thickness around 50-100 µm) are flexible and fragile. A temporary mechanical stabilization is needed in order to enable processing of the wafer and further decrease device wafer thickness.

    For that the device wafers are temporarily bonded to the carrier. During processing the carrier wafer is used as a mechanical and handling support and can be detached after processing, whereby different de-bonding technologies are used:

    Carriers for chemical release

    Using chemical release process, a solvent gets in contact to the adhesive and releases it. For this type of de-bonding, thousands of through holes through the carrier wafer are enabling consistent contact and fast decomposition of the adhesive.

    Carrier for laser release

    After processing the adhesive interlayer will be exposed by using a laser. After exposure the interlayer will lose its adhesion and the device and carrier wafers can be separated.

    Carriers for thermal release

    By heating up the processed wafer stack the adhesive interlayer will loose its adhesion and the device wafer can be released from the carrier by a so called shear or slide-off de-bond.

    Plan Optik is offering the plain carrier (excluding the adhesives) but is closely co-operating with adhesive and equipment makers. Glass is used as carrier wafer material due to its mechanical stability and chemical resistance. All Plan Optik carrier wafers can be reused up to 30 times (depending on the details of the used process).

    In order to reduce the risk of bow or warp the cte-match between semiconductor device wafer from e.g. Si, GaAs, InP or SiC can be adjusted by using different types of glass. The transparency of glass is not only used for laser de-bonding process but furthermore for in-process inspection. Also laser markings or QR-codes can be implemented for process traceability.

    If you are interested to learn more about Carriers for temporary bonding and de-bonding and how these carriers can be applied to your thin wafer handling process make sure to contact us!


 Products

  • CARRIER WAFERS
    For the manufacture of ultra-thin substrates from silicon, gallium arsenide and other special materials. CTE-adapted materials, re-cyclable. Customer-specific solutions....

  • Plan Optik produces carrier wafers as a carrier substrate for the processing of thin semiconductor wafers. These carriers are used to permit the safe handling of delicate semiconductor wafers (e.g. those made of silicon and gallium arsenide). Semiconductor wafers are becoming ever thinner, and at the same time the requirements as regards their thickness tolerance and surface quality for back thinning, sawing and numerous other processes continue to rise. For this reason, high-precision carrier wafers (carriers) are a fundamental requirement when it comes to processing. Plan Optik manufactures these carriers using a special glass which provides the perfect substrate material in this respect, because it demonstrates excellent thermal and chemical stability. An additional advantage is the possibility of re-using such carriers - thus making an important contribution not only to the reduction of costs but also to environmental protection.

  • SUBSTRATE WAFERS
    Substrate wafers for general MEMS & Semiconductor applications. Borosilicate, Quartz, Fused Silica, Alkaline Free and Silicon-on-Glass Wafers. manufactured to custom specifications. Standard SEMI / JEIDA specifications from 2” to 300 mm....

  • Plan Optik offers customized substrate wafers from various types of glass and quartz, from single-item production to large-scale series. The diameter measures between 2” - 300 mm with low thickness tolerances and low ttv values.

    Typical areas of application for Plan Optik’s substrate wafers are in consumer electronics sector (CMOS imaging, micro mirrors), automotive sector (pressure sensors, e.g. tires, engine control), aerospace (3D acceleration sensors), chemistry (micro reaction technology), pharmaceuticals (Lab-on-chip) and in semiconductor production in general.

    Applications:

    • MEMS & Semiconductors
    • Anodic bonding with Silicon
    • MEMS & Sensor manufacturing
    • Optoelectronics
    • OLEDs and high performance LCD Displays
    • Thin film semiconductors
    • Optical switches, solar and industrial applications
    • SoG Wafers to replace common SOI-Wafers with better Insulation
    • Leading edge Semiconductor, lithography and optical applications
  • PACKAGING WAFERS
    Cap Wafers from glass, quartz, silicon and compound materials for Wafer Level Packaging up to 300 mm. Customer-specific, in various materials and combinations....

  • Plan Optik manufactures packaging wafers from custom-made single items to large-scale series using glass, quartz and silicon and combinations of these three materials. The diameter is 50 - 300 mm with low thickness tolerances and low ttv values. In each case the structuring of the wafer is carried out on a customer-specific basis, for example with optical cavities, coatings and drillings.

    Packaging wafers by Plan Optik are used to pack and thus to seal hermetically optical or chemical sensors, pressure sensors and acceleration sensors. Typical industrial applications lie in the fields of consumer electronics (CMOS imaging, micro-mirrors), automotive technology (pressure sensors, e.g. tires, engine monitoring), aerospace (3D acceleration sensors), chemistry (micro-reaction technology), pharmaceuticals (lab-on-chip) and in the general manufacture of semiconductors.

  • INTERPOSER
    Patterned interposer and TGVs from Glass, Quartz, Silicon-on-Glass or compound materials used for 3D Integration. Wafer diameter from 2” to 200 mm manufactured on customer specific designs with patterning and alignment features....

  • Plan Optik manufactures Interposer like Glass-Interposer, Si-Interposer, Through-Glass-Vias (TGV) or Wafers Interposer with Redistribution Layers.

    Using borosilicate glass with a thermal expansion coefficient adapted to that of silicon, Plan Optik wafers are used in 3D wafer level packaging of MEMS, whereby the combination of mechanical, optical and electrical functions within a wafer substrate is made possible. This results in vacuum-tight Through-Silicon-Vias (TGV) which can also be used in demanding environments, for example with high temperature fluctuations or humidity.

    Applications:

    • 2.5D / 3D Wafer-Level-Packaing
    • Chip-Stacking
    • 3D Integration of MEMS Sensors & Semiconductor Devices
    • RF components and Modules
    • CMOS Image Sensors (CIS)
    • Automotive RF & Camera Modules

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